Along with the announcement of the Ryzen 3000 desktop processors based on the Zen 2 microarchitecture, AMD has officially revealed details about the X570, a new chipset for the flagship Socket AM4 motherboards. The main innovation in this chipset is support for the PCI Express 4.0 bus, but other interesting features have also been discovered.
It's worth emphasizing right away that the new motherboards based on the X570, which will appear on store shelves in the near future, are built with an eye to work with the PCI Express 4.0 bus from the very beginning. This means that all slots on the new boards will be able to work with compatible devices in the new high-speed mode without any reservations (when a XNUMXrd generation Ryzen processor is installed in the system). This applies both to the slots connected to the processor controller of the PCI Express bus, and to those slots for which the chipset controller is responsible.
By itself, the X570 logic set is capable of providing up to 16 PCI Express 4.0 lanes, but half of these lanes can be reconfigured into SATA ports. In addition, the chipset has an independent four-port SATA controller, a USB 3.1 Gen2 controller with support for eight 10-gigabit ports, and a USB 2.0 controller with support for 4 ports.
However, you need to understand that the operation of a large number of peripherals at high speed in systems based on the X570 will be limited by the bandwidth of the bus connecting the processor to the chipset. And this bus uses only four PCI Express 4.0 lanes if a Ryzen 3000 processor is installed on the board, or four PCI Express 3.0 lanes when older processors are installed.
It is worth recalling that the Ryzen 3000 system-on-a-chip has its own capabilities: support for 20 PCI Express 4.0 lanes (16 lanes for a graphics card and 4 lanes for an NVMe drive), and 4 USB 3.1 Gen2 ports. All this allows motherboard manufacturers to create very flexible and functional platforms based on the X570 with a large number of high-speed PCIe slots, M.2, a variety of network controllers, high-speed ports for peripherals, and so on.
The heat dissipation of the X570 logic set is indeed 15 W versus 6 W for the previous generation chipsets, however, AMD mentions some "simplified" version of the X570, in which the heat dissipation will be reduced to 11 W due to the rejection of a certain number of PCI Express 4.0 lanes. Nevertheless, the X570 still remains a very hot chip, which is primarily due to the integration of a high-speed PCI Express bus controller into the chip.
AMD confirmed that the X570 chipset was developed by itself, while the design of past chipsets was handled by an external contractor - ASMedia.
Leading motherboard manufacturers will showcase their X570-based products in the coming days. AMD promises that their range will consist of at least 56 models in total.
Source: 3dnews.ru