Majiyoyin Intanet sun fitar da bayanai game da halayen fasaha na ƙirar ƙirar Qualcomm na gaba - guntu na Snapdragon 875, wanda zai maye gurbin samfurin Snapdragon 865 na yanzu.
Bari mu ɗan tuna da halayen guntu na Snapdragon 865. Waɗannan su ne nau'ikan nau'ikan nau'ikan Kryo 585 guda takwas waɗanda ke da mitar agogo har zuwa 2,84 GHz da na'ura mai saurin hoto na Adreno 650. An kera na'urar ta amfani da fasahar 7-nanometer. Tare da shi, modem na Snapdragon X55 na iya aiki, wanda ke ba da tallafi ga cibiyoyin sadarwar wayar hannu na ƙarni na biyar (5G).
Guntuwar Snapdragon 875 na gaba (sunan da ba na hukuma ba), a cewar majiyoyin yanar gizo, za a kera su ta amfani da fasahar 5-nanometer. Zai dogara ne akan nau'ikan kwamfuta na Kryo 685, wanda adadinsu, a fili, zai zama guda takwas.
An ce akwai babban aikin Adreno 660 graphics accelerator, Adreno 665 rendering unit da Spectra 580 image processor. Sabon samfurin zai sami goyan baya ga ƙwaƙwalwar tashar LPDDR5 quad-channel.
Ana tsammanin Snapdragon 875 zai haɗa da modem na Snapdragon X60 5G. Zai samar da saurin watsa bayanai har zuwa 7,5 Gbit/s zuwa ga mai biyan kuɗi kuma har zuwa 3 Gbit/s zuwa tashar tushe.
Ana sa ran sanarwar wayoyin hannu na farko a kan dandalin Snapdragon 875 a farkon shekara mai zuwa.
source: 3dnews.ru