{"id":103469,"date":"2022-03-03T15:36:38","date_gmt":"2022-03-03T13:36:39","guid":{"rendered":"https:\/\/prohoster.info\/blog\/novosti-interneta\/intel-amd-i-arm-predstavili-ucie-otkrytyj-standart-dlya-chipletov"},"modified":"2022-03-03T15:36:38","modified_gmt":"2022-03-03T13:36:39","slug":"intel-amd-i-arm-predstavili-ucie-otkrytyj-standart-dlya-chipletov","status":"publish","type":"post","link":"https:\/\/prohoster.info\/et\/blog\/news\/intel-amd-i-arm-predstavili-ucie-otkrytyj-standart-dlya-chipletov","title":{"rendered":"Intel, AMD ja ARM esitlesid UCIe, avatud standardit kiipletid jaoks","gt_translate_keys":[{"key":"rendered","format":"text"}]},"content":{"rendered":"

UCIe (Universal Chiplet Interconnect Express) konsortsiumi loomine on kuulutatud, eesm\u00e4rgiga arendada avatud spetsifikatsioone ja luua \u00f6kos\u00fcsteemi chiplet-tehnoloogia jaoks. Chiplet'id v\u00f5imaldavad luua kombineeritud h\u00fcbriidintegraalskeeme (multichip mooduleid), mis koosnevad s\u00f5ltumatutest pooljuhtplokkidest, mis ei ole seotud \u00fche tootjaga ning suhtlevad omavahel standardse k\u00f5rge kiiruselise UCIe liidese kaudu.

\"Intel,<\/center> <\/p>\n

Spetsialiseeritud lahenduse, n\u00e4iteks masin\u00f5ppe jaoks ehitatud protsessori v\u00f5i v\u00f5rguoperatsioonide t\u00f6\u00f6tlemise kiirendi loomise puhul UCIe abil, piisab olemasolevate chiplet'ide kasutamisest, mis on varustatud erinevate tootjate protsessorituumade v\u00f5i kiirenditega. Kui t\u00fc\u00fcpilisi lahendusi pole, saab luua oma chipleti vajaliku funktsionaalsusega, rakendades enda jaoks mugavaid tehnoloogiaid ja lahendusi. <\/p>\n

P\u00e4rast seda piisab valitud kiipletide \u00fchendamisest LEGO-stiilis plokikomplekteerimise abil (ettepanek tehnoloogia meenutab PCIe kaartide kasutamist arvuti komponente kokkupanekuks, kuid ainult integreeritud ringide tasemel). Andmevahetus ja suhtlemine kiipletide vahel toimub k\u00f5rge kiirusinterf\u00e4\u00e4ri UCIe abil, ning plokkide kokkupanekuks kasutatakse paradigmata \"s\u00fcsteem pakendis\" (SoP, system-on-package) mitte \"s\u00fcsteem kristallil\" (SoC, system-on-chip). <\/p>\n

V\u00f5rreldes SoC tehnoloogiate, v\u00f5imaldab kiipletite tehnoloogia luua asendatavaid ja taaskasutatavaid pooljuhi komponente, mida saab kasutada erinevates seadmetes, mis oluliselt v\u00e4hendab kiipide arenduskulusid. Kiipletide s\u00fcsteemides saab kombineerida erinevaid arhitektuure ja tootmisprotsesse \u2014 kuna iga kiiplet t\u00f6\u00f6tab eraldi, suhtlevad nad standardsete liideste kaudu, seega v\u00f5ivad \u00fches tootes olla \u00fchendatud erinevate k\u00e4skude komplekti (ISA) arhitektuurid, nagu RISC-V, ARM ja x86. Kiipletite rakendamine lihtsustab ka testimist \u2014 iga kiiplet saab testida eraldi enne integreerimist l\u00f5plikku lahendusse.

\"Intel,<\/center> <\/p>\n

Chiplet-tehnoloogia edendamise algatusele on liitunud ettev\u00f5tted Intel, AMD, ARM, Qualcomm, Samsung, ASE (Advanced Semiconductor Engineering), Google Cloud, Meta\/Facebook, Microsoft ja Taiwan Semiconductor Manufacturing Company. Avalikkusele on esitatud UCIe 1.0 avatud spetsifikatsioon, mis standardiseerib integreeritud ringide \u00fchendamise meetodid, protokollide kihi, tarkvara mudeli ja testimise protsessi. Chiplet'ide \u00fchendamiseks on v\u00e4lja kuulutatud PCIe (PCI Express) ja CXL (Compute Express Link) toetus.
\n
Allikas: opennet.ru<\/a> <\/p>","protected":false,"gt_translate_keys":[{"key":"rendered","format":"html"}]},"excerpt":{"rendered":"

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\u0441\u043e\u0431\u043e\u0439 \u043f\u0440\u0438 \u043f\u043e\u043c\u043e\u0449\u0438 \u0441\u0442\u0430\u043d\u0434\u0430\u0440\u043d\u043e\u0433\u043e \u0432\u044b\u0441\u043e\u043a\u043e\u0441\u043a\u043e\u0440\u043e\u0441\u0442\u043d\u043e\u0433\u043e \u0438\u043d\u0442\u0435\u0440\u0444\u0435\u0439\u0441\u0430 UCIe. \u0414\u043b\u044f \u0440\u0430\u0437\u0440\u0430\u0431\u043e\u0442\u043a\u0438 \u0441\u043f\u0435\u0446\u0438\u0430\u043b\u0438\u0437\u0438\u0440\u043e\u0432\u0430\u043d\u043d\u043e\u0433\u043e \u0440\u0435\u0448\u0435\u043d\u0438\u044f, \u043d\u0430\u043f\u0440\u0438\u043c\u0435\u0440, […]<\/p>\n","protected":false,"gt_translate_keys":[{"key":"rendered","format":"html"}]},"author":1,"featured_media":103470,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[702],"tags":[],"class_list":["post-103469","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-news"],"aioseo_notices":[],"aioseo_head":"\n\t\t\n\t\n\t\n\t\n\t\n\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\n","aioseo_head_json":{"title":"\ud83e\udd47 Intel, AMD ja ARM tutvustasid UCIe, avatud standard chiplet'idele | ProHoster","description":"Teatatud on UCIe (Universal Chiplet Interconnect Express) konsortsiumi loomine, mille eesm\u00e4rk on arendada avatud spetsifikatsioone ja luua \u00f6kos\u00fcsteem chiplet tehnoloogia 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