TSMC introduced a new generation of the System-On-Wafer platform (CoW-SoW), which uses 3D layout technology. The basis of CoW-SoW is the InFO_SoW platform, introduced by the company in 2020, which allows the creation of logical processors at the scale of an entire 300 mm silicon wafer. To date, only Tesla has adapted this technology. It is used in her supercomputer Dojo. Image Source: TSMC
Source: 3dnews.ru