Some time ago, Sony itself revealed general information regarding the technical characteristics of its future Sony PlayStation 5 console, and various rumors supplemented it. Now, TheNedrMag has published more detailed specifications for the PlayStation 5 developer kits.
The novelty is based on a monolithic crystal with dimensions of about 22,4 Γ 14,1 mm (almost 316 mm2). Apparently, this is a custom 7nm chip that combines a CPU with eight Zen 2 cores and a GPU based on the Navi architecture. Nearby on the board there are sixteen Samsung K4ZAF325BM-HC18 memory chips at once. Judging by the markings, these are 6 Gb (16 GB) GDDR2 chips with a bandwidth of 18 Gb / s per pin. That is, in total, the console has 32 GB of fast video memory.
There are also three Samsung K4AAG085WB-MCRC RAM chips soldered on the board. These are 4 GB DDR2 chips with a frequency of 2400 MHz. Two of them are located next to the NAND chips, that is, they are the DRAM cache of the solid state drive. And yes, four Toshiba BiCS3 (TLC) 3D NAND (TH58LJT2T24BAEG) flash memory chips are soldered here directly on the printed circuit board, that is, there is no way to replace the SSD. The total capacity of flash memory chips is 2 TB. The advanced Phison PS5016-E16 acts as a controller here. It supports the NVMe protocol and uses the PCI Express 4.0 interface for connection. The controller itself is eight-channel, the maximum speed with NAND is 800 MT / s, and with DDR4 DRAM - 1600 Mbps.
In general, the published characteristics are very impressive. Of course, this is just a development kit, but its specifications should be close to the final version of the console. The only disappointment is the lack of the ability to replace the SSD, but the fact that it is built on TLC memory, has a capacity of 2 TB and will use PCIe 4.0 cannot but rejoice. Yes, and 32 GB of fast GDDR6 memory will clearly be useful in modern games.
Source: 3dnews.ru