{"id":36093,"date":"2019-10-31T22:09:35","date_gmt":"2019-10-31T19:09:35","guid":{"rendered":"https:\/\/prohoster.info\/blog\/intel-predstavila-novye-instrumenty-dlya-mnogokristalnoj-upakovki-chipov\/"},"modified":"2019-10-31T22:09:35","modified_gmt":"2019-10-31T19:09:35","slug":"intel-predstavila-novye-instrumenty-dlya-mnogokristalnoj-upakovki-chipov","status":"publish","type":"post","link":"https:\/\/prohoster.info\/ro\/blog\/news\/intel-predstavila-novye-instrumenty-dlya-mnogokristalnoj-upakovki-chipov","title":{"rendered":"Intel a prezentat noi instrumente pentru ambalarea multi-chip a procesoarelor","gt_translate_keys":[{"key":"rendered","format":"text"}]},"content":{"rendered":"<p>\u00cen contextul apropiatei bariere \u00een produc\u021bia de cipuri, care devine imposibilitatea de a mai reduce dimensiunile proceselor tehnologice, ambalarea multicristalelor iese \u00een eviden\u021b\u0103. Performan\u021ba procesoarelor viitoare va fi m\u0103surat\u0103 prin complexitatea sau, mai bine spus, diversitatea solu\u021biilor. Cu c\u00e2t mai multe func\u021bii sunt atribuite unui cip mic de procesor, cu at\u00e2t mai puternic\u0103 \u0219i eficient\u0103 va fi \u00eentreaga platform\u0103. \u00cen acest fel, procesorul \u00eensu\u0219i va reprezenta o platform\u0103 dintr-o mul\u021bime de cristale heterogene, conectate printr-un bus de mare vitez\u0103, care nu va fi cu nimic mai prejos (din punct de vedere al vitezei \u0219i consumului) dec\u00e2t dac\u0103 ar fi fost un singur cristal monolitic. Cu alte cuvinte, procesorul va deveni at\u00e2t placa de baz\u0103, c\u00e2t \u0219i un set de pl\u0103ci de extensie, inclusiv memorie, periferice \u0219i altele.<\/p>\n<p><img decoding=\"async\" alt=\"Intel a prezentat noi instrumente pentru ambalarea multi-chip a procesoarelor\" src=\"\/wp-content\/uploads\/2019\/07\/4785956c4a16627ae41d16951e19e579.jpg\" style=\"display:block;margin: 0 auto;\" \/><\/p>\n<p>Compania Intel a demonstrat deja implementarea a dou\u0103 tehnologii proprii pentru ambalarea spa\u021bial\u0103 a cristalelor heterogene \u00eentr-un singur carcasa. Acestea sunt tehnologiile EMIB \u0219i <noindex><a rel=\"nofollow noopener noreferrer\" href=\"https:\/\/3dnews.ru\/979542\" target=\"_blank\">Foveros<\/a><\/noindex>. Prima reprezint\u0103 pun\u021bile-interfe\u021be integrate \u00een substratul &laquo;montajului&raquo; pentru aranjarea orizontal\u0103 a cristalelor, iar a doua este o configura\u021bie tridimensional\u0103 sau stivuit\u0103 a cristalelor, inclusiv utilizarea canalelor verticale de metalizare TSVs. Prin intermediul tehnologiei EMIB, compania lanseaz\u0103 FPGA-uri din genera\u021bia Stratix X \u0219i procesoare hibride Kaby Lake G, iar tehnologia Foveros va fi implementat\u0103 \u00een produsele comerciale \u00een a doua jum\u0103tate a acestui an. De exemplu, cu ajutorul acesteia, vor fi lansate procesoare pentru notebookuri Lakefield.<\/p>\n<p>F\u0103r\u0103 \u00eendoial\u0103, Intel nu se va opri aici \u0219i va continua s\u0103 dezvolte activ tehnologiile de ambalare progresiv\u0103 a cristalelor. Concuren\u021bii fac acela\u0219i lucru. At\u00e2t <noindex><a rel=\"nofollow noopener noreferrer\" href=\"https:\/\/3dnews.ru\/969311\" target=\"_blank\">TSMC<\/a><\/noindex>, c\u00e2t \u0219i Samsung dezvolt\u0103 tehnologii pentru compunerea spa\u021bial\u0103 a cristalelor (chipletelor) \u0219i inten\u021bioneaz\u0103 s\u0103 exploreze noi oportunit\u0103\u021bi.<\/p>\n<p><img decoding=\"async\" alt=\"Intel a prezentat noi instrumente pentru ambalarea multi-chip a procesoarelor\" src=\"\/wp-content\/uploads\/2019\/07\/66d9fbe6807e5fa72b1c7895a1e6ed56.jpg\" style=\"display:block;margin: 0 auto;\" \/><\/p>\n<p>Recent, la conferin\u021ba SEMICON West, compania Intel a ar\u0103tat din nou <noindex><a rel=\"nofollow noopener noreferrer\" href=\"https:\/\/newsroom.intel.com\/news\/intel-unveils-new-tools-advanced-chip-packaging-toolbox\/#gs.o1sfv2\" target=\"_blank\">a ar\u0103tat<\/a><\/noindex>, c\u0103 tehnologiile sale pentru ambalarea multi-cristal se dezvolt\u0103 \u00eentr-un ritm bun. La eveniment au fost prezentate trei tehnologii, implementarea c\u0103rora va avea loc \u00een cur\u00e2nd. Trebuie spus c\u0103 toate cele trei tehnologii nu vor deveni standarde industriale. Toate dezvolt\u0103rile Intel le p\u0103streaz\u0103 pentru sine \u0219i le va oferi doar clien\u021bilor la produc\u021bie pe baz\u0103 de contract.<\/p>\n<p><center><\/center><br \/>\n<center><div class=\"youtube-placeholder\" data-id=\"NZ8t2zdTo2c\" onclick=\"loadVideo(this)\">\r\n        <img decoding=\"async\" src=\"https:\/\/img.youtube.com\/vi\/NZ8t2zdTo2c\/hqdefault.jpg\" alt=\"Reda\u021bi video\" loading=\"lazy\" width=\"480\" height=\"360\" style=\"width:100%;height:auto;\">\r\n        <div class=\"play-button\"><\/div>\r\n    <\/div><\/center><\/p>\n<p>Prima dintre cele trei noi tehnologii pentru ambalarea spa\u021bial\u0103 a chiplet-urilor este Co-EMIB. Aceasta este o combina\u021bie a tehnologiei de poduri interfa\u021b\u0103 EMIB cu chiplet-uri Foveros. Construc\u021biile multi-cristal stack Foveros pot fi conectate prin link-uri orizontale EMIB \u00een sisteme complexe f\u0103r\u0103 a compromite l\u0103\u021bimea de band\u0103 \u0219i performan\u021ba. Intel afirm\u0103 c\u0103 \u00eent\u00e2rzierile \u0219i l\u0103\u021bimea de band\u0103 a tuturor interfe\u021belor multicamerei vor fi la fel de bune ca \u00een cazul unui cristal monolitic. De fapt, datorit\u0103 densit\u0103\u021bii maxime de plasare a cristalelor heterogene, performan\u021ba general\u0103 \u0219i eficien\u021ba energetic\u0103 a solu\u021biei \u0219i interfe\u021belor vor fi chiar mai bune dec\u00e2t \u00een cazul unei solu\u021bii monolitice.<\/p>\n<p>Pentru prima dat\u0103, tehnologia Co-EMIB poate fi realizat\u0103 pentru produc\u021bia de procesoare hibride Intel pentru supercomputerul Aurora, a\u0219teptat s\u0103 fie livrat la sf\u00e2r\u0219itul anului 2021 (proiect comun Intel \u0219i Cray). Prototipul procesorului a fost prezentat la SEMICON West sub form\u0103 de un stack de 18 cristale mici pe un singur cristal mare (Foveros), dou\u0103 dintre acestea fiind conectate orizontal prin interfa\u021ba EMIB.<\/p>\n<p>A doua dintre cele trei noi tehnologii de ambalare spa\u021bial\u0103 a chip-urilor Intel se nume\u0219te Omni-Directional Interconnect (ODI). Aceast\u0103 tehnologie este nimic altceva dec\u00e2t utilizarea interfe\u021belor EMIB \u0219i Foveros pentru conexiuni electrice orizontale \u0219i verticale ale cristalelor. Separarea ODI ca punct distinct a fost determinat\u0103 de faptul c\u0103 compania a implementat alimentarea chiplet-urilor \u00een stack cu ajutorul conexiunilor TSV verticale. Aceast\u0103 abordare va permite o distribu\u021bie eficient\u0103 a aliment\u0103rii. \u00cen acela\u0219i timp, rezisten\u021ba canalelor TSV de 70 \u03bcm pentru alimentare a fost semnificativ redus\u0103, ceea ce va diminua num\u0103rul canalelor necesare pentru furnizarea de energie \u0219i va elibera spa\u021biu pe cristal pentru tranzistoare (de exemplu).<\/p>\n<p><center><div class=\"youtube-placeholder\" data-id=\"JZt4rqzGuHs\" onclick=\"loadVideo(this)\">\r\n        <img decoding=\"async\" src=\"https:\/\/img.youtube.com\/vi\/JZt4rqzGuHs\/hqdefault.jpg\" alt=\"Reda\u021bi video\" loading=\"lazy\" width=\"480\" height=\"360\" style=\"width:100%;height:auto;\">\r\n        <div class=\"play-button\"><\/div>\r\n    <\/div><\/center><\/p>\n<p>\u00cen cele din urm\u0103, a treia tehnologie pentru ambalarea spa\u021bial\u0103 pe care Intel a numit-o este interfa\u021ba cristal-cristal MDIO. Aceasta este un bus Advanced Interface Bus (AIB) la nivel fizic pentru schimbul de semnale inter-cristale. Strict vorbind, acesta este a doua genera\u021bie a bus-ului AIB, pe care Intel \u00eel dezvolt\u0103 la cererea DARPA. Prima genera\u021bie AIB a fost prezentat\u0103 \u00een 2017, av\u00e2nd capacitatea de a transmite date prin fiecare contact cu o vitez\u0103 de 2 Gbps. Bus-ul MDIO va asigura un schimb la viteza de 5,4 Gbps. Aceast\u0103 leg\u0103tur\u0103 va deveni un competitor pentru bus-ul TSMC LIPINCON. Viteza de schimb a LIPINCON este mai mare - 8 Gbps, dar Intel MDIO are o densitate mai mare de Gbyte\/s pe milimetru: 200 comparativ cu 67, a\u0219a c\u0103 Intel declar\u0103 c\u0103 dezvoltarea sa nu este inferioar\u0103 celei a competitorului.<\/p>\n<p><center><\/p>\n<p><\/center><\/p>\n<p>\t\t\t\t<center><br \/>\n\t\t\t\t\t\t\t\t<\/center><br \/>Sursa: <a content=\"nofollow\" rel=\"nofollow\" href=\"https:\/\/3dnews.ru\/990495\">3dnews.ru<\/a><\/p>","protected":false,"gt_translate_keys":[{"key":"rendered","format":"html"}]},"excerpt":{"rendered":"<p>\u0412 \u0441\u0432\u0435\u0442\u0435 \u043f\u0440\u0438\u0431\u043b\u0438\u0436\u0430\u044e\u0449\u0435\u0433\u043e\u0441\u044f \u0431\u0430\u0440\u044c\u0435\u0440\u0430 \u0432 \u043f\u0440\u043e\u0438\u0437\u0432\u043e\u0434\u0441\u0442\u0432\u0435 \u0447\u0438\u043f\u043e\u0432, \u043a\u043e\u0442\u043e\u0440\u044b\u043c \u0441\u0442\u0430\u043d\u043e\u0432\u0438\u0442\u0441\u044f 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\u0441\u043b\u043e\u0436\u043d\u043e\u0441\u0442\u044c\u044e \u0438\u043b\u0438, \u043b\u0443\u0447\u0448\u0435 \u0441\u043a\u0430\u0437\u0430\u0442\u044c, \u043a\u043e\u043c\u043f\u043b\u0435\u043a\u0441\u043d\u043e\u0441\u0442\u044c\u044e \u0440\u0435\u0448\u0435\u043d\u0438\u0439. \u0427\u0435\u043c \u0431\u043e\u043b\u044c\u0448\u0435 \u0444\u0443\u043d\u043a\u0446\u0438\u0439 \u0431\u0443\u0434\u0435\u0442 \u0432\u043e\u0437\u043b\u043e\u0436\u0435\u043d\u043e \u043d\u0430 \u043d\u0435\u0431\u043e\u043b\u044c\u0448\u043e\u0439 \u0447\u0438\u043f \u043f\u0440\u043e\u0446\u0435\u0441\u0441\u043e\u0440\u0430, \u0442\u0435\u043c \u043c\u043e\u0449\u043d\u0435\u0435 \u0438 \u044d\u0444\u0444\u0435\u043a\u0442\u0438\u0432\u043d\u0435\u0435 \u0431\u0443\u0434\u0435\u0442 \u0432\u0441\u044f \u043f\u043b\u0430\u0442\u0444\u043e\u0440\u043c\u0430. \u041f\u0440\u0438 \u044d\u0442\u043e\u043c \u0441\u0430\u043c \u043f\u0440\u043e\u0446\u0435\u0441\u0441\u043e\u0440 \u0431\u0443\u0434\u0435\u0442 \u043f\u0440\u0435\u0434\u0441\u0442\u0430\u0432\u043b\u044f\u0442\u044c \u0441\u043e\u0431\u043e\u0439 [&hellip;]<\/p>\n","protected":false,"gt_translate_keys":[{"key":"rendered","format":"html"}]},"author":1,"featured_media":26991,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[702],"tags":[],"class_list":["post-36093","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-news"],"aioseo_notices":[],"aioseo_head":"\n\t\t<!-- All in One SEO 5.0.2.1 - aioseo.com -->\n\t<meta name=\"description\" content=\"\u0412 \u0441\u0432\u0435\u0442\u0435 \u043f\u0440\u0438\u0431\u043b\u0438\u0436\u0430\u044e\u0449\u0435\u0433\u043e\u0441\u044f \u0431\u0430\u0440\u044c\u0435\u0440\u0430 \u0432 \u043f\u0440\u043e\u0438\u0437\u0432\u043e\u0434\u0441\u0442\u0432\u0435 \u0447\u0438\u043f\u043e\u0432, \u043a\u043e\u0442\u043e\u0440\u044b\u043c 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