A safiyar yau a Seoul, Koriya ta Kudu, Intel ya gudanar da taron "Memory and Storage Day 2019" wanda aka keɓe don shirye-shiryen gaba a cikin ƙwaƙwalwar ajiya da kasuwar tuƙi mai ƙarfi. A can, wakilan kamfanin sun yi magana game da samfurin Optane na gaba, ci gaba a ci gaba da ci gaban PLC NAND (Penta Level Cell) na biyar-bit da sauran fasaha masu ban sha'awa da ke shirin ingantawa a cikin shekaru masu zuwa. Intel ya kuma yi magana game da sha'awar sa na gabatar da RAM marasa ƙarfi a cikin kwamfutocin tebur a cikin dogon lokaci da kuma game da sabbin samfuran SSDs da aka saba don wannan sashin.
Babban abin da ba a zata ba na gabatarwar Intel game da ci gaba mai gudana shine labarin PLC NAND - mahimmin nau'in ƙwaƙwalwar walƙiya mai yawa. Kamfanin ya jaddada cewa a cikin shekaru biyu da suka gabata, jimillar bayanan da aka samar a duniya ya ninka sau biyu, don haka tafiyar da ke dogara da QLC NAND mai nau'i hudu ba ya zama mafita mai kyau ga wannan matsala - masana'antun suna buƙatar wasu zaɓuɓɓuka tare da mafi girma. yawan ajiya. Abin da ake fitarwa yakamata ya zama Penta-Level Cell (PLC) flash memory, kowane tantanin halitta wanda ke adana bayanai guda biyar a lokaci guda. Don haka, matsayi na nau'ikan ƙwaƙwalwar ajiyar walƙiya zai yi kama da SLC-MLC-TLC-QLC-PLC. Sabuwar PLC NAND za ta iya adana bayanai sau biyar idan aka kwatanta da SLC, amma, ba shakka, tare da ƙananan aiki da aminci, tun da mai sarrafawa zai bambanta tsakanin jihohi 32 daban-daban na cajin tantanin halitta don rubutawa da karanta biyar biyar. .
Yana da kyau a lura cewa Intel ba shi kaɗai ba ne a cikin ƙoƙarinsa na ƙirƙirar ƙwaƙwalwar filasha mai yawa. Toshiba ya kuma yi magana game da shirye-shiryen ƙirƙirar PLC NAND a yayin taron ƙwaƙwalwar ajiyar Flash da aka gudanar a watan Agusta. Koyaya, fasahar Intel ta bambanta sosai: kamfanin yana amfani da ƙwayoyin ƙwaƙwalwar ƙofa da ke iyo, yayin da ƙirar Toshiba an gina su a kewayen sel masu tushen tarko. Tare da haɓaka yawan ma'ajiyar bayanai, ƙofar da ke iyo da alama ita ce mafi kyawun mafita, tunda yana rage tasirin juna da kwararar caji a cikin sel kuma yana ba da damar karanta bayanai tare da ƴan kurakurai. A takaice dai, ƙirar Intel ya fi dacewa don haɓaka ɗimbin yawa, wanda aka tabbatar da sakamakon gwajin QLC NAND na kasuwanci da aka yi ta amfani da fasaha daban-daban. Irin waɗannan gwaje-gwajen sun nuna cewa lalacewar bayanai a cikin ƙwayoyin ƙwaƙwalwar QLC dangane da ƙofar da ke iyo yana faruwa sau biyu zuwa sau uku a hankali fiye da a cikin ƙwayoyin QLC NAND tare da tarkon caji.
Dangane da wannan bangon, bayanin da Micron ya yanke shawarar raba haɓakar ƙwaƙwalwar ajiyar filasha tare da Intel, a tsakanin sauran abubuwa, saboda sha'awar canzawa zuwa amfani da ƙwayoyin tarko, yana da ban sha'awa sosai. Intel ya ci gaba da jajircewa ga ainihin fasaha kuma yana aiwatar da shi cikin tsari a cikin duk sabbin hanyoyin warwarewa.
Baya ga PLC NAND, wanda har yanzu yana kan ci gaba, Intel yana da niyyar ƙara yawan ma'ajiyar bayanai a cikin ma'adanar filasha ta hanyar amfani da wasu fasahohi masu araha. Musamman ma, kamfanin ya tabbatar da sauyin da ke gabatowa zuwa samar da taro na 96-Layer QLC 3D NAND: za a yi amfani da shi a cikin sabon kayan masarufi. .
Wannan za a biyo baya ta hanyar sarrafa samar da 144-Layer QLC 3D NAND - zai bugi abubuwan samarwa a shekara mai zuwa. Yana da ban sha'awa cewa Intel ya musanta duk wani niyyar yin amfani da siyar da lu'ulu'u uku na monolithic, don haka yayin da ƙirar 96-Layer ta ƙunshi haɗaɗɗun madaidaitan lu'ulu'u biyu masu Layer 48, da alama fasahar 144-Layer za ta dogara ne akan 72-Layer. "kayayyakin da aka kammala rabin-kalla".
Tare da karuwar adadin yadudduka a cikin QLC 3D NAND lu'ulu'u, masu haɓaka Intel ba su yi niyyar ƙara ƙarfin lu'ulu'u da kansu ba. Dangane da fasahar 96- da 144-Layer, za a samar da lu'ulu'u iri ɗaya kamar yadda ƙarni na farko 64-Layer QLC 3D NAND. Wannan ya faru ne saboda sha'awar samar da SSDs dangane da shi tare da ingantaccen matakin aiki. SSDs na farko da za su yi amfani da ƙwaƙwalwar Layer 144 za su zama faifan sabar Arbordale+.
source: 3dnews.ru