Kulengezedwa kwa flagship Qualcomm Snapdragon 865 chip ikuyembekezeka koyambirira kwa Disembala

Qualcomm yalengeza kuti chochitika cha Snapdragon Tech Summit 2019 chidzachitika pachilumba cha Maui m'zilumba za Hawaii kuyambira Disembala 3 mpaka 5.

Kulengezedwa kwa flagship Qualcomm Snapdragon 865 chip ikuyembekezeka koyambirira kwa Disembala

Palibe mawu pazomwe zidzaperekedwe pamwambowu. Komabe, owonera akuvomereza kuti Qualcomm ikhala ndi chiwonetsero cham'badwo wotsatira wa purosesa yam'manja.

Tikukamba za chip chomwe chikuwoneka pansi pa dzina losavomerezeka la Snapdragon 865. Chogulitsacho chidzalowa m'malo mwa mapurosesa a Snapdragon 855 ndi Snapdragon 855 Plus, omwe amakhala ngati maziko a mafoni apamwamba kwambiri.

Malinga ndi zomwe zilipo, nsanja ya Snapdragon 865 ipereka chithandizo cha LPDDR5 RAM ndi UFS 3.0 flash drive. Mosakayikira, chip chiphatikiza chowonjezera chaposachedwa kwambiri chazithunzi ndi gawo lofulumizitsa ntchito zokhudzana ndi luntha lochita kupanga.


Kulengezedwa kwa flagship Qualcomm Snapdragon 865 chip ikuyembekezeka koyambirira kwa Disembala

Purosesa yatsopanoyo idzakhala "mtima" wa mafoni apamwamba kwambiri mumtundu wa 2020. Izi zitha kutengedwa ndi onse otsogola opanga zida zam'manja.

Mwachidziwikire, zida zoyamba zochokera ku Snapdragon 865 zidzawonetsedwa pachiwonetsero chamagetsi cha CES 2020, chomwe chidzachitike kuyambira Januware 7 mpaka 10 ku Las Vegas (Nevada, USA). 



Source: 3dnews.ru

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