{"id":34696,"date":"2019-10-31T21:59:52","date_gmt":"2019-10-31T18:59:52","guid":{"rendered":"https:\/\/prohoster.info\/blog\/amd-raskryla-podrobnosti-o-chipsete-x570\/"},"modified":"2019-10-31T21:59:52","modified_gmt":"2019-10-31T18:59:52","slug":"amd-raskryla-podrobnosti-o-chipsete-x570","status":"publish","type":"post","link":"https:\/\/prohoster.info\/da\/blog\/news\/amd-raskryla-podrobnosti-o-chipsete-x570","title":{"rendered":"AMD har afsl\u00f8ret detaljer om X570-chipsettet","gt_translate_keys":[{"key":"rendered","format":"text"}]},"content":{"rendered":"

Sammen med annonceringen af de station\u00e6re Ryzen 3000-processorer baseret p\u00e5 Zen 2 mikroarkitekturen, har AMD officielt afsl\u00f8ret detaljerne om X570 — det nye chipset til flagskibs Socket AM4-morboards. Den st\u00f8rste nyhed i dette chipset er underst\u00f8ttelsen af PCI Express 4.0-bussen, men der er ogs\u00e5 nogle andre interessante funktioner.<\/p>\n

\"AMD<\/p>\n

Det skal straks understreges, at de nye bundkort baseret p\u00e5 X570, som snart vil v\u00e6re tilg\u00e6ngelige i butikkerne, er designet til at arbejde med PCI Express 4.0-bussen fra starten. Det betyder, at alle slots p\u00e5 de nye bundkort vil v\u00e6re i stand til at arbejde med kompatible enheder i det nye h\u00f8jhastigheds-mode uden forbehold (n\u00e5r der installeres en Ryzen 3000-serie processor). Dette g\u00e6lder b\u00e5de slots, der forbindes til PCI Express-busens processor-controller, og de slots, der drives af chipset-controlleren.<\/p>\n

\"AMD<\/p>\n

Chipsettet X570 kan selv levere op til 16 PCI Express 4.0-linjer, men halvdelen af disse linjer kan genkonfigureres til SATA-porte. Derudover har chipsettet en uafh\u00e6ngig SATA-controller med fire porte, en USB 3.1 Gen2-controller med support for otte 10-gigabit porte og en USB 2.0-controller med support for 4 porte.<\/p>\n

\"AMD<\/p>\n

Det er dog vigtigt at forst\u00e5, at drift af mange perifere enheder med h\u00f8j hastighed i systemer baseret p\u00e5 X570 vil v\u00e6re begr\u00e6nset af b\u00e5ndbredden p\u00e5 busserne, der forbinder processoren til chipsettet. Denne bus bruger kun fire PCI Express 4.0-linjer, n\u00e5r en Ryzen 3000-processor installeres p\u00e5 bundkortet, eller fire PCI Express 3.0-linjer, n\u00e5r processorer fra tidligere generationer installeres.<\/p>\n

<\/center><\/p>\n

Det er v\u00e6rd at huske, at systemet p\u00e5 chippen Ryzen 3000 ogs\u00e5 har sine egne egenskaber: underst\u00f8ttelse af 20 PCI Express 4.0-linjer (16 linjer — til grafikkortet og 4 linjer — til NVMe-lagring) samt 4 USB 3.1 Gen2-porte. Alt dette g\u00f8r det muligt for producenterne af bundkort at skabe meget fleksible og funktionelle platforme baseret p\u00e5 X570 med et stort antal hurtige PCIe-slots, M.2, forskellige netv\u00e6rkscontrollere, hurtige porte til periferiudstyr og mere.<\/p>\n

\"AMD<\/p>\n

Den termiske effekt fra X570-chips\u00e6ttet er faktisk 15 W mod 6 W for den tidligere generations chips\u00e6t, men AMD n\u00e6vner en vis \"forenklet\" version af X570, hvor den termiske effekt vil blive reduceret til 11 W ved at reducere antallet af PCI Express 4.0-linjer. Ikke desto mindre forbliver X570 et ret varmt chip, hvilket prim\u00e6rt skyldes integrationen af en hurtig PCI Express-controller i chippen.<\/p>\n

AMD har bekr\u00e6ftet, at X570-chips\u00e6ttet er designet af dem selv, mens designet af de tidligere chips\u00e6t blev h\u00e5ndteret af en ekstern underleverand\u00f8r — ASMedia.<\/p>\n

De f\u00f8rende producenter af bundkort vil pr\u00e6sentere deres produkter baseret p\u00e5 X570 i de kommende dage. AMD lover, at deres udvalg samlet set vil best\u00e5 af mindst 56 modeller.<\/p>\n

<\/p>\n

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Kilde: 3dnews.ru<\/a><\/p>","protected":false,"gt_translate_keys":[{"key":"rendered","format":"html"}]},"excerpt":{"rendered":"

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