Tshiab Samsung chips yog tsim los rau neeg hlau thiab hluav taws xob tsheb

Samsung Electronics tau tshaj tawm cov khoom lag luam semiconductor tshiab tsim los siv rau hauv kev tsav tsheb tus kheej thiab hluav taws xob.

Tshiab Samsung chips yog tsim los rau neeg hlau thiab hluav taws xob tsheb

Cov kev daws teeb meem tau pom tias yog ib feem ntawm Samsung Foundry Forum (SFF) 2019 kev tshwm sim hauv Munich (Lub Tebchaws Yelemees). Cov chips tshiab yog tsim los rau kev lag luam tsheb hauv Tebchaws Europe, Middle East thiab Africa.

Samsung, tshwj xeeb tshaj yog, tau pom lub platform tshiab uas muab cov ntsiab lus tseem ceeb rau kev siv cov kev daws teeb meem raws li 5G, Internet of Things (IoT) thiab kev ua haujlwm siab (HPC). Cov platforms no yuav xav tau hauv cov tsheb ntse.

Tam sim no, Samsung tsim ntau yam khoom siv semiconductor rau kev lag luam tsheb, xws li kev pabcuam tsav tsheb thiab cov khoom siv rau infotainment systems.


Tshiab Samsung chips yog tsim los rau neeg hlau thiab hluav taws xob tsheb

Samsung cov khoom siv tsheb tam sim no siv 28nm FD-SOI txheej txheem thiab 14nm thev naus laus zis. Samsung npaj yuav nthuav qhia sai sai raws li cov txheej txheem thev naus laus zis mus txog 8 nanometers.

Samsung kuj tseem ceeb tshwj xeeb rau kev ua haujlwm kev nyab xeeb thiab kev ntseeg tau ntawm cov khoom siv, uas yog qhov tseem ceeb hauv kev lag luam tsheb vim tias kev ua tsis tiav tuaj yeem ua rau muaj kev sib tsoo, raug mob lossis lwm yam tshwm sim loj. 



Tau qhov twg los: 3d xov.ru

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