{"id":36093,"date":"2019-10-31T22:09:35","date_gmt":"2019-10-31T19:09:35","guid":{"rendered":"https:\/\/prohoster.info\/blog\/intel-predstavila-novye-instrumenty-dlya-mnogokristalnoj-upakovki-chipov\/"},"modified":"2019-10-31T22:09:35","modified_gmt":"2019-10-31T19:09:35","slug":"intel-predstavila-novye-instrumenty-dlya-mnogokristalnoj-upakovki-chipov","status":"publish","type":"post","link":"https:\/\/prohoster.info\/hu\/blog\/news\/intel-predstavila-novye-instrumenty-dlya-mnogokristalnoj-upakovki-chipov","title":{"rendered":"Az Intel \u00faj eszk\u00f6z\u00f6ket mutatott be a chipk\u00e9sz\u00edtm\u00e9nyek t\u00f6bbchipcsomagol\u00e1s\u00e1hoz.","gt_translate_keys":[{"key":"rendered","format":"text"}]},"content":{"rendered":"

A k\u00f6zelg\u0151 chipgy\u00e1rt\u00e1si korl\u00e1tok f\u00e9ny\u00e9ben, amelyek a technol\u00f3giai folyamatok tov\u00e1bbi cs\u00f6kkent\u00e9s\u00e9nek lehetetlens\u00e9g\u00e9t jelentik, a t\u00f6bbkrist\u00e1lyos chipek csomagol\u00e1sa ker\u00fcl a k\u00f6z\u00e9ppontba. A j\u00f6v\u0151 processzorainak teljes\u00edtm\u00e9nye a funkci\u00f3k komplexit\u00e1s\u00e1val lesz m\u00e9rhet\u0151. Min\u00e9l t\u00f6bb funkci\u00f3t integr\u00e1lnak egy kis processzorchipbe, ann\u00e1l er\u0151sebb \u00e9s hat\u00e9konyabb lesz az eg\u00e9sz platform. Maga a processzor egy sokf\u00e9le krist\u00e1lyt tartalmaz\u00f3 platformk\u00e9nt fog m\u0171k\u00f6dni, amelyet egy nagy sebess\u00e9g\u0171 busz k\u00f6t \u00f6ssze, amely sebess\u00e9gben \u00e9s fogyaszt\u00e1sban nem marad el egyetlen monolitikus krist\u00e1lyt\u00f3l sem. M\u00e1s szavakkal, a processzor egy alaplapot \u00e9s kieg\u00e9sz\u00edt\u0151 k\u00e1rty\u00e1kat k\u00e9pvisel, bele\u00e9rtve a mem\u00f3ri\u00e1t, perif\u00e9ri\u00e1kat \u00e9s egy\u00e9b eszk\u00f6z\u00f6ket.<\/p>\n

\"Az<\/p>\n

Az Intel m\u00e1r bemutatta k\u00e9t saj\u00e1t technol\u00f3gia megval\u00f3s\u00edt\u00e1s\u00e1t a k\u00fcl\u00f6nb\u00f6z\u0151 krist\u00e1lyok t\u00e9rbeli csomagol\u00e1s\u00e1ra egy h\u00e1zban. Ezek az EMIB \u00e9s Foveros<\/a><\/noindex>. Az els\u0151 a \"mont\u00e1zs\" alapba be\u00e9p\u00edtett h\u00edd-interf\u00e9szeket jelenti a chipk\u00e9szletek v\u00edzszintes elrendez\u00e9s\u00e9hez, m\u00edg a m\u00e1sodik egy h\u00e1romdimenzi\u00f3s vagy r\u00e9tegelt elrendez\u00e9st takar, amely k\u00f6zvetlen\u00fcl, t\u00f6bbek k\u00f6z\u00f6tt, f\u00fcgg\u0151leges metalliz\u00e1l\u00e1si csatorn\u00e1k (TSV-k) haszn\u00e1lat\u00e1val t\u00f6rt\u00e9nik. Az EMIB technol\u00f3gia seg\u00edts\u00e9g\u00e9vel a c\u00e9g a Stratix X gener\u00e1ci\u00f3s FPGA-kat \u00e9s a Kaby Lake G hibrid processzorokat gy\u00e1rtja, m\u00edg a Foveros technol\u00f3gia kereskedelmi term\u00e9kekben az idei \u00e9v m\u00e1sodik fel\u00e9ben fog megjelenni. P\u00e9ld\u00e1ul ennek seg\u00edts\u00e9g\u00e9vel laptop processzorok, mint a Lakefield, fognak el\u0151\u00e1ll\u00edtani.<\/p>\n

Term\u00e9szetesen az Intel nem fog meg\u00e1llni ezzel, \u00e9s tov\u00e1bbra is akt\u00edvan fejleszti a krist\u00e1lyok progressz\u00edv csomagol\u00e1s\u00e1hoz sz\u00fcks\u00e9ges technol\u00f3gi\u00e1kat. A versenyt\u00e1rsak is ugyanazt csin\u00e1lj\u00e1k. Az TSMC<\/a><\/noindex>\u00e9s a Samsung is fejleszt\u00e9seket v\u00e9gez a krist\u00e1lyok (chipletek) t\u00e9rbeli elrendez\u00e9s\u00e9hez, \u00e9s azt tervezik, hogy tov\u00e1bbra is kihaszn\u00e1lj\u00e1k az \u00faj lehet\u0151s\u00e9geket.<\/p>\n

\"Az<\/p>\n

N\u00e9h\u00e1ny nappal ezel\u0151tt a SEMICON West konferenci\u00e1n az Intel ism\u00e9t bemutatta<\/a><\/noindex>, hogy a t\u00f6bbkrist\u00e1lyos csomagol\u00e1s\u00e1hoz haszn\u00e1lhat\u00f3 technol\u00f3gi\u00e1i j\u00f3 iramban fejl\u0151dnek. Az esem\u00e9nyen h\u00e1rom technol\u00f3gi\u00e1t mutattak be, melyek megval\u00f3s\u00edt\u00e1sa a k\u00f6zelj\u00f6v\u0151ben v\u00e1rhat\u00f3. Meg kell jegyezni, hogy ezek a technol\u00f3gi\u00e1k nem fognak ipari szabv\u00e1nny\u00e1 v\u00e1lni. Az Intel minden fejleszt\u00e9st meg\u0151riz mag\u00e1nak, \u00e9s csak szerz\u0151d\u00e9ses gy\u00e1rt\u00e1sra sz\u00e1nt \u00fcgyfeleknek fogja k\u00edn\u00e1lni.<\/p>\n

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A h\u00e1rom \u00faj chiplet t\u00e9rbeli csomagol\u00e1si technol\u00f3gia k\u00f6z\u00fcl az els\u0151 a Co-EMIB. Ez az EMIB olcs\u00f3 interf\u00e9sz h\u00eddk\u00e9nt val\u00f3 kombin\u00e1l\u00e1sa a Foveros chipletekkel. A Foveros t\u00f6bbr\u00e9teg\u0171, \u00f6sszekapcsolt strukt\u00far\u00e1i az EMIB v\u00edzszintes \u00f6sszek\u00f6ttet\u00e9sekkel k\u00f6thet\u0151k \u00f6ssze bonyolult rendszerekbe an\u00e9lk\u00fcl, hogy a s\u00e1vsz\u00e9less\u00e9g romlana vagy a teljes\u00edtm\u00e9ny cs\u00f6kkenne. Az Intel \u00e1ll\u00edt\u00e1sa szerint az \u00f6sszes t\u00f6bb szint\u0171 interf\u00e9sz k\u00e9sleltet\u00e9se \u00e9s s\u00e1vsz\u00e9less\u00e9ge nem lesz rosszabb, mint egy monolitikus chip eset\u00e9ben. Val\u00f3j\u00e1ban az elt\u00e9r\u0151 chipek maxim\u00e1lis s\u0171r\u0171s\u00e9g\u0171 elhelyez\u00e9se r\u00e9v\u00e9n a megold\u00e1s \u00e9s az interf\u00e9szek \u00e1ltal\u00e1nos teljes\u00edtm\u00e9nye \u00e9s energiahat\u00e9konys\u00e1ga m\u00e9g magasabb lesz, mint egy monolitikus megold\u00e1s\u00e9.<\/p>\n

A Co-EMIB technol\u00f3gia els\u0151 alkalommal val\u00f3s\u00edthat\u00f3 meg az Intel hibrid processzorainak gy\u00e1rt\u00e1s\u00e1hoz, amely az Aurora szupersz\u00e1m\u00edt\u00f3g\u00e9p gy\u00e1rt\u00e1sa sor\u00e1n v\u00e1rhat\u00f3an 2021 v\u00e9g\u00e9n ker\u00fcl forgalomba (az Intel \u00e9s a Cray k\u00f6z\u00f6tti k\u00f6z\u00f6s projekt). A processzor protot\u00edpus\u00e1t a SEMICON West-en mutatt\u00e1k be, amely 18 apr\u00f3 chipb\u0151l \u00e1llt egy nagy chipen (Foveros), amelynek p\u00e1rj\u00e1t EMIB horizont\u00e1lis \u00f6sszek\u00f6ttet\u00e9ssel kapcsolt\u00e1k \u00f6ssze.<\/p>\n

Az Intel m\u00e1sodik \u00faj chip t\u00e9rbeli csomagol\u00e1si technol\u00f3gi\u00e1ja az Omni-Directional Interconnect (ODI) n\u00e9ven ismert. Ez a technol\u00f3gia nem m\u00e1s, mint az EMIB \u00e9s a Foveros interf\u00e9szek felhaszn\u00e1l\u00e1sa a chipek v\u00edzszintes \u00e9s f\u00fcgg\u0151leges elektromos \u00f6sszekapcsol\u00e1s\u00e1ra. Az ODI k\u00fcl\u00f6n pontk\u00e9nt val\u00f3 kiemel\u00e9s\u00e9t az indokolja, hogy a c\u00e9g f\u00fcgg\u0151leges TSV-kapcsolatokkal biztos\u00edtotta a chipletek t\u00e1pl\u00e1l\u00e1s\u00e1t a stackben. Ez a megk\u00f6zel\u00edt\u00e9s lehet\u0151v\u00e9 teszi a t\u00e1pl\u00e1l\u00e1s hat\u00e9kony eloszt\u00e1s\u00e1t. Ezenk\u00edv\u00fcl a 70 mikrom\u00e9teres TSV-csatorn\u00e1k t\u00e1pl\u00e1l\u00e1s\u00e1nak ellen\u00e1ll\u00e1sa jelent\u0151sen cs\u00f6kkent, ami cs\u00f6kkenti a sz\u00fcks\u00e9ges t\u00e1pl\u00e1l\u00f3 csatorn\u00e1k sz\u00e1m\u00e1t, \u00e9s felszabad\u00edtja a chip fel\u00fclet\u00e9t a tranzisztorok sz\u00e1m\u00e1ra (p\u00e9ld\u00e1ul).<\/p>\n

\r\n \"Vide\u00f3\r\n
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V\u00e9gre, a harmadik technol\u00f3gi\u00e1t, amelyet az Intel a t\u00e9rbeli csomagol\u00e1shoz bejelentett, a MDIO krist\u00e1ly-krist\u00e1ly interf\u00e9sz. Ez egy Advanced Interface Bus (AIB), amely a fizikai r\u00e9tegk\u00e9nt szolg\u00e1l a krist\u00e1lyok k\u00f6z\u00f6tti jelcser\u00e9re. Sz\u00f3 szerint ez az AIB busz m\u00e1sodik gener\u00e1ci\u00f3ja, amelyet az Intel a DARPA megb\u00edz\u00e1s\u00e1b\u00f3l fejleszt. Az AIB els\u0151 gener\u00e1ci\u00f3j\u00e1t 2017-ben bemutatt\u00e1k, amely lehet\u0151v\u00e9 tette, hogy minden \u00e9rintkez\u00e9sen 2 Gbit\/s-os sebess\u00e9ggel adatokat tov\u00e1bb\u00edtsanak. A MDIO busz 5,4 Gbit\/s sebess\u00e9ggel biztos\u00edtja a cser\u00e9t. Ez a link versenybe sz\u00e1ll a TSMC LIPINCON busz\u00e1val. A LIPINCON sebess\u00e9ge magasabb - 8 Gbit\/s, de az Intel MDIO s\u0171r\u0171s\u00e9g mutat\u00f3ja GByte\/s per millim\u00e9ter szempontj\u00e1b\u00f3l jobb: 200 a 67-hez k\u00e9pest, \u00edgy az Intel kijelenti, hogy a fejleszt\u00e9se nem rosszabb, mint a versenyt\u00e1rs\u00e9.<\/p>\n

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Forr\u00e1s: 3dnews.ru<\/a><\/p>","protected":false,"gt_translate_keys":[{"key":"rendered","format":"html"}]},"excerpt":{"rendered":"

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[…]<\/p>\n","protected":false,"gt_translate_keys":[{"key":"rendered","format":"html"}]},"author":1,"featured_media":26991,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[702],"tags":[],"class_list":["post-36093","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-news"],"aioseo_notices":[],"aioseo_head":"\n\t\t\n\t\n\t\n\t\n\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\n","aioseo_head_json":{"title":"\ud83e\udd47Az Intel \u00faj eszk\u00f6z\u00f6ket mutatott be a t\u00f6bbkrist\u00e1lyos chipcsomagol\u00e1shoz | ProHoster","description":"A chipgy\u00e1rt\u00e1s ter\u00e9n k\u00f6zelg\u0151 korl\u00e1tok f\u00e9ny\u00e9ben, amely a gy\u00e1rt\u00e1si folyamatok tov\u00e1bbi kicsiny\u00edt\u00e9s\u00e9nek lehetetlens\u00e9ge, a t\u00f6bbkrist\u00e1lyos csomagol\u00e1s a krist\u00e1lyok k\u00f6z\u00e9ppontj\u00e1ba ker\u00fcl.","canonical_url":"https:\/\/prohoster.info\/hu\/blog\/news\/intel-predstavila-novye-instrumenty-dlya-mnogokristalnoj-upakovki-chipov","robots":"max-image-preview:large","keywords":"","webmasterTools":{"miscellaneous":""},"schema":null,"og:locale":"hu_HU","og:site_name":"ProHoster | \u041a\u0443\u043f\u0438\u0442\u044c \u043d\u0430\u0434\u0435\u0436\u043d\u044b\u0439 \u0445\u043e\u0441\u0442\u0438\u043d\u0433 \u0434\u043b\u044f \u0441\u0430\u0439\u0442\u043e\u0432 \u0441 \u0437\u0430\u0449\u0438\u0442\u043e\u0439 \u043e\u0442 DDoS, VPS VDS \u0441\u0435\u0440\u0432\u0435\u0440\u044b","og:type":"article","og:title":"\ud83e\udd47Intel \u043f\u0440\u0435\u0434\u0441\u0442\u0430\u0432\u0438\u043b\u0430 \u043d\u043e\u0432\u044b\u0435 \u0438\u043d\u0441\u0442\u0440\u0443\u043c\u0435\u043d\u0442\u044b \u0434\u043b\u044f \u043c\u043d\u043e\u0433\u043e\u043a\u0440\u0438\u0441\u0442\u0430\u043b\u044c\u043d\u043e\u0439 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