Not so long ago, photos of a new hybrid processor appeared on the Web. Picasso generation, which is designed for desktop PCs. And now the same Chinese source has published new data on the upcoming desktop APUs of the Picasso generation. In particular, he found out the overclocking potential of new products, and also scalped one of them.
So, to begin with, we recall that the Ryzen 3000 APUs (with integrated graphics) do not have much in common with the upcoming Ryzen 3000 CPUs (without integrated graphics). The new APUs will offer Zen+ cores and be manufactured on a 12nm process, while future CPUs will already be made on a 7nm process and receive Zen 2 cores.
Now let's move on to the results of the experiments of the Chinese enthusiast. He managed to overclock the younger Ryzen 3 3200G processor to 4,3 GHz at a core voltage of 1,38 V. For comparison, its predecessor, the Ryzen 3 2200G, only overclocked to 4,0 GHz at the same voltage. In turn, the older Ryzen 5 3400G managed to overclock to 4,25 GHz at the same voltage of 1,38 V. Its predecessor, the Ryzen 5 2400G, only overclocked to 3,925 GHz at the same voltage. Of course, in all cases we are talking about overclocking all cores.
In terms of temperature, the Ryzen 3 3200G overclocked to 75Β°C, just like its predecessor. On the other hand, the Ryzen 5 3400G overclocked at 80Β°C, just one degree higher than the Ryzen 5 2400G. It turns out that the new overclocked APUs are able to reach a frequency of about 300 MHz higher, while operating at the same voltage and at the same temperature. Recall that Ryzen 3 APUs have 4 cores, 4 threads and 4 MB of L5 cache. In turn, Ryzen 4 APUs have 8 cores and XNUMX threads.
After experimenting with overclocking, a Chinese enthusiast decided to scalp the younger Ryzen 3 3200G. It didnβt work out very well for him - the processor crystal was badly damaged, but his experiment revealed one unexpected feature of the new product. There is solder between the die and the CPU cover, whereas the Ryzen 2000 and older APUs used thermal paste. Apparently, the presence of solder also had a positive effect on the overclocking potential of the new chips. It is worth noting that the chip sizes of the new products are exactly the same as those of their predecessors.
In general, Ryzen 3000 APUs will differ from their predecessors in much the same way as conventional Ryzen 1000 and 2000 series CPUs. The advantages of Zen+ cores over conventional Zen and the transition to a 12nm process already increase the potential of new products, and the presence of solder will help to consolidate the result.
Source: 3dnews.ru