Qualcomm yakazivisa kuti Snapdragon Tech Summit 2019 chiitiko chichaitirwa pachitsuwa cheMaui muHawaiian archipelago kubva Zvita 3 kusvika 5.
Iko hakuna izwi rekuti ndezvipi zvigadzirwa zvichaunzwa pachiitiko ichi. Nekudaro, vanocherekedza vanobvuma kuti Qualcomm ichaita mharidzo yechizvarwa chinotevera flagship mobile processor.
Tiri kutaura nezve chip iyo ikozvino inowanikwa pasi pezita risingazivikanwi Snapdragon 865. Chigadzirwa chacho chichatsiva ikozvino Snapdragon 855 uye Snapdragon 855 Plus processors, iyo inoshanda sehwaro hwepamusoro-soro smartphones.
Zvinoenderana neruzivo rwuripo, iyo Snapdragon 865 chikuva ichapa rutsigiro rweLPDDR5 RAM uye UFS 3.0 flash drive. Pasina kupokana, iyo chip ichasanganisira yazvino magiraidhi accelerator uye yuniti yekumhanyisa mashandiro ane chekuita nehungwaru hwekugadzira.
Iyo processor nyowani ichave "moyo" wepamusoro-yekupedzisira mafoni mumhando ye2020 modhi. Ichi chigadzirwa chinozogamuchirwa nevose vanotungamira vanogadzira emafoni emidziyo.
Zvingangodaro, michina yekutanga yakavakirwa paSnapdragon 865 icharatidzwa paCES 2020 yemagetsi kuratidzwa, iyo ichaitwa kubva Ndira 7 kusvika 10 muLas Vegas (Nevada, USA).
Source: 3dnews.ru