Ke hoʻomohala nei ka Open Compute Project i kahi kikowaena hui no nā chiplets

ʻAʻole hou nā chips me nā kristal he nui i loko o kahi pūʻolo. Eia kekahi, ke lanakila nei nā ʻōnaehana heterogeneous e like me AMD Roma i ka mākeke. ʻO ka make ʻana o kēlā me kēia ʻāpana i kapa ʻia he chiplet.

ʻO ka hoʻohana ʻana i nā chiplets e ʻae iā ʻoe e hoʻomaikaʻi i ke kaʻina hana ʻenehana a hōʻemi i ke kumukūʻai o ka hana ʻana o nā kaʻina hana paʻakikī; Ua ma'alahi loa ka hana o ka scaling. Loaʻa i ka ʻenehana Chiplet kona mau koina, akā ʻo ka Open Compute Project hāʻawi i kahi hoʻonā. OCP, hoʻomanaʻo mākou iā ʻoe, ʻo ia kēia ka hui, i loko o kahi e kaʻana like ai kona poʻe komo i nā hanana i ke kahua o ka lako polokalamu a me ka hoʻolālā ʻana o nā kikowaena ʻikepili hou a me nā lako no lākou. Kūkākūkā mākou iā ia ma mua o hoʻokahi manawa haʻiʻia i ko makou poe heluhelu.

Nui nā poʻe e hoʻohana i nā chiplets i kēia mau lā. ʻAʻole wale ʻo AMD i neʻe mai nā cores processor monolithic i "packaged processors", Intel Stratix 10 a i ʻole Huawei Kunpeng chips i kahi ʻano like. Me he mea lā ʻo ka modular, chiplet architecture e hiki ai ke loli nui, akā i kēia manawa ʻaʻole kēia ka hihia - hoʻohana nā mea hana āpau i kā lākou ʻōnaehana interconnect (no ka laʻana, no AMD ʻo ia ka Infinity Fabric). No laila, ua kaupalena ʻia nā koho hoʻonohonoho chip i ka arsenal o kahi mea hana. ʻO ka maikaʻi loa, hiki ke hoʻohana ʻia nā chiplets mai nā mea hoʻomohala a i ʻole nā ​​​​mea hoʻomohala.

Ke hoʻāʻo nei ʻo Intel e hoʻoponopono i kēia pilikia ma o ka hui pū ʻana me DARPA a hoʻolaha i kahi kūlana hāmama Kaʻa Kaʻa Interface (AIB). Loaʻa i kona manaʻo ponoʻī o ka pilikia Ka Papa Hana Kaulike: hoʻi i ka 2018, ua hana ka consortium i kahi subgroup Wehe i ka Domain-Specific Architecture (ODSA), komo i ka noiʻi ʻana i kēia pilikia. ʻOi aku ka laulā o OCP ma mua o Intel; ʻo ka pahuhopu honua ka hui piha ʻana o ka mākeke chiplet. Pono kēia e hoʻomaʻamaʻa e like me ka hiki i ka hana ʻana i nā ʻōnaehana kikoʻī i hiki ke hoʻohui i nā chiplets o nā ʻano like ʻole a me nā mea hana: tensor coprocessors, network and cryptographic accelerators, ʻo ia hoʻi nā ASIC no ka mining cryptocurrency.

Paʻa ka holomua o ODSA: inā i ka manawa o ka hui mua o ka hui ma 2018, ʻehiku wale nō ʻoihana hoʻomohala i hoʻokomo ʻia i loko, a laila i kēia manawa ua kokoke ka nui o ka poʻe i komo i hoʻokahi haneli. Ke holomua nei ka hana, akā he nui nā pilikia e hoʻoponopono ʻia: no ka laʻana, ʻaʻole wale ka pilikia o ka nele o kahi interconnect interface - pono e hoʻomohala a hoʻopaʻa i kahi maʻamau e hiki ai ke hoʻohui i nā chiplets me nā hana like ʻole, hoʻoholo i nā pilikia me hoʻopaʻa a hoʻāʻo i nā hāʻina multi-chiplet i mākaukau, hāʻawi i nā mea hana hoʻomohala, a hoʻomaopopo i nā pilikia e pili ana i ka waiwai naʻauao, a ʻoi aku ka nui.

I kēia manawa, aia ka mākeke no nā hoʻonā e pili ana i nā chiplets mai nā mea hana like ʻole i kona wā kamaliʻi. ʻO ka manawa wale nō e hōʻike i ke ala e lanakila ai.

Source: 3dnews.ru