TSMC is thinking about building a chip testing and packaging facility in Japan

It has long been known that one of the reasons for the current shortage of advanced computing accelerators is TSMC's limited ability to test and package chips for them using CoWoS technology. All of the company's core facilities are concentrated in Taiwan, but now Reuters reports that TSMC has intentions to build a similar enterprise in Japan. Image Source: TSMC
Source: 3dnews.ru

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