Yechipiri vhezheni yeXtacking tekinoroji yakagadzirirwa Chinese 3D NAND

sei Chirevo MaChina enhau masangano, Yangtze Memory Technologies (YMTC) yakagadzirira iyo yechipiri vhezheni yayo yekubata Xtacking tekinoroji kukwirisa kugadzirwa kweakawanda-layer 3D NAND flash memory. Xtacking tekinoroji, tinorangarira, yakapihwa pagore reFlash Memory Summit foramu muna Nyamavhuvhu gore rapfuura uye yakatowana mubairo muchikamu "Iyo yakanyanya hunyanzvi yekutanga mumunda weflash memory."

Ehe, kudaidza bhizinesi rine bhajeti remabhiriyoni emadhora kutanga kuri kurerutsa kambani, asi, ngative vakatendeseka, YMTC haisati yagadzira zvigadzirwa muhuwandu hwakawanda. Iyo kambani ichaenda kune yakawanda yekutengesa zvinhu zve 3D NAND pedyo nekupera kwegore rino painotangisa kugadzirwa kwe128-Gbit 64-layer memory, iyo, nenzira, ichatsigirwa neiyo yakafanana hunyanzvi Xtacking tekinoroji.

Sezvinotevera kubva mishumo ichangoburwa, nguva pfupi yadarika paGSA Memory + foramu, Yangtze Memory CTO Tang Jiang akabvuma kuti Xtacking 2.0 tekinoroji ichaunzwa muna Nyamavhuvhu. Nehurombo, mukuru wehunyanzvi wekambani haana kugovera ruzivo rwekuvandudzwa kutsva, saka isu tinofanirwa kumirira kusvika Nyamavhuvhu. Sezvinoratidzwa zvekare, kambani inochengeta chakavanzika kusvika kumagumo uye kusati kwatanga kweFlash Memory Summit 2019, isu hatigone kudzidza chero chinhu chinonakidza nezve Xtacking 2.0.

Kana iri tekinoroji yeXtacking pachayo, chinangwa chayo chaive mapoinzi matatu: render simba rakasimba pakugadzirwa kwe3D NAND uye zvigadzirwa zvakavakirwa pazviri. Aya ndiwo kumhanya kweiyo interface ye flash memory chips, kuwedzera kwekurekodha density uye kumhanya kwekuunza zvigadzirwa zvitsva kumusika. Xtacking tekinoroji inokutendera kuti uwedzere mwero wekuchinjana nendangariro array mu3D NAND machipi kubva pa1–1,4 Gbit/s (ONFi 4.1 uye ToggleDDR interfaces) kuenda ku3 Gbit/s. Sezvo huwandu hwemachipisi huchikura, izvo zvinodikanwa zvekutsinhana nekukurumidza zvichawedzera, uye maChinese anotarisira kuve wekutanga kuita budiriro munzvimbo ino.

Pane chimwe chipingamupinyi mukuwedzera kurekodha density - kuvapo pane 3D NAND chip kwete chete ndangariro array, asiwo peripheral control uye simba maseketi. Aya maseketi anobvisa kubva pa20% kusvika 30% yenzvimbo inoshandisika kubva mundangariro arrays, uye 128% yeiyo chip surface ichabviswa kubva ku50-Gbit chips. Panyaya yeXtacking tekinoroji, iyo ndangariro array inogadzirwa pane yayo chip, uye maseketi ekudzora anogadzirwa pane imwe. Iyo crystal yakazvipira zvachose kumaseru ekurangarira, uye kudzora maseketi padanho rekupedzisira remusangano we chip anonamirwa kune kristaro nendangariro.

Kugadzira kwakasiyana uye kunotevera kusangana kunobvumirawo kukurumidza kusimudzira kwetsika memory machipisi uye zvigadzirwa zvetsika zvinounganidzwa sezvidhinha mumusanganiswa wakakodzera. Iyi nzira inotibvumira kudzikisa kusimukira kwechikafu ndangariro machipisi neinenge 3 mwedzi kubva panguva yakazara yekuvandudza yemwedzi gumi nemaviri kusvika gumi nemasere. Kukurumbira kuchinjika kunoreva kufarira kwevatengi kwakakwira, uko mugadziri weChinese wechidiki anoda semhepo.

Source: 3dnews.ru