Nkhondo yamalonda pakati pa Washington ndi Beijing imakakamiza opanga ma chipmaker aku Singapore kuti achepetse antchito

Chifukwa cha nkhondo yamalonda yomwe ikuchitika pakati pa China ndi United States, komanso zoletsa za US ku kampani ya telecommunication yaku China Huawei komanso kuchepa kwa kufunikira kwa ogula, opanga ma chip ku Singapore ayamba kuchepetsa kupanga ndikudula mazana a ntchito, lipoti la Reuters.

Nkhondo yamalonda pakati pa Washington ndi Beijing imakakamiza opanga ma chipmaker aku Singapore kuti achepetse antchito

Kugwa kwapagululi, komwe kudapangitsa pafupifupi gawo limodzi mwa magawo atatu a zomwe zidapangidwa ku Singapore chaka chatha, zikubweretsa mantha kuti chuma chake chomwe chimayendetsedwa ndi kunja chitha kutsika m'miyezi ikubwerayi.

Kupanga tinthu tating'onoting'ono timene timagwiritsa ntchito mafoni a m'manja mpaka pamagalimoto kwakhala maziko a chipambano cha dziko laling'ono la zilumbazi.

Ang Wee Seng, wamkulu wa Singapore Semiconductor Industry Association (SSIA), adauza a Reuters kuti "akukonzekera zoyipa" ndipo akuyika antchito ake kuti akhale okonzeka kuthandiza ogwira ntchito omwe achotsedwa ntchito kupeza ntchito zatsopano.



Source: 3dnews.ru

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