{"id":36093,"date":"2019-10-31T22:09:35","date_gmt":"2019-10-31T19:09:35","guid":{"rendered":"https:\/\/prohoster.info\/blog\/intel-predstavila-novye-instrumenty-dlya-mnogokristalnoj-upakovki-chipov\/"},"modified":"2019-10-31T22:09:35","modified_gmt":"2019-10-31T19:09:35","slug":"intel-predstavila-novye-instrumenty-dlya-mnogokristalnoj-upakovki-chipov","status":"publish","type":"post","link":"https:\/\/prohoster.info\/et\/blog\/novosti-interneta\/intel-predstavila-novye-instrumenty-dlya-mnogokristalnoj-upakovki-chipov","title":{"rendered":"Intel esitles uusi t\u00f6\u00f6riistu mitmikristallide kiipide pakendamiseks","gt_translate_keys":[{"key":"rendered","format":"text"}]},"content":{"rendered":"

Koos kiipide tootmise l\u00e4henemisega, kus tehnoloogia protsesside suunamine ei ole enam v\u00f5imalik, t\u00f5ukab mitmikristallide paketis olevad kristallid esiplaanile. Tulevaste protsessorite j\u00f5udlust m\u00f5\u00f5detakse lahenduste keerukuse v\u00f5i, \u00f5igemini \u00f6eldes, kompleksuse j\u00e4rgi. Mida rohkem funktsioone usaldatakse v\u00e4ikesesse protsessorikiipi, seda v\u00f5imsam ja efektiivsem on kogu platvorm. Samal ajal esindab protsessor mitmesuguseid kristalle, mis on \u00fchendatud \u00fclikiire bussiga, mis ei ole kiiruselt ja tarbimise poolest halvem kui see, kui tegemist oleks \u00fche monoliitse kristalliga. Teisis\u00f5nu, protsessor muutub nii emaplaadiks kui ka laienduspordikomplektiks, sealhulgas m\u00e4luks, perifeeriaks jne.<\/p>\n

\"Intel<\/p>\n

Intel on juba demonstreerinud kahe oma tehnoloogia rakendust eriotstarbeliste kristallide ruumiliseks pakkimiseks \u00fchte korpusesse. Need tehnoloogiad on EMIB ja Foveros<\/a><\/noindex>. \u041f\u0435\u0440\u0432\u0430\u044f \u043f\u0440\u0435\u0434\u0441\u0442\u0430\u0432\u043b\u044f\u0435\u0442 \u0441\u043e\u0431\u043e\u0439 \u0432\u0441\u0442\u0440\u043e\u0435\u043d\u043d\u044b\u0435 \u0432 «\u043c\u043e\u043d\u0442\u0430\u0436\u043d\u0443\u044e» \u043f\u043e\u0434\u043b\u043e\u0436\u043a\u0443 \u043c\u043e\u0441\u0442\u044b-\u0438\u043d\u0442\u0435\u0440\u0444\u0435\u0439\u0441\u044b \u0434\u043b\u044f \u0433\u043e\u0440\u0438\u0437\u043e\u043d\u0442\u0430\u043b\u044c\u043d\u043e\u0439 \u043a\u043e\u043c\u043f\u043e\u043d\u043e\u0432\u043a\u0438 \u043a\u0440\u0438\u0441\u0442\u0430\u043b\u043b\u043e\u0432, \u0430 \u0432\u0442\u043e\u0440\u0430\u044f \u2015 \u044d\u0442\u043e \u0442\u0440\u0451\u0445\u043c\u0435\u0440\u043d\u0430\u044f \u0438\u043b\u0438 \u0441\u0442\u0435\u043a\u043e\u0432\u0430\u044f \u043a\u043e\u043c\u043f\u043e\u043d\u043e\u0432\u043a\u0430 \u043a\u0440\u0438\u0441\u0442\u0430\u043b\u043b\u043e\u0432 \u0441 \u0438\u0441\u043f\u043e\u043b\u044c\u0437\u043e\u0432\u0430\u043d\u0438\u0435\u043c, \u0432 \u0442\u043e\u043c \u0447\u0438\u0441\u043b\u0435 \u0441\u043a\u0432\u043e\u0437\u043d\u044b\u0445 \u0432\u0435\u0440\u0442\u0438\u043a\u0430\u043b\u044c\u043d\u044b\u0445 \u043a\u0430\u043d\u0430\u043b\u043e\u0432 \u043c\u0435\u0442\u0430\u043b\u043b\u0438\u0437\u0430\u0446\u0438\u0438 TSVs. \u0421 \u043f\u043e\u043c\u043e\u0449\u044c\u044e \u0442\u0435\u0445\u043d\u043e\u043b\u043e\u0433\u0438\u0438 EMIB \u043a\u043e\u043c\u043f\u0430\u043d\u0438\u044f \u0432\u044b\u043f\u0443\u0441\u043a\u0430\u0435\u0442 FPGA \u043f\u043e\u043a\u043e\u043b\u0435\u043d\u0438\u044f Stratix X \u0438 \u0433\u0438\u0431\u0440\u0438\u0434\u043d\u044b\u0435 \u043f\u0440\u043e\u0446\u0435\u0441\u0441\u043e\u0440\u044b Kaby Lake G, \u0430 \u0442\u0435\u0445\u043d\u043e\u043b\u043e\u0433\u0438\u044f Foveros \u0431\u0443\u0434\u0435\u0442 \u0440\u0435\u0430\u043b\u0438\u0437\u043e\u0432\u0430\u043d\u0430 \u0432 \u043a\u043e\u043c\u043c\u0435\u0440\u0447\u0435\u0441\u043a\u0438\u0445 \u043f\u0440\u043e\u0434\u0443\u043a\u0442\u0430\u0445 \u0432\u043e \u0432\u0442\u043e\u0440\u043e\u0439 \u043f\u043e\u043b\u043e\u0432\u0438\u043d\u0435 \u0442\u0435\u043a\u0443\u0449\u0435\u0433\u043e \u0433\u043e\u0434\u0430. \u041d\u0430\u043f\u0440\u0438\u043c\u0435\u0440, \u0441 \u0435\u0451 \u043f\u043e\u043c\u043e\u0449\u044c\u044e \u0431\u0443\u0434\u0443\u0442 \u0432\u044b\u043f\u0443\u0441\u043a\u0430\u0442\u044c\u0441\u044f \u043d\u043e\u0443\u0442\u0431\u0443\u0447\u043d\u044b\u0435 \u043f\u0440\u043e\u0446\u0435\u0441\u0441\u043e\u0440\u044b Lakefield.<\/p>\n

Ilmselt ei kavatse Intel selle peale peatuda ning j\u00e4tkab aktiivselt kristallide arendamise tehnoloogiate edendamist. Konkurendid teevad sama. Nii TSMC<\/a><\/noindex>kui ka Samsung arendavad tehnoloogiaid kristallide (chiplet'ite) ruumilise paigutuse jaoks ning plaanivad uusi v\u00f5imalusi endale suunata.<\/p>\n

\"Intel<\/p>\n

Hiljuti SEMICON West konverentsil tutvustas Intel taas n\u00e4itas<\/a><\/noindex>, et et tehnoloogiad mitme kristalliga pakendamiseks arenevad hea tempoga. \u00dcritusel esitati kolm tehnoloogiat, mille rakendamine toimub l\u00e4hitulevikus. Tuleb \u00f6elda, et k\u00f5ik kolm tehnoloogiat ei saa t\u00f6\u00f6stuse standarditeks. K\u00f5ik Intel'i arendused hoitakse endale ja neid pakutakse ainult lepingulistele tootmispartneritele.<\/p>\n

<\/center>
\n
\r\n \"Vaata\r\n
<\/div>\r\n <\/div><\/center><\/p>\n

Esimene kolmest uuest tehnoloogiast chipletite ruumilise pakendamise jaoks on Co-EMIB. See on EMIB odavate silla-liidestetehnoloogiate ja Foveros chipletide kombinatsioon. Foveros mitme kristalli virnastamise struktuure saab siduda horisontaalsete EMIB linkidega keerukatesse s\u00fcsteemidesse, ilma et see halvendaks l\u00e4bilaskev\u00f5imet v\u00f5i v\u00e4hendaks j\u00f5udlust. Intel kinnitab, et k\u00f5igi mitme tasandi liideste viivitused ja l\u00e4bilaskev\u00f5ime ei ole halvemad kui monoliitsel kristallil. Tegelikult t\u00e4nu erinevate kristallide maksimaalsele tihedusele on lahenduse ja liideste koguj\u00f5udlus ja energiat\u00f5husus isegi k\u00f5rgem kui monoliitsete lahenduste puhul.<\/p>\n

Esimene tehnoloogia Co-EMIB v\u00f5ib rakenduda Intel'i h\u00fcbriidprotsessorite tootmiseks superarvutis Aurora, mille tarnimine on oodata 2021. aasta l\u00f5puks (koost\u00f6\u00f6projekt Intel'i ja Cray vahel). Protsessori protot\u00fc\u00fcp n\u00e4idati SEMICON West'il 18 v\u00e4ikese kristalli kuhjast, mis asetati \u00fchele suurele kristallile (Foveros), paar, mis liitus horisontaalselt EMIB-\u00fchendusega.<\/p>\n

Teine kolmest uutest Intel'i kiipide ruumilise pakendamise tehnoloogiast on Omni-Directional Interconnect (ODI). See tehnoloogia on \u00fcksnes EMIB ja Foveros liideste kasutamine kristallide horisontaalse ja vertikaalse elektrilise \u00fchenduse tagamiseks. ODI eraldi punktina esitlemise p\u00f5hjuseks on see, et ettev\u00f5te rakendas chipletide toitmise kuhja kaudu vertikaalsete TSV-\u00fchenduste abil. See l\u00e4henemine v\u00f5imaldab efektiivselt toite jaotada. 70-mikroniste TSV-kanalite takistus toite jaoks on oluliselt v\u00e4hendatud, mis v\u00e4hendab vajalike toitekanalite arvu ning vabastab kristalli pindala transistooride jaoks.<\/p>\n

\r\n \"Vaata\r\n
<\/div>\r\n <\/div><\/center><\/p>\n

L\u00f5puks nimetas Intel kolmandaks tehnoloogiaks ruumilise pakendamiseraami kristall-kristalli MDIO liidese. See on Advanced Interface Bus (AIB) buss f\u00fc\u00fcsilise kihina kristallidevaheliseks signaalide edastamiseks. T\u00e4psemalt \u00f6eldes on see AIB bussi teine p\u00f5lvkond, mille Intel on arendanud DARPA tellimusel. AIB esimene p\u00f5lvkond esitati 2017. aastal, v\u00f5imalusega edastada iga kontakti kaudu andmeid kiirusel 2 Gbit\/s. MDIO buss tagab andmeedastuse kiirusel 5,4 Gbit\/s. See link saab olema konkurent TSMC LIPINCON bussile. LIPINCON\u2019i edastuskiirus on suurem \u2012 8 Gbit\/s, kuid Intel MDIO-l on k\u00f5rgem gigabaiti\/mm tihedus: 200 v\u00f5rreldes 67-ga, nii et Intel v\u00e4idab, et arendus ei j\u00e4\u00e4 konkurendist alla.<\/p>\n

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Allikas: 3dnews.ru<\/a><\/p>","protected":false,"gt_translate_keys":[{"key":"rendered","format":"html"}]},"excerpt":{"rendered":"

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Tulevaste protsessorite j\u00f5udlust m\u00f5\u00f5detakse lahenduste keerukuse v\u00f5i pigem kompleksuse j\u00e4rgi. Mida rohkem funktsioone on v\u00e4ikesele protsessorikiibile m\u00e4\u00e4ratud, seda v\u00f5imsam ja t\u00f5husam on kogu platvorm. Samuti esindab protsessor","canonical_url":"https:\/\/prohoster.info\/et\/blog\/novosti-interneta\/intel-predstavila-novye-instrumenty-dlya-mnogokristalnoj-upakovki-chipov","robots":"max-image-preview:large","keywords":"","webmasterTools":{"miscellaneous":""},"schema":null,"og:locale":"et_EE","og:site_name":"ProHoster | \u041a\u0443\u043f\u0438\u0442\u044c \u043d\u0430\u0434\u0435\u0436\u043d\u044b\u0439 \u0445\u043e\u0441\u0442\u0438\u043d\u0433 \u0434\u043b\u044f \u0441\u0430\u0439\u0442\u043e\u0432 \u0441 \u0437\u0430\u0449\u0438\u0442\u043e\u0439 \u043e\u0442 DDoS, VPS VDS \u0441\u0435\u0440\u0432\u0435\u0440\u044b","og:type":"article","og:title":"\ud83e\udd47Intel \u043f\u0440\u0435\u0434\u0441\u0442\u0430\u0432\u0438\u043b\u0430 \u043d\u043e\u0432\u044b\u0435 \u0438\u043d\u0441\u0442\u0440\u0443\u043c\u0435\u043d\u0442\u044b \u0434\u043b\u044f \u043c\u043d\u043e\u0433\u043e\u043a\u0440\u0438\u0441\u0442\u0430\u043b\u044c\u043d\u043e\u0439 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