Intel talks a lot about the spatial layout of Foveros processors, it has been tested on Lakefield mobiles, and by the end of 2021 it is using it when creating discrete 7nm GPUs. At a meeting between AMD representatives and analysts, it became clear that such ideas are also not alien to this company.
At the recent FAD 2020 event, AMD CTO Mark Papermaster was able to briefly talk about the future path of the evolutionary development of layout solutions. Back in 2015, Vega GPUs used the so-called 2,5-dimensional layout, when HBM-type memory chips were placed on the same substrate as the GPU die. AMD introduced the planar multi-chip layout in 2017, two years later everyone got used to the fact that there is no typo in the word βchipletβ.
In the future, as the presentation slide explains, AMD will switch to a hybrid layout that will combine elements of 2,5D and 3D. The illustration gives a poor idea of ββthe features of this layout, but in the center you can see four crystals located in the same plane, surrounded by four HBM memory stacks of the corresponding generation. Apparently, the arrangement of a common substrate will become more complicated in this case. AMD expects that the transition to this layout will increase the density of profile interfaces by ten times. It's reasonable to assume that GPUs for server applications will be among the first to adopt this layout.
Source: 3dnews.ru