According to Digitimes, citing supply chain sources, at the upcoming CES 2020 (January 7-10), Intel plans to introduce a new laptop cooling design that can improve heat dissipation efficiency by 25-30%. At the same time, many laptop manufacturers intend to demonstrate finished products that already use this innovation during the exhibition.
The new heatsink design is part of Intel's Project Athena and uses vapor chambers and graphite sheets. Recall: this year, Intel began to actively promote Project Athena as a standard for modern laptops - it is designed to increase battery life, ensure the system immediately wakes up from standby, add support for 5G networks and artificial intelligence.
Traditionally, heatsinks and heatsinks are located in the space between the outside of the keyboard and the bottom bezel, since most of the key components that generate heat are located there. But Intel's new design replaces the traditional heat sink modules with a vapor chamber, and the graphite sheet behind the laptop's screen serves as a heatsink for better heat dissipation.
The heat transfer to the graphite plate will be ensured by the special design of the laptop hinges. The new design will allow manufacturers to create mobile computers without fans and help reduce their thickness even further. Let's hope we actually see these laptops at CES 2020 and they start hitting the market next year.
As reported, in addition to traditional clamshell laptops, the new heat sink module can be used in convertible laptops. In the past two years, evaporative chambers have been gaining ground in the laptop market and are mainly used in gaming models that require more efficient heat dissipation. Compared to traditional heat pipe solutions, the evaporator chambers can be freely shaped to optimize coverage of units requiring cooling.
Currently, the Intel thermal module design is only suitable for laptops that open at a maximum angle of 180Β°, but not for models with a 360Β° rotating screen, since the graphite sheet requires a special hinge design and affects the overall design. But sources from the hinge industry have said that the problem is currently being addressed and it is quite possible that it will be overcome in the near future.
Source: 3dnews.ru