Taiwanese semiconductor forge TSMC announced that it has fully completed development of the 5nm process design infrastructure under the Open Innovation Platform, including technology files and design kits. The technical process has passed many tests of the reliability of silicon chips. This enables the development of 5nm SoCs for next-generation mobile and high-performance solutions targeting the fast-growing 5G and artificial intelligence markets.
TSMC's 5nm process technology has already reached the risk production stage. Using the ARM Cortex-A72 core as an example, compared to TSMC's 7nm process, it provides a 1,8-fold improvement in die density and a 15 percent improvement in clock speed. 5nm technology takes advantage of process simplification by completely switching to extreme ultraviolet (EUV) lithography, making good progress in increasing chip yield rates. Today, the technology has reached a higher level of maturity compared to previous TSMC processes at the same stage of development.
TSMC's entire 5nm infrastructure is now available for download. Drawing on the resources of the Taiwanese manufacturer's open design ecosystem, customers have already begun intensive design development. Together with partners Electronic Design Automation, the company has also added another level of design flow certification.
Source: 3dnews.ru