Dangane da shingen da ke gabatowa a cikin samar da guntu, wanda shine rashin yuwuwar ci gaba da raguwar hanyoyin fasaha, fakitin guntu da yawa na lu'ulu'u yana zuwa gaba. Ayyukan na'urori masu sarrafawa na gaba za a auna su ta hanyar rikitarwa, ko mafi kyau tukuna, rikitarwa na mafita. Yawancin ayyuka ana sanya su zuwa ƙaramin guntu mai sarrafawa, mafi ƙarfi da inganci duk dandamali zai kasance. A wannan yanayin, mai sarrafawa da kansa zai zama dandamali na tarin lu'ulu'u daban-daban da aka haɗa ta hanyar bas mai sauri, wanda ba zai zama mafi muni ba (dangane da sauri da amfani) fiye da idan crystal monolithic ɗaya ne. A takaice dai, na'urar za ta zama duka motherboard da saitin katunan faɗaɗawa, gami da ƙwaƙwalwar ajiya, kayan aiki, da sauransu.
Intel ya riga ya nuna aiwatar da fasahohin mallakar mallaka guda biyu don fakitin sararin samaniya na lu'ulu'u iri-iri a cikin fakiti ɗaya. Waɗannan su ne EMIB da . Na farko shi ne gada-musamman da aka gina a cikin "hawa" substrate for a kwance tsari na lu'ulu'u, da kuma na biyu shi ne mai girma uku ko stacked tsari na lu'ulu'u ta yin amfani da, a tsakanin sauran abubuwa, ta tsaye metallization tashoshi TSVs. Yin amfani da fasahar EMIB, kamfanin yana samar da Stratix X ƙarni FPGAs da Kaby Lake G masu sarrafa kayan masarufi, kuma za a aiwatar da fasahar Foveros a cikin samfuran kasuwanci a cikin rabin na biyu na wannan shekara. Misali, za a yi amfani da shi don samar da na'urorin sarrafa kwamfyutocin Lakefield.
Tabbas, Intel ba zai tsaya a nan ba kuma zai ci gaba da haɓaka fasahohi don fakitin guntu na ci gaba. Masu fafatawa suna yin hakan. Yaya , kuma Samsung suna haɓaka fasahohi don tsarin sararin samaniya na lu'ulu'u (chiplets) kuma suna da niyyar ci gaba da jawo bargon sabbin damammaki akan kansu.
Kwanan nan, a taron SEMICON West, Intel kuma cewa fasahohin sa don marufi da yawa na guntu suna haɓaka cikin sauri mai kyau. Taron ya gabatar da fasahohi guda uku, wanda aiwatar da su zai gudana nan gaba kadan. Dole ne a ce duk fasahohin uku ba za su zama matsayin masana'antu ba. Intel yana adana duk abubuwan haɓakawa don kansa kuma zai samar da su ga abokan ciniki kawai don kera kwangila.
Farkon sabbin fasahohi guda uku don fakitin sararin samaniya na chiplets shine Co-EMIB. Wannan haɗin fasaha ce ta gadar EMIB mai rahusa tare da Foveros chiplets. Za a iya haɗa ƙira mai tarin guntu na Foveros tare da haɗin kai na EMIB a kwance zuwa tsarin hadaddun ba tare da sadaukar da kayan aiki ko aiki ba. Intel yayi iƙirarin cewa latency da kayan aiki na duk mu'amala mai yawa-Layer ba zai zama mafi muni fiye da guntu monolithic ba. A gaskiya ma, saboda matsananciyar yawa na lu'ulu'u iri-iri, aikin gabaɗaya da ingantaccen makamashi na mafita da musaya za su kasance mafi girma fiye da yanayin maganin monolithic.
A karon farko, ana iya amfani da fasahar Co-EMIB don samar da na'urori masu sarrafa kayan haɗin gwiwar Intel don babban kwamfuta na Aurora, wanda ake tsammanin zai yi jigilar kaya a ƙarshen 2021 (aikin haɗin gwiwa tsakanin Intel da Cray). An nuna na'urar sarrafa samfurin a SEMICON West a matsayin jigon ƴan ƙananan yara 18 da suka mutu akan babban mutu ɗaya (Foveros), biyu daga cikinsu an haɗa su a kwance ta hanyar haɗin EMIB.
Na biyu na sabbin fasahohin tattara bayanan sararin samaniya uku na Intel ana kiransa Omni-Directional Interconnect (ODI). Wannan fasaha ba wani abu ba ne face amfani da musaya na EMIB da Foveros don haɗin lantarki a kwance da a tsaye na lu'ulu'u. Abin da ya sanya ODI wani abu dabam shine gaskiyar cewa kamfanin ya aiwatar da samar da wutar lantarki don chiplets a cikin tari ta amfani da haɗin TSVs a tsaye. Wannan tsarin zai ba da damar rarraba abinci yadda ya kamata. A lokaci guda, juriya na tashoshi na 70-μm TSVs don samar da wutar lantarki yana raguwa sosai, wanda zai rage adadin tashoshi da ake buƙata don samar da wutar lantarki da yanki kyauta akan guntu don transistor (misali).
A ƙarshe, Intel ya kira guntu-zuwa-chip interface MDIO fasaha ta uku don marufi. Wannan shi ne Advanced Interface Bus (AIB) a cikin nau'i na Layer na zahiri don musayar siginar tsaka-tsaki. Magana mai mahimmanci, wannan shine ƙarni na biyu na bas ɗin AIB, wanda Intel ke haɓakawa don DARPA. An gabatar da ƙarni na farko na AIB a cikin 2017 tare da ikon canja wurin bayanai akan kowane lamba a saurin 2 Gbit/s. Motar MDIO za ta samar da musanya a gudun 5,4 Gbit/s. Wannan hanyar haɗin za ta zama mai fafatawa ga bas ɗin TSMC LIPINCON. Saurin canja wurin LIPINCON ya fi girma - 8 Gbit/s, amma Intel MDIO yana da girman GB/s mafi girma a kowace millimita: 200 da 67, don haka Intel na da'awar ci gaban da bai wuce na abokin hamayyarsa ba.
source: 3dnews.ru