In the assortment of any well-known company that produces motherboards, today there are a lot of models that support overclocking functions. Somewhere - for example, in the elite ASUS ROG series - there are an inexhaustible number of such functions, as well as many others, and in more affordable versions of the boards, on the contrary, the developers have added only the most basic overclocking capabilities. But there is a very small category of motherboards designed specifically for overclocking. They are not oversaturated with controllers that "weight" the circuitry, often do not support the maximum amount of RAM for a particular set of logic, and are not illuminated by a solid "carpet" of LEDs on the textolite. But they are ready to squeeze all the juice out of processors and are designed to achieve maximum frequencies and set records.
One of these boards was released by ASRock more than a year ago with the direct participation of overclocking legend Nick Shih from Taiwan. He owned and still holds several records for overclocking processors using liquid nitrogen, and among professional overclockers, he held first place for 18 months. It was his recommendations that helped the developers to release the ASRock X299 OC Formula, and it was his extreme overclocking profiles that were programmed into the BIOS of this board.
Today we will get acquainted with the features of this board and study its overclocking capabilities.
Specifications and cost
| ASRock X299 OC Formula | |
| Supported processors | Intel Core X processors in LGA2066 version (seventh generation of Core microarchitecture); support for Turbo Boost Max Technology 3.0; support ASRock Hyper BCLK Engine III technology |
| Chipset | Intel X299 Express |
| Memory subsystem | 4 × DIMM DDR4 unbuffered memory up to 64 GB; four- or two-channel memory mode (depending on the processor); support for modules with a frequency of 4600(OC)/4500(OC)/4400(OC)/4266(OC)/4133(OC)/4000(OC)/ 3866(OC)/3800(OC)/3733(OC)/3600(OC)/3200(OC)/2933(OC)/2800(OC)/2666(OC)/2400(OC)/ 2133 MHz; 15 µm gold-plated contacts in memory slots; support for Intel XMP (Extreme Memory Profile) 2.0 |
| Connectors for expansion cards | 5 PCI Express x16 3.0 slots, x16/x0/x0/x16/x8 or x8/x8/x8/x8/x8 operating modes with 44 PCI-E lanes processor; x16/x0/x0/x8/x4 or x8/x8/x0/x8/x4 processor with 28 PCI-E lanes; x16/x0/x0/x0/x4 or x8/x0/x0/x8/x4 with 16 lane PCI-E processor; 1 PCI Express 3.0 x4; 1 PCI Express 2.0 x1; 15 µm gold-plated contacts in PCI-E1 and PCI-E5 slots |
| Video subsystem scalability | NVIDIA Quad/4-way/3-way/2-way SLI Technology; AMD Quad/4-way/3-way/2-way CrossFireX Technology |
| Drive interfaces | Chipset Intel X299 Express: – 6 × SATA 3, throughput up to 6 Gb/s (supports RAID 0, RAID 1, RAID 5, RAID 10, Intel Optane Memory, Intel Rapid Storage 15, Intel Smart Response, NCQ, AHCI, and Hot Plug); – 2 × Ultra M.2 (PCI Express x4 Gen 3/SATA 3), throughput up to 32 Gbps (both ports support 2230/2242/2260/2280/22110 storage types). ASMedia ASM1061 controller: – 2 × SATA 3, throughput up to 6 Gb/s (supports NCQ, AHCI and Hot Plug) |
| Networked interface |
Two network controllers Intel Gigabit LAN I219V and I211AT (10/100/1000 Mbps); protection against lightning and electrostatic discharges (Lightning / ESD Protection); support for Wake-On-LAN, Dual LAN with Teaming technologies; energy-saving Ethernet 802.3az, PXE |
| Wireless network interface | No |
| Bluetooth | No |
| Audio subsystem | Realtek ALC7.1 1220CH HD Codec: – signal-to-noise ratio at the linear audio output is 120 dB, and at the linear input - 113 dB; – Japanese audio capacitors Nichicon Fine Gold Series; – built-in headphone amplifier TI NE5532 Premium with output to the front panel (support for headphones with impedance up to 600 ohms); - isolation of the audio zone on the board's textolite; – left and right audio channels are located in different layers of the printed circuit board; – protection against power surges; – 15-micron gold-plated audio connectors; – support for Premium Blu-ray audio; – support for Surge Protection and Purity Sound 4 technologies; – DTS Connect support |
| USB interface | Chipset Intel X299 Express: – 6 USB 3.1 Gen1 ports (4 on the rear panel, 2 connected to the connector on the board); – 6 USB 2.0 ports (2 on the rear panel, 4 are connected to two connectors on the board). ASMedia ASM3142 controller: – 2 USB 3.1 Gen2 ports (Type-A and Type-C on the rear panel); ASMedia ASM3142 controller: – 1 x USB 3.1 Gen2 (Type-C for chassis front) |
| Connectors and buttons on the rear panel | 2 USB 2.0 ports and PS/2 combo port; BIOS Flashback button Clear CMOS button; 2 USB 3.1 Gen1; 2 USB 3.1 Gen1 ports and RJ-45 LAN socket; 2 USB 3.1 Gen2 ports (Type-A + Type-C) and RJ-45 network LAN socket; optical S/PDIF output; 5 audio jacks (Rear Speaker / Central / Bass / Line in / Front Speaker / Microphone) |
| Internal connectors on the motherboard | EATX 24-pin high-density power connector; 8-pin high-density ATX 12V power connector; 4-pin high-density ATX 12V power connector; 6-pin high-density ATX 12V power connector for graphics cards; 8 SATA3; 2 M.2; 5 4-pin headers for case/CPU fans with PWM support; 2 RGB LED connectors; USB 3.1 Gen1 connector for connecting two ports; 2 USB 2.0 connectors for connecting four ports; USB 3.1 Gen2 connector for the port on the front panel of the case; TPM connector; front panel audio jack; right angle audio jack; Virtual RAID On CPU connector; Power LED and Speaker connectors; Thunderbolt connector; a group of connectors for the front panel; connector Voltage Control; indicators Dr. debug; illuminated power button; reset button; reset button (Retry); Safe Boot button Rapid OC buttons; Menu button; PCIe ON/OFF switches; Post Status Checker (PSC); Slow Mode switch; switch LN2 Mode; BIOS B Select connector |
| BIOS | 2 × 128 Mbit AMI UEFI BIOS with multilingual GUI (SD/HD/Full HD); support for PnP, DMI 3.0; WfM 2.0, SM BIOS 3.0, ACPI 6.1; support for Secure Backup UEFI technology |
| Signature features, technologies and exclusive features | OC Formula Power Kit: – 13 Phase CPU Power design + 2 Phase Memory Power design; – Digi Power (CPU and Memory); –Dr. MOS; OC Formula Connector Kit: – Hi-Density Power Connector (24-pin for Motherboard, 8+4 pin for Motherboard, 6-pin for PCIe Slot); – 15μ Gold Contact (memory sockets and PCIE x16 slots (PCIE1 and PCIE5)); OC Formula Cooling Kit: – 8 Layer PCB; – 2oz copper; – Heat Pipe Design; OC Formula Monitor Kit: – Multi Thermal Sensor ASRock Super Alloy: – aluminum radiator XXL; – Premium 60A Power Chokes; – 60A Dr.MOS; – premium memory capacitors; – Capacitors Nichicon 12K Black (100% made in Japan polymer capacitors of high quality and conductivity); – black matte printed circuit board; – High Density Glass Fabric PCB; ASRock Steel Slots; ASRock Ultra M.2 (PCIe Gen3 x4 & SATA3); ASRock Ultra USB Power; ASRock Full Spike Protection (for all USB, Audio and LAN ports); ASRock Live Update & APP Shop |
| Operating system | Microsoft Windows 10 x64 |
| Form factor, dimensions (mm) | ATX, 305×244 |
| Warranty manufacturer, years | 3 |
| Minimum retail price, rub. | 30 700 |
Packaging equipment
ASRock X299 OC Formula comes in a huge box, decorated in a strict color scheme. There are no bright eye-catching splash screens and stickers on the front side - only the name of the board, the manufacturer and the list of supported technologies.
|
|
|
On the back of the box, you can find a brief listing of the board's features and ports on the rear panel, while more detailed information is revealed under the hinged front panel of the box.
Here you can already get almost all the information about the product, as well as see most of the board through a transparent plastic window.
The sticker on the end of the box shows the serial number and batch number, the name of the board model and its dimensions, country of manufacture and weight.
Please note that the board weighs more than 1,2 kilograms, it is really very massive and heavy.
Inside the cardboard box, the board lies on a polyethylene foam pallet, to which it is pressed with plastic ties, and another insert of the same material covers it on top.
The board package includes four SATA cables with latches, a standard backplate, a rear panel cover, two screws for fixing drives in M.2 slots, as well as four connecting bridges at once for organizing various SLI configurations.
From the documentation, the board comes with two types of instructions containing sections in Russian, a memo on supported processors, an ASRock postcard, a disk with drivers and proprietary utilities.
ASRock X299 OC Formula comes with a three-year warranty. As for the cost, in Russia the board can be purchased at a price of 30,7 thousand rubles. In other words, this is one of the most expensive motherboards for LGA2066 processors.
Design Features
The design of ASRock X299 OC Formula is strict, but at the same time attractive. The color scheme of the board is chosen in such a way that all its elements, including heatsinks, harmonize with each other. Therefore, when you look at it, you get the feeling of a serious and high-quality product, and not just another "toy" board with bright trinkets on a textolite.
|
|
|
I would especially like to note the massive radiators for cooling the VRM circuits of the processor, connected by a heat pipe. The chipset heatsink, on which the name of the board model is printed, is decorated in the same style as them.
|
|
|
We add that ASRock X299 OC Formula is made in the ATX form factor and has dimensions of 305 × 244 mm.
A large area of the back panel of the board is occupied by the ribbed end of the second section of the heatsink. Obviously, due to such a simple solution, the developers sought to increase the cooling efficiency of the VRM elements. The board's specifications state that this heatsink is capable of dissipating up to 450 watts of thermal power from the VRM elements.
Despite this fact, all the necessary ports are brought to the rear panel. Among them are eight USB, including 3.1 Gen2, a PS / 2 port, BIOS Flashback and Clear CMOS buttons, two network sockets, an optical output and 5 audio outputs. The plug is not built-in here, as on some other flagship motherboards.
Of the hinged elements on the ASRock X299 OC Formula, there are only radiators, no backlit plastic casings. The radiators are fixed with screws, so they can be removed without much difficulty. Here's what the board looks like without them.
Like other flagship ASRock boards, the X299 OC Formula uses an eight-layer high-density PCB that is more resistant to voltage surges and high humidity. In addition, it doubles the thickness of the copper layers, which should have a positive effect on heat distribution.
The main advantages of the ASRock board, which we will analyze in the course of the article, are listed below.
A diagram with a table from the instruction manual will help to study in more detail the arrangement of elements on the textolite.
|
|
|
In the LGA2066 processor socket of the ASRock X299 OC Formula board, the contact pins are coated with a 15-micron gold layer. According to the developers, such a coating helps to increase the resistance of needles to corrosion and increase the number of times that you can remove and install the processor without worsening contact with it (which is especially important for overclockers). In addition, in the center of the connector there is a hole for installing a thermal sensor under the processor.
The board currently supports 17 models of Intel processors released in the LGA2066 design.
It is stated that the processor power circuit is built according to a 13-phase scheme, where Dr. MOS, long life Premium 60A Power Choke and Nichicon 12K capacitors. The total power of the processor power circuit is rated at around 750 A.
|
|
|
But upon closer examination, it turns out that 12 phases are allocated directly to the processor, and another one is used for VCCSA (the right throttle in the photo marked TR30) and VCCIO. On the reverse side of the textolite, duplicate microcircuits are soldered, the use of which is also indicated by the use of the seven-phase ISL69138 controller.
In addition, ASRock X299 OC Formula has an external clock generator - Hyper BCLK Engine III, implemented by ICS 6V41742B microprocessor.
It should help to achieve higher overclocking results in BCLK frequency and provide increased accuracy of its setting.
To provide power, the board was endowed with four connectors. These include the standard 24- and 8-pin, as well as an additional 4-pin for the processor and memory. Well, and a six-pin connector, which should be connected if four video cards are installed on the board at once.
|
|
|
All power connectors on the board use high-density contact needles.
The number of RAM slots on the ASRock X299 OC Formula board has been reduced from eight to four, and the maximum supported DDR4 memory has been reduced from 128GB to 64GB. This approach of ASRock engineers is understandable and justified, since overclockers on platforms with LGA2066 rarely use all eight slots, and it is much easier to achieve more impressive memory overclocking from four modules than from eight. The slots are located in pairs on both sides of the processor socket, all contacts inside them are covered with a 15-micron layer of gold.
The module frequency can reach 4600 MHz, and support for XMP (Extreme Memory Profile) 2.0 standard will make it as easy as possible to achieve this indicator, since DDR4 kits with such a nominal frequency can already be purchased. By the way, the company's website publishes lists of RAM kits certified for this board, among which there is a memory with a frequency of 4600 MHz (G.Skill F4-4600CL19D-16GTZKKC). We add that the power supply system of each pair of slots is dual-channel.
There are seven PCI Express slots on the ASRock X299 OC Formula at once, while five of them, made in the x16 form factor, have a metal shell that further strengthens these slots and shields their contacts from electromagnetic radiation. In addition, in the first and fifth slots, the contacts inside are also gold-plated with a layer of 15 microns thick.
When installed on a processor board with 44 PCI-E lines, it is possible to create multiprocessor graphic configurations of four video cards on AMD or NVIDIA GPUs in x8/x8/x8/x8 mode, and two video cards will work in a full-speed x16/x16 bundle. In turn, with a processor with 28 PCI-E lanes, it is possible to operate four video cards on AMD GPUs in x8/x8/x8/x4 mode or three on NVIDIA GPUs in x8/x8/x8 mode, and two video cards will always work in x16 mode. /x8. Finally, when a processor with 16 PCI-E lanes is installed in the motherboard, x16 or x8/x8 modes will be available.
A huge array of multiplexers manufactured by NXP (22 pieces) is responsible for the distribution of PCI-E lines on the board, some of which are placed on the back side of the textolite.
The ASM1184e controller manufactured by ASMedia additionally switches the PCI-Express lines.
For peripherals, the board has one open-ended PCI Express 3.0 x4 slot and one PCI Express 2.0 x1 slot.
The die of the Intel X299 Express chipset contacts the heatsink through a thermal pad and does not stand out in any way.
Is it only possible to note that on the board's textolite, 19 RGB backlight LEDs are soldered exactly along the perimeter of the chipset heatsink.
The board is equipped with eight SATA 3 ports at once, six of which are implemented by the capabilities of the Intel X299 Express chipset. They support RAID 0, 1, 5, and 10, as well as Intel Optane Memory, Intel Rapid Storage 15, Intel Smart Response, NCQ, AHCI, and Hot Plug technologies.
Two additional ports are implemented by the ASMedia ASM1061 controller. The meaning of their presence on the board aimed at overclocking is not clear to us.
The ASRock X299 OC Formula comes with two Ultra M.2 ports up to 32Gb/s, both of which support both PCI Express x4 Gen 3 and SATA 3 drives.
The length of the drives in both ports can be any (from 30 to 110 mm), but the disadvantage here is obvious - there are no heatsinks as a class, although the problem of overheating high-speed SSDs and reducing their performance is quite acute today.
Continuing the topic of drives, we note the presence of a Virtual RAID On CPU (VROC1) connector on the board.
It is designed to create hyper-speed RAID arrays from NVMe SSDs connected directly to the processor.
There are a total of 15 USB ports on the board - eight external and seven internal. Six ports are USB 3.1 Gen1: four are brought to the rear panel and two are connected to the internal connector on the board. Another six ports belong to the USB 2.0 standard: two are brought to the rear panel and four are connected to two internal connectors on the board.
All listed ports are implemented by chipset capabilities. Two additional ASMedia ASM3142 controllers made it possible to add three high-speed USB 3.1 Gen2 ports with a throughput of up to 10 Gb / s.
Two such ports can be found on the rear panel (Type-A and Type-C connectors), and another port is located on the PCB and is designed to connect a cable to it from the front panel of the system unit case. In general, the number of USB ports and their distribution on the ASRock X299 OC Formula can be called ideal.
The board was equipped with two gigabit network controllers: Intel WGI219-V and Intel WGI211-AT.
Both controllers and their connectors are Lightning/ESD Protection and support Wake-On-LAN, Dual LAN with Teaming and energy-saving Ethernet 802.3az.
Despite the obvious overclocking orientation of the ASRock X299 OC Formula, due attention is paid to the sound on it. The sound path is based on the popular 7.1-channel Realtek ALC1220 audio codec.
To increase the purity of the sound, it was supplemented with Japanese Nichicon Fine Gold Series audio capacitors and a TI NE5532 Premium headphone amplifier with front panel output (support for headphones with impedance up to 600 ohms).
In addition, the left and right audio channels are located on different layers of the PCB, and the entire audio component area is separated from the rest of the board by non-conductive strips.
Such hardware optimizations, according to the developers, made it possible to achieve a signal-to-noise ratio of 120 dB at the linear audio output, and 113 dB at the linear input. At the software level, they are complemented by Purity Sound 4, DTS Connect, Premium Blu-ray audio, Surge Protection and DTS Connect technologies.
Monitoring and fan control functions on the board are assigned to two Super I / O controllers Nuvoton NCT6683D and NCT6791D at once.
|
|
|
In addition, two additional Winbond W83795ADG controllers are soldered on the back of the board.
Each such controller can monitor up to 21 voltages, 8 fans and 6 temperature sensors. But it is strange that on the board we can find only 5 connectors for connecting and controlling fans by PWM or voltage. In our opinion, for a motherboard of this class and orientation, there should be at least seven of these connectors.
But the board is equipped with a comprehensive set of overclocking buttons and switches, as well as four diagnostic LEDs.
In addition, on the bottom edge of the textolite there is an indicator of POST codes, with which you can determine the cause of an error during boot or system failure.
ASRock X299 OC Formula contains two 128-bit BIOS chips.
Switching between the main and backup microcircuit is implemented by the good old jumper. We add that the BIOS Flashback button on the rear panel of the board can be used to update the BIOS. And for this, neither a processor, nor RAM, nor a video card is required - only the board itself with power connected, a USB drive with the FAT32 file system and a new BIOS version.
As we mentioned above, the chipset heatsink area is highlighted on the board. The color of the backlight and its mode of operation are configured both in the BIOS and in the proprietary ASRock RGB LED application.
Two RGB connectors will help expand the backlight to the entire case of the system unit, to which you can connect LED strips with a current limit of 3 A each and a length of up to two meters.
The cooling of the VRM circuit elements on the ASRock X299 OC Formula is implemented by two massive radiators connected by a heat pipe. The remote heatsink partially extends to the rear panel of the board and is additionally cooled by external air flow.
The barely warming chipset has a flat aluminum heatsink with thermal pads.
Source: 3dnews.ru