SK Hynix has started production of 96-layer 4D QLC NAND memory chips with a capacity of 1 Tbps. At the moment, deliveries of samples of these microcircuits to large developers of controllers for solid state drives have begun. And this means that before the mass production of these microcircuits, as well as drives based on them, there is not much time left.
First, let's recall that 4D NAND is the marketing name for a slightly modified 3D NAND memory. SK Hynix decided to use this name because in its microcircuits, the peripheral circuits that control the array of cells are not located next to the cells, but are transferred under them (Periphery Under Cell, PUC). It is interesting that other manufacturers have similar solutions, but they do not use the loud name "4D NAND", but modestly continue to call their memory "3D NAND".
According to the manufacturer, the transfer of peripherals under the cells made it possible to reduce the area of ββ\u10b\u3bchips by more than 96% compared to classic XNUMXD QLC NAND chips. This, combined with the XNUMX-layer layout, further increases storage density. Although, as you know, QLC memory already has a high density due to the storage of four bits of information in a cell.
SK Hynix has now started supplying 4TB 1D QLC NAND chips to various manufacturers for testing and subsequent development of drives based on them. But at the same time, she herself is also working on SSDs based on these memory chips. The company is working on its own controller, and is also developing a software basis for its solutions, which are planned to be delivered to the consumer market. SK Hynix plans to launch its own 4D QLC NAND based SSDs next year.
Source: 3dnews.ru