Qualcomm's flagship Snapdragon 875 chip will get a built-in X60 5G modem

Internet sources have released information about the technical characteristics of the future flagship Qualcomm processor - the Snapdragon 875 chip, which will replace the current Snapdragon 865 product.

Qualcomm's flagship Snapdragon 875 chip will get a built-in X60 5G modem

Let us briefly recall the characteristics of the Snapdragon 865 chip. These are eight Kryo 585 cores with a clock frequency of up to 2,84 GHz and an Adreno 650 graphics accelerator. The processor is manufactured using 7-nanometer technology. In conjunction with it, the Snapdragon X55 modem can work, which provides support for fifth generation mobile networks (5G).

The future Snapdragon 875 chip (unofficial name), according to web sources, will be manufactured using 5-nanometer technology. It will be based on Kryo 685 computing cores, the number of which, apparently, will be eight pieces.

It is said that there is a high-performance Adreno 660 graphics accelerator, an Adreno 665 rendering unit and a Spectra 580 image processor. The new product will receive support for quad-channel LPDDR5 memory.


Qualcomm's flagship Snapdragon 875 chip will get a built-in X60 5G modem

The Snapdragon 875 will supposedly include the Snapdragon X60 5G modem. It will provide information transmission speeds of up to 7,5 Gbit/s towards the subscriber and up to 3 Gbit/s towards the base station.

The announcement of the first flagship smartphones on the Snapdragon 875 platform is expected early next year. 



Source: 3dnews.ru

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