Kev lees paub lub cev
Cia peb nco qab tias Lakefield processors ib txhij yuav siv Foveros spatial layout, uas yuav tso cai rau ntau qhov sib txawv ntawm cov txheej txheem hauv tsib theem, suav nrog RAM. Tag nrho cov ntau yam no yuav haum rau hauv cov ntaub ntawv ntsuas 12 Γ 12 Γ 1 hli, uas yuav tso cai rau Lakefield processors siv rau hauv cov khoom siv mobile compact. Piv txwv li, ib qho ntawm Microsoft Surface Neo qauv, uas yog lub ntsiav tshuaj foldable nrog ob qhov kev qhia, yuav siv Lakefield processors.
Kev them nyiaj yug rau PCI Express 3.0, raws li cov duab kos duab ntawm Lakefield processors, yuav tsum tau muab los ntawm cov txheej hauv qab ntawm silicon uas siv 22 nm thev naus laus zis. Cov cores suav yuav nyob rau hauv ib txheej nyias, uas yuav raug tsim siv 10 nm ++ chav kawm technology. Plaub lub cores compact nrog Tremont architecture yuav nyob ib sab ntawm ib qho tseem ceeb ua haujlwm nrog Sunny Cove microarchitecture; lub qhov rooj tom ntej yuav yog Gen11 cov duab subsystem nrog 64 qhov kev ua tiav.
Nws yog ib qho tseem ceeb uas Intel npaj yuav hloov kho Lakefield processors thaum kawg ntawm xyoo tom ntej. Los ntawm lub sijhawm ntawd, 4.0nm Tiger Lake cov txheej txheem tuaj yeem muab kev txhawb nqa rau PCI Express 10 hauv ntu cov neeg siv khoom; nws tsis tuaj yeem txiav txim siab tias Lakefield Refresh processors yuav ua raws.
Tau qhov twg los: 3d xov.ru