Dipatimenti ya Zamalonda ku US idalengeza Lachisanu kukulitsa kwa Temporary General License, yomwe imalola makampani aku US kuti azichita zinthu zina ndi Huawei Technologies kwa masiku owonjezera 90, ngakhale ali pamndandanda.
Nthawi yomweyo, oyang'anira a Trump adasuntha kuti aletse kuperekedwa kwa ma semiconductors ku Huawei kuchokera kwa opanga ma chip padziko lonse lapansi, zomwe zingayambitse mikangano mu ubale wa US ndi China.
Dipatimenti ya Zamalonda ku United States lero yalengeza za kusintha kwa malamulo otumiza kunja ndikuyang'ana kwambiri pa "kugula kwa semiconductors" kwa Huawei komwe kumachokera ku mapulogalamu ena a US ndi teknoloji. Malinga ndi dipatimentiyi, izi zidzanyalanyaza zoyesayesa za Huawei zolepheretsa kuwongolera kunja kwa US.
Dipatimenti ya Zamalonda idazindikira kuti Huawei akupitilizabe kugwiritsa ntchito mapulogalamu ndi ukadaulo waku US kupanga ma semiconductors ngakhale adasankhidwa.
Pansi pa kusintha kwa malamulo otumiza kunja, makampani akunja omwe amagwiritsa ntchito zida zaku US kupanga tchipisi amayenera kupeza laisensi yaku US asanapereke mitundu ina ya tchipisi ku Huawei kapena kampani yake ya HiSilicon. Onse a Huawei ndi othandizira ake, ndi TSMC, omwe amapereka tchipisi ta HiSilicon, anali akuwukiridwa.
Tsopano, kuti Huawei apeze ma chipset ena kapena agwiritse ntchito chip chopangidwa pogwiritsa ntchito mapulogalamu ndiukadaulo kuchokera kumakampani aku America, ifunika kupeza laisensi kuchokera ku dipatimenti yazamalonda ku US.
Monga momwe dipatimentiyo idanenera, Huawei azitha kupeza ma chipset omwe akupanga popanda chilolezo mkati mwa masiku 120 kuyambira tsiku losintha.
Source: 3dnews.ru