Together with the Ryzen 3000 (Matisse) processors, AMD is also preparing to release a new X570 system logic set, codenamed Valhalla, which focuses on the flagship Socket AM4 motherboards of the new generation. As you know, the main feature of this chipset will be support for the high-speed PCI Express 4.0 bus, which will be implemented in the new generation Ryzen processors. However, now more detailed information about the properties of the new chipset has become known: the PCI Express 4.0 bus in future Ryzen 3000-based systems will be supported not only by slots connected directly to the processor, but by all chipset links too.
This follows from the block diagram of one of the motherboards based on AMD X570, which was published on the Chinese forum chiphell.com. It follows from it that the processor in future systems will support a PCI Express 4.0 x16 slot for a graphics card (with the possibility of bifurcation of lines into two PCI Express 4.0 x8 slots), a slot for an NVMe M.2 drive with a connected PCI Express 3.0 x4 interface, and four USB 3.1 Gen1 ports. The processor will be connected to the AMD X570 hub via four PCI Express 4.0 lanes.
A twofold increase in the throughput of the processor-chipset line made it possible to endow the X570 chip, as well as the future processors themselves, with support for the PCI Express 4.0 bus. The new chipset, like its predecessors, will offer eight PCI Express lanes for connecting slots and additional controllers, but while past AMD chipsets only offered PCI Express 2.0 lanes, now we are talking about PCI Express 4.0 lanes with significantly increased bandwidth. In addition, the chipset supports six SATA ports, two USB 3.1 Gen2 ports, four USB 3.1 Gen1 ports, and four USB 2.0 ports.
It's worth noting that the block diagram describes the design of a particular board, so the number of USB and SATA ports on other motherboards may vary. However, you can be sure of the main thing: all slots on the expected motherboards with the X570 chipset will support the PCI Express 4.0 protocol with a bandwidth doubled compared to PCI Express 3.0.
However, the increase in bus speeds was not without some negative consequences. The TDP of the X570 logic set is 15 W, which means that on most motherboards the chipset heatsink will be equipped with a fan.
It would be appropriate to recall that the X570 system logic set differs from its predecessors in that it was developed directly by AMD engineers, while earlier chipsets for Socket AM4 processors were prepared by ASMedia.
Source: 3dnews.ru