No nā mahina he nui, ua lawe ʻo Intel i nā hiʻohiʻona o nā motherboards e pili ana i nā kaʻina hana 10nm Lakefield i nā hōʻikeʻike ʻoihana, a ua kamaʻilio pinepine e pili ana i ka holomua XNUMXD Foveros hoʻolālā a lākou i hoʻohana ai, akā ʻaʻole hiki ke hāʻawi i nā lā hoʻolaha a me nā hiʻohiʻona. Ua hiki mai - ʻelua wale nō mau hiʻohiʻona i hāʻawi ʻia ma ka ʻohana Lakefield.
ʻO ka hana ʻana o nā mea hana Lakefield e hāʻawi iā Intel i nā kumu he nui e haʻaheo ai. ʻO ka hihia, e ana i ka 12 × 12 × 1 mm, aia kekahi mau papa o nā cores computing, logic system, element mana, integrated graphics a me LPDDR4X-4267 memo me ka nui o 8 GB. Nui nā mea i ʻōlelo ʻia e pili ana i ka hoʻonohonoho ʻana o nā cores computing Lakefield: ʻehā cores waiwai me ka hale hoʻolālā Tremont e pili ana i hoʻokahi kumu huahana me ka hoʻolālā Sunny Cove. ʻO ka mea hope loa, loaʻa i nā kiʻi hoʻohui ʻia ʻo Gen 11 ke kākoʻo maoli no nā hōʻike ʻelua, e ʻae ana iā Lakefield e hoʻohana ʻia no nā polokalamu kelepona paʻa.
Ma ke ʻano standby, ʻaʻole i ʻoi aku ka nui o ka mea hana Lakefield ma mua o 2,5 mW, ʻo ia ka ʻumi o ka liʻiliʻi ma mua o nā kaʻina hana kelepona nui ʻo Amber Lake-Y. Pono e hana ʻia nā mea hana ʻo Lakefield me ka hoʻohana ʻana i ka ʻenehana 10nm o ka hanauna like me Tiger Lake a i ʻole Ice Lake-SP, ʻoiai ʻaʻole kūpono kēia manaʻo. ʻAʻole mākou e poina i kekahi o nā "papa" o ka "sandwich" silicon, ʻo ia ʻo Lakefield, i hana ʻia me ka ʻenehana 22 nm. Aia nā cores computing a me nā kiʻi i hoʻohui ʻia ma kahi chip 10-nm, kahi e hoʻoholo ai i ka primacy o kēia ʻenehana i ka wā e wehewehe ai i ka mea hana.
Ua kaupalena ʻia ka laulā o nā hiʻohiʻona Lakefield i ʻelua inoa: Core i5-L16G7 a me Core i3-L13G4. Hāʻawi nā mea ʻelua i ka hui pū ʻana o nā cores computing "4 + 1" me ka ʻole multithreading, ua lako me 4 MB o ka cache, loaʻa kahi TDP ʻaʻole i ʻoi aku ma mua o 7 W a me nā kiʻi subsystem kiʻi mai 200 a 500 MHz. Aia ka ʻokoʻa i nā alapine o nā cores computing a me ka helu o nā ʻāpana hoʻokō kiʻi. ʻO ka Core i5-L16G7 he 64 mau ʻāpana hoʻokō kiʻi, aʻo ka Core i3-L13G4 he 48 wale nō. ʻO ka mua o nā kaʻina hana e hana i nā alapine mai 1,4 a 1,8 GHz me nā cores a pau, ʻo ka lua - mai 0,8 a 1,3 GHz me nā cores āpau. Ma ke ʻano hoʻokahi-core, hiki i ka mea mua ke hiki i ke alapine o 3,0 GHz, ʻo ka ʻōpio - 2,8 GHz wale nō. ʻO ke ʻano hana hoʻomanaʻo, kona ʻano a me ka leo ua like ia no nā kaʻina hana ʻelua: 8 GB LPDDR4X-4267. Hāʻawi ka hiʻohiʻona kahiko i ke kākoʻo no ka hoʻonohonoho kauoha DL Boost.
Hiki i nā ʻōnaehana hoʻokumu ʻo Lakefield ke kākoʻo iā Gigabit Wi-Fi 6 interface uea ʻole a me ka modem LTE. Ma keʻano o nā pilina, hoʻokō ʻia ke kākoʻo no PCI Express 3.0 a me USB 3.1 no nā awa Type-C. Kākoʻo ʻia nā SSD me nā UFS a me NVMe.
Ua nalowale ka Microsoft Surface Neo mai ka papa inoa o nā polokalamu Intel Lakefield e puka mai ana i kēia makahiki, akā pono ke kūʻai aku ʻo Lenovo ThinkPad X1 Fold ma mua o ka hopena o ka makahiki, a e kū mai ka Samsung Galaxy Book S i nā mākeke koho i kēia. mahina. ʻO ka ʻoiaʻiʻo, ua ʻae kēia kūlana iā Intel e hoʻonohonoho i kahi hoʻolaha kūkala o nā kaʻina hana Lakefield i kēia manawa.
Source: 3dnews.ru