TSMC estimates the total investment in the development of the 3nm process at 1,5 trillion Taiwan dollars, that is, about $50 billion. The company has spent approximately $20 billion so far. Trial production was originally planned for June of this year. But now it has been postponed to October.
Today, among semiconductor manufacturers, only three companies are capable of printing chips in compliance with 10-nanometer and thinner standards: Intel, TSMC and Samsung. Among them, when mastering the 3nm standards, Samsung is going to switch to the use of GAA spatial gate transistors. TSMC's 3nm process will be relatively conservative: the first generation will continue to use FinFET transistors.
TSMC originally planned to hold its technical forum in April - at the meeting plans for the 3nm process technology were to be revealed. But due to the coronavirus pandemic, the event was postponed to the end of August. In addition, as mentioned, 3nm production looks set to be delayed as well, with the initial test print being scheduled for June. However, due to the pandemic, the installation of semiconductor equipment is delayed.
As a result, the 3nm production line of the Nanke 18 plant will also be delayed by a quarter: TSMC planned to install equipment there in October. And now plans have been pushed back to early 2021.
However, for TSMC the biggest risk this year is the 5nm process. If nothing unexpected happens, production should begin at the end of the second quarter, meaning mass production of Apple's A14 processor and Huawei's Kirin 1020 processor should begin in June. But supply chains are being disrupted and demand is falling. Previously, there were rumors that the production and delivery of the Apple A14 processor would be delayed by 3 months. This will undoubtedly impact TSMC's quarterly operating results.
Source: 3dnews.ru