The development of Zen 3 architecture is already complete, as can be inferred from statements made by AMD representatives at industry events. By the third quarter of next year, the company is set to closely collaborate with TSMC to commence the production of EPYC Milan server processors, which will be manufactured using EUV lithography based on the second generation of 7nm technology. It is already known that the third-level cache of processors with Zen 3 architecture will be fully unified—all eight cores of a single die will have access to 32MB of cache.
What additional improvements the Zen 3 architecture will receive remains a mystery, but some sources are already making predictions about their impact on the performance level of corresponding AMD processors. As noted by the resource , citing informed sources, the gain in specific performance per clock for a single core in processors with Zen 3 architecture is expected to exceed 8%. Recall that when announcing the Zen 2 architecture processors, AMD representatives frequently mentioned that the actual performance gains surpassed their forecasts, so a similar scenario cannot be ruled out for Zen 3.
Equally important is the information about the frequency potential increase for Zen 3 processors, which will be manufactured using a more advanced version of the 7nm technology. Early engineering samples of processors with Zen 3 architecture show an increase in peak frequencies over those of Zen 2 processors by a hundred or so megahertz. In essence, this says little about the capabilities of the future series of processors, which will only appear in about a year, but this promising start is encouraging.
Source: 3dnews.ru
