Network sources report that the company HiSilicon, which manufactures chips and is wholly owned by Huawei, intends to intensify the development of mobile chipsets with an integrated 5G modem. In addition, the company plans to use millimeter wave (mmWave) technology after the new chipset for 5G-enabled smartphones is introduced at the end of 2019.
Earlier, there were reports on the Internet that in the second half of this year, Huawei will release a new HiSilicon Kirin 985 mobile processor, which will support 4G networks, and will also be equipped with a Balong 5000 modem, allowing the device to operate in fifth generation (5G) communication networks. . The Kirin 985 mobile chip, which will be manufactured by Taiwanese company TSMC, may appear in the new Huawei Mate 30 series of smartphones. Huawei flagship smartphones are likely to be introduced in the fourth quarter of 2019.
The new HiSilicon mobile chip will be tested in the second quarter of this year, and its mass production will start in the third quarter of 2019. Network sources say that new mobile chips with an integrated 5G modem will begin to be produced in late 2019 or early 2020. These processors are expected to be the basis for new smartphones with which the Chinese vendor plans to enter the 5G era.
Qualcomm and Huawei compete in a segment where each company is trying to become the first chip supplier with an integrated 5G modem. Taiwanese company MediaTek is also expected to introduce its own 5G-enabled processor in late 2019, while Apple is unlikely to be able to do so before 2020.
Source: 3dnews.ru