{"id":33440,"date":"2019-10-31T21:52:34","date_gmt":"2019-10-31T18:52:34","guid":{"rendered":"https:\/\/prohoster.info\/blog\/novye-podrobnosti-o-gibridnyh-pyatiyadernyh-protsessorah-intel-lakefield\/"},"modified":"2019-10-31T21:52:34","modified_gmt":"2019-10-31T18:52:34","slug":"novye-podrobnosti-o-gibridnyh-pyatiyadernyh-protsessorah-intel-lakefield","status":"publish","type":"post","link":"https:\/\/prohoster.info\/en\/blog\/news\/novye-podrobnosti-o-gibridnyh-pyatiyadernyh-protsessorah-intel-lakefield","title":{"rendered":"New details about hybrid five-core Intel Lakefield processors","gt_translate_keys":[{"key":"rendered","format":"text"}]},"content":{"rendered":"<ul>\n<li>In the future, almost all Intel products will use the spatial architecture Foveros, with its active implementation starting within the 10nm process.<\/li>\n<li>The second generation of Foveros will be utilized by the first 7nm Intel graphics processors, which will find applications in the server segment.<\/li>\n<li>At the investor event, Intel clarified the five layers that the Lakefield processor will consist of.<\/li>\n<li>For the first time, forecasts on the performance levels of these processors have been published.<\/li>\n<\/ul>\n<p>Intel first discussed the advanced architecture of hybrid processors Lakefield back <noindex><a rel=\"nofollow\" href=\"https:\/\/3dnews.ru\/980711\">in early January<\/a><\/noindex> this year, but yesterday's investor event was used by the company to integrate the approaches used in the development of these processors into the overall concept of the corporation's growth in the coming years. At the very least, the spatial layout of Foveros was mentioned at yesterday's event in various contexts \u2014 it will be used, for example, by the first 7nm discrete graphics processor of the brand, which will find application in the server segment in 2021.<\/p>\n<p><img decoding=\"async\" alt=\"New details about hybrid five-core Intel Lakefield processors\" src=\"\/wp-content\/uploads\/2019\/05\/52667f98fa8b87d32d23bf1d5e9e0d57.png\" style=\"display:block;margin: 0 auto;\" \/><\/p>\n<p>Within the 10nm process, Intel will use the first generation of 3D Foveros architecture, while 7nm products will transition to the second generation of Foveros architecture. By 2021, in addition to this, the EMIB substrate will evolve to its third generation, which Intel has already tested on its programmable matrices and unique Kaby Lake-G mobile processors that combine Intel's compute cores with a discrete AMD Radeon RX Vega M graphics chip. Accordingly, the Foveros architecture of the Lakefield mobile processors discussed below still belongs to the first generation.<\/p>\n<p><strong>Lakefield: five layers of perfection<\/strong><\/p>\n<p>At the event <noindex><a rel=\"nofollow\" href=\"https:\/\/newsroom.intel.com\/news\/2019-intel-investor-meeting\/\">for investors<\/a><\/noindex> the head of engineering developments Venkata Renduchintala, whom Intel finds appropriate to refer to by the nickname \u201cMurthy\u201d in all official documents, spoke about the main layout tiers of the future Lakefield processors, which allowed for a broader understanding of such products compared to the presentation in January.<\/p>\n<p><center><\/center><br \/>\n<img decoding=\"async\" alt=\"New details about hybrid five-core Intel Lakefield processors\" src=\"\/wp-content\/uploads\/2019\/05\/a0aae2f3de962f1f186bfa86c6bcc5d7.png\" style=\"display:block;margin: 0 auto;\" \/><\/p>\n<p>The entire packaging of the Lakefield processor measures 12 x 12 x 1 mm, enabling the creation of very compact motherboards suitable for placement not only in ultra-thin laptops, tablets, and various types of convertible devices but also in powerful smartphones.<\/p>\n<p><img decoding=\"async\" alt=\"New details about hybrid five-core Intel Lakefield processors\" src=\"\/wp-content\/uploads\/2019\/05\/bc7052cfaf69d4be8d8451b6ffbe3c2c.png\" style=\"display:block;margin: 0 auto;\" \/><\/p>\n<p>The second layer consists of a basic component manufactured using 22nm technology. It integrates elements of the system logic chipset, 1MB of L3 cache, and a power subsystem.<\/p>\n<p><img decoding=\"async\" alt=\"New details about hybrid five-core Intel Lakefield processors\" src=\"\/wp-content\/uploads\/2019\/05\/4ae371f30d88ebf1a36fcba7d038b32c.png\" style=\"display:block;margin: 0 auto;\" \/><\/p>\n<p>The third layer was named after the entire layout concept \u2014 Foveros. This is a matrix of scalable three-dimensional interconnections that allows efficient information exchange between several tiers of silicon crystals. Compared to the 2.5D layout based on a silicon bridge, the bandwidth of Foveros is increased two to three times. This interface has low specific energy consumption but allows for products with energy consumption levels from 3 watts to 1 kW. Intel promises that the technology is at a stage of maturity where the yield of usable products is quite high.<\/p>\n<p><img decoding=\"async\" alt=\"New details about hybrid five-core Intel Lakefield processors\" src=\"\/wp-content\/uploads\/2019\/05\/37cdb67590df84136ddec8af80e5a105.png\" style=\"display:block;margin: 0 auto;\" \/><\/p>\n<p>The fourth layer houses 10nm components: four energy-efficient Atom-type cores with Tremont architecture and one large core with Sunny Cove architecture, as well as a Gen11 graphics subsystem with 64 execution units, which the Lakefield processors share with mobile 10nm counterparts from Ice Lake. This layer also contains some components that enhance the thermal conductivity of the entire multi-layer system.<\/p>\n<p><img decoding=\"async\" alt=\"New details about hybrid five-core Intel Lakefield processors\" src=\"\/wp-content\/uploads\/2019\/05\/1dcd3c48a03f1b9485672f8e8eefb25c.png\" style=\"display:block;margin: 0 auto;\" \/><\/p>\n<p>Finally, at the top of this \u201csandwich\u201d are four LPDDR4 memory chips with a total capacity of 8 GB. Their mounting height from the base does not exceed one millimeter, making the entire \u201ctier\u201d quite airy, no more than two millimeters.<\/p>\n<p><strong>Initial data on configuration and some specifications <\/strong><strong>Lakefield<\/strong><\/p>\n<p>In the footnotes to its May press release, Intel mentions the results of a comparison between a hypothetical Lakefield processor and a mobile dual-core 14nm processor from the Amber Lake generation. The comparison was based on simulation and modeling, so it cannot be claimed that Intel already has engineering samples of the Lakefield processors. In January, Intel representatives explained that the 10nm Ice Lake processors would be the first to hit the market. Today it was revealed that shipments of these processors for laptops will begin in June, and the slides in the Lakefield presentation also referred to the product list for 2019. Thus, we can expect the debut of mobile computers based on Lakefield by the end of this year, but the lack of engineering samples as of April is somewhat concerning.<\/p>\n<p><img decoding=\"async\" alt=\"New details about hybrid five-core Intel Lakefield processors\" src=\"\/wp-content\/uploads\/2019\/05\/336731122c82d793bd19dbfa3ba7e035.png\" style=\"display:block;margin: 0 auto;\" \/><\/p>\n<p>Returning to the configuration of the compared processors. In this case, Lakefield had five cores without multi-threading support, with the TDP parameter potentially taking two values: five or seven watts respectively. In conjunction with the processor, there should be LPDDR4-4267 memory with a total capacity of 8 GB, configured in dual-channel mode (2 \u00d7 4 GB). The Amber Lake processors represented the Core i7-8500Y model with two cores and Hyper-Threading with a TDP level of no more than 5 watts and frequencies of 3.6\/4.2 GHz.<\/p>\n<p>If we are to believe Intel's statements, the Lakefield processor provides, in comparison to Amber Lake, a twofold reduction in motherboard area, a twofold decrease in power consumption in active mode, a twofold increase in graphics subsystem performance, as well as a tenfold reduction in power consumption in standby mode. The comparison was conducted using GfxBENCH and SYSmark 2014 SE, so it does not claim objectivity, but it was sufficient for the presentation.<\/p>\n<p><center><\/p>\n<p><\/center><\/p>\n<p>\t\t\t\t<center><br \/>\n\t\t\t\t\t\t\t\t<\/center><br \/>Source: <a content=\"nofollow\" rel=\"nofollow\" href=\"https:\/\/3dnews.ru\/987217\">3dnews.ru<\/a><\/p>","protected":false,"gt_translate_keys":[{"key":"rendered","format":"html"}]},"excerpt":{"rendered":"<p>\u0412 \u0431\u0443\u0434\u0443\u0449\u0435\u043c \u043f\u043e\u0447\u0442\u0438 \u0432\u0441\u0435 \u043f\u0440\u043e\u0434\u0443\u043a\u0442\u044b Intel \u0431\u0443\u0434\u0443\u0442 \u0438\u0441\u043f\u043e\u043b\u044c\u0437\u043e\u0432\u0430\u0442\u044c \u043f\u0440\u043e\u0441\u0442\u0440\u0430\u043d\u0441\u0442\u0432\u0435\u043d\u043d\u0443\u044e \u043a\u043e\u043c\u043f\u043e\u043d\u043e\u0432\u043a\u0443 Foveros, \u0435\u0451 \u0430\u043a\u0442\u0438\u0432\u043d\u043e\u0435 \u0432\u043d\u0435\u0434\u0440\u0435\u043d\u0438\u0435 \u043d\u0430\u0447\u043d\u0451\u0442\u0441\u044f \u0432 \u0440\u0430\u043c\u043a\u0430\u0445 10-\u043d\u043c \u0442\u0435\u0445\u043f\u0440\u043e\u0446\u0435\u0441\u0441\u0430. \u0412\u0442\u043e\u0440\u043e\u0435 \u043f\u043e\u043a\u043e\u043b\u0435\u043d\u0438\u0435 Foveros \u0431\u0443\u0434\u0435\u0442 \u0438\u0441\u043f\u043e\u043b\u044c\u0437\u043e\u0432\u0430\u0442\u044c\u0441\u044f \u043f\u0435\u0440\u0432\u044b\u043c\u0438 7-\u043d\u043c \u0433\u0440\u0430\u0444\u0438\u0447\u0435\u0441\u043a\u0438\u043c\u0438 \u043f\u0440\u043e\u0446\u0435\u0441\u0441\u043e\u0440\u0430\u043c\u0438 Intel, \u043a\u043e\u0442\u043e\u0440\u044b\u0435 \u043d\u0430\u0439\u0434\u0443\u0442 \u043f\u0440\u0438\u043c\u0435\u043d\u0435\u043d\u0438\u0435 \u0432 \u0441\u0435\u0440\u0432\u0435\u0440\u043d\u043e\u043c \u0441\u0435\u0433\u043c\u0435\u043d\u0442\u0435. \u041d\u0430 \u043c\u0435\u0440\u043e\u043f\u0440\u0438\u044f\u0442\u0438\u0438 \u0434\u043b\u044f \u0438\u043d\u0432\u0435\u0441\u0442\u043e\u0440\u043e\u0432 Intel \u0440\u0430\u0437\u044a\u044f\u0441\u043d\u0438\u043b\u0430, \u0438\u0437 \u043a\u0430\u043a\u0438\u0445 \u043f\u044f\u0442\u0438 \u044f\u0440\u0443\u0441\u043e\u0432 \u0431\u0443\u0434\u0435\u0442 \u0441\u043e\u0441\u0442\u043e\u044f\u0442\u044c \u043f\u0440\u043e\u0446\u0435\u0441\u0441\u043e\u0440 Lakefield. \u0412\u043f\u0435\u0440\u0432\u044b\u0435 \u043e\u043f\u0443\u0431\u043b\u0438\u043a\u043e\u0432\u0430\u043d\u044b \u043f\u0440\u043e\u0433\u043d\u043e\u0437\u044b \u043f\u043e \u0443\u0440\u043e\u0432\u043d\u044e \u0431\u044b\u0441\u0442\u0440\u043e\u0434\u0435\u0439\u0441\u0442\u0432\u0438\u044f [&hellip;]<\/p>\n","protected":false,"gt_translate_keys":[{"key":"rendered","format":"html"}]},"author":1,"featured_media":25153,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[702],"tags":[],"class_list":["post-33440","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-news"],"aioseo_notices":[],"aioseo_head":"\n\t\t<!-- All in One SEO 5.0.1.1 - 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