It took SK Hynix less than a year to move from completion HBM2E memory to its mass production. But the main thing is not even this amazing efficiency, but the unique high-speed characteristics of the new HBM2E chips. The HBM2E SK Hynix chips achieve up to 460 GB/s of bandwidth per chip, up 50 GB/s more than before.
A significant jump in HBM memory performance should occur when switching to or HBM3. Then the exchange rate will rise to 820 GB / s. In the meantime, the gap will be filled by SK Hynix chips, the exchange rate for each output of which is 3,6 Gb / s. Each such microcircuit is assembled from eight crystals (layers). If we take into account that each layer has a 16-Gb die, then the total capacity of the new chips is 16 GB.
Memory with such a combination of characteristics is beginning to be in demand and relevant for creating solutions in the field of machine learning and artificial intelligence. It grew out of the sphere of gaming video cards, where it got its start thanks to AMD video cards. Today, the main purpose of HBM memory is high performance computing and AI.
"SK Hynix is ββat the forefront of technological innovation that advances human civilization through achievements including the world's first HBM product development," said Jonghoon Oh, Executive Vice President and Chief Marketing Officer (CMO) at SK Hynix . βWith the full scale production of HBM2E, we will continue to strengthen our presence in the premium memory market and lead the fourth industrial revolution.β
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Source: 3dnews.ru