{"id":115346,"date":"2024-04-26T03:22:58","date_gmt":"2024-04-26T01:22:58","guid":{"rendered":"https:\/\/prohoster.info\/blog\/novosti-interneta\/tsmc-predstavila-tehproczess-n4c-blagodarya-emu-4-nm-chipy-stanut-deshevle"},"modified":"2024-04-26T03:22:58","modified_gmt":"2024-04-26T01:22:58","slug":"tsmc-predstavila-tehproczess-n4c-blagodarya-emu-4-nm-chipy-stanut-deshevle","status":"publish","type":"post","link":"https:\/\/prohoster.info\/es\/blog\/news\/tsmc-predstavila-tehproczess-n4c-blagodarya-emu-4-nm-chipy-stanut-deshevle","title":{"rendered":"TSMC ha presentado el proceso N4C: gracias a \u00e9l, los chips de 4 nm ser\u00e1n m\u00e1s baratos","gt_translate_keys":[{"key":"rendered","format":"text"}]},"content":{"rendered":"<p>La empresa TSMC ha presentado un nuevo proceso tecnol\u00f3gico de clase 4-5 nm \u2014 N4C. Este proceso est\u00e1 dise\u00f1ado para reducir el costo de producci\u00f3n de los productos basados en \u00e9l en un 8,5 % en comparaci\u00f3n con el proceso N4P, manteniendo al mismo tiempo la continuidad en la infraestructura tecnol\u00f3gica y las herramientas de dise\u00f1o. Adem\u00e1s, N4C tiene como objetivo garantizar una reducci\u00f3n en el nivel de defectos durante la producci\u00f3n de chips. Fuente de la imagen: TSMC<br \/>Fuente: <a content=\"nofollow\" rel=\"nofollow\" href=\"https:\/\/3dnews.ru\/1103873\">3dnews.ru<\/a> <\/p>","protected":false,"gt_translate_keys":[{"key":"rendered","format":"html"}]},"excerpt":{"rendered":"<p>La empresa TSMC ha presentado un nuevo proceso tecnol\u00f3gico de clase 4\u20135 nm \u2014 N4C. Este proceso est\u00e1 dise\u00f1ado para reducir el costo de producci\u00f3n de los productos basados en \u00e9l en un 8,5 % en comparaci\u00f3n con el proceso N4P, manteniendo al mismo tiempo la continuidad en el equipamiento tecnol\u00f3gico y en las herramientas de dise\u00f1o. Adem\u00e1s, N4C tiene como objetivo garantizar una disminuci\u00f3n en la tasa de defectos en la fabricaci\u00f3n de chips. Fuente de las im\u00e1genes: TSMC. Fuente: 3dnews.ru<\/p>","protected":false,"gt_translate_keys":[{"key":"rendered","format":"html"}]},"author":1,"featured_media":0,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[702],"tags":[],"class_list":["post-115346","post","type-post","status-publish","format-standard","hentry","category-news"],"aioseo_notices":[],"aioseo_head":"\n\t\t<!-- All in One SEO 5.0.2 - aioseo.com -->\n\t<meta name=\"description\" content=\"\u041a\u043e\u043c\u043f\u0430\u043d\u0438\u044f TSMC \u043f\u0440\u0435\u0434\u0441\u0442\u0430\u0432\u0438\u043b\u0430 \u043d\u043e\u0432\u044b\u0439 \u0442\u0435\u0445\u043f\u0440\u043e\u0446\u0435\u0441\u0441 \u043a\u043b\u0430\u0441\u0441\u0430 4\u20135 \u043d\u043c \u2014 N4C.\" \/>\n\t<meta name=\"robots\" content=\"max-image-preview:large\" \/>\n\t<meta name=\"author\" content=\"Yuri Gagarin\"\/>\n\t<link rel=\"canonical\" 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