After the flagship single-chip system Dimensity 1000 by MediaTek at the Communication Communication Conference event, , announced a new chip - Dimensity 800. This processor is designed to become the heart of mid-range and high-end smartphones.
At the same time, it became known that the first smartphones based on the MediaTek Dimensity 800 will appear on the market in the second quarter of next year, and the full launch and mass deliveries of the chip itself are scheduled for the first quarter of 2020. Unfortunately, so far MediaTek has not revealed any technical details regarding the features and functions of the new single-chip system. One thing is clear: it should get a built-in 5G modem, which is a hallmark of the entire new Dimensity series.
Recall: the first representative of this series was the Dimensity 1000 5G processor, manufactured using 7-nm standards. The solution includes eight CPU cores: these are the ARM Cortex-A77 @ 2,6 GHz and ARM Cortex-A55 @ 2 GHz quartets. Responsible for graphics ARM Mali-G77 MC9; supports displays with resolutions up to 2520 × 1080 pixels. The chip also contains an advanced AI Processing Unit (APU 3.0) that delivers 4,5 trillion operations per second (TOPS) performance.
The built-in Helio M70 5G modem is capable of 4,7Gbps download and 2,5Gbps upload, and supports both standalone and non-standalone network architectures (SA/NSA). Dimensity 1000 aims to challenge the Qualcomm Snapdragon 865, HiSilicon Kirin 990 and Samsung Exynos 990.
The upcoming Oppo Reno3 smartphone is expected to be powered by the MediaTek Dimensity 1000L 5G processor, which is also known as the MediaTek MT6885, with a difference in the form of lower clock speeds. The first smartphones with the Dimensity 1000 5G chip will appear in China and other Asian markets in the first quarter of 2020, and in the US and EU in the second half of 2020.
Source: 3dnews.ru