Although AMD has not yet introduced its processors based on the Zen 2 architecture, there is already talk online about their successors — chips based on Zen 3, which are expected to be unveiled next year. The PCGamesN resource decided to investigate what we can expect from the transition of these processors to the improved 7nm process (7nm+).
As is known, the Ryzen 3000 processors on the Zen 2 architecture, whose release is expected quite soon, are manufactured by the Taiwanese company TSMC using the 'standard' 7nm process with the application of deep ultraviolet lithography (Deep Ultra Violet, DUV). The future chips based on Zen 3 will be produced using the improved 7nm process with lithography in 'hard' ultraviolet (Extreme Ultra Violet, EUV). Interestingly, TSMC started mass production according to the 7nm EUV standards last month.
Despite both standards being 7-nanometer, they differ significantly from each other in certain aspects. In particular, the use of EUV allows for approximately a 20% increase in transistor density. Additionally, the improved 7nm process will reduce the power consumption of the chip by about 10%. All of this is expected to positively impact the consumer qualities of the products, including the future AMD processors with the Zen 3 architecture.
Recall that when discussing the goals set for the creation of Zen 3-based chips, AMD mentioned increasing energy efficiency, as well as a 'modest' performance increase, implying a slight rise in IPC compared to Zen 2. The company also clearly indicated its intention to use not the 'standard,' but the improved 7nm process for its future processors. Various processors based on Zen 3 are expected to be released sometime in 2020.
Source: 3dnews.ru
