Qualcomm has announced the release of two new chips, QCC514x and QCC304x, designed for the creation of truly wireless headphones (TWS) that can offer high-end features. Both solutions support Qualcomm's TrueWireless Mirroring technology for a more reliable connection and are equipped with specialized hardware for hybrid active noise cancellation from Qualcomm.
Qualcomm TrueWireless Mirroring technology processes the connection to the phone through one earbud, which then transmits data wirelessly to the other, reducing the amount of data synchronization needed for a stable connection.
Another important feature of the new chips is hybrid active noise cancellation (Hybrid ANC) technology. This will allow even relatively affordable headphones to offer active noise cancellation along with the ability to enable a mode for reproducing sounds from the external environment.
While the Qualcomm QCC514X offers support for a constantly active voice assistant, the QCC304X relies on activating smart assistants at the push of a button. The company states that the new chips are more energy-efficient and promise extended battery life.
As the new Qualcomm chips can endow entry-level headphones with voice assistant and active noise cancellation features, an active growth in TWS headphone offerings can be expected, which will provide high-end capabilities similar to more expensive models like the Apple AirPods Pro.
The company plans to start shipping these new chips to manufacturers starting next month. Qualcomm has indicated that it expects new products based on these SoCs to hit the market in the second quarter of 2020.
Source: 3dnews.ru
