X3D dhizaini: AMD inokurudzira kusanganisa chiplets uye HBM ndangariro

Intel inotaura zvakawanda nezve spatial dhizaini yeFoveros processors, yakazviedza panharembozha yeLakefield, uye pakupera kwa2021 iri kuishandisa kugadzira discrete 7nm graphics processors. Pamusangano pakati pevamiriri ve AMD nevanoongorora, zvakava pachena kuti pfungwa dzakadaro hadzisi dzechienzi kukambani iyi.

X3D dhizaini: AMD inokurudzira kusanganisa chiplets uye HBM ndangariro

Pachiitiko chechangobva kuitika cheFAD 2020, AMD CTO Mark Papermaster yakakwanisa kutaura muchidimbu nezve nzira yeramangwana yekushanduka-shanduka kwemhinduro dzekurongedza. Kudzoka muna 2015, Vega graphics processors vakashandisa iyo inonzi 2,5-dimensional dhizaini, apo HBM-mhando yekurangarira machipisi yakaiswa pane imwechete substrate neGPU crystal. AMD yakashandisa planar yakawanda-chip dhizaini muna 2017; makore maviri gare gare, munhu wese akajaira kuti pakanga pasina typo muizwi rekuti "chiplet".

X3D dhizaini: AMD inokurudzira kusanganisa chiplets uye HBM ndangariro

Mune ramangwana, sekutsanangura kunoita siraidhi, AMD ichachinja kuenda kune yakasanganiswa dhizaini iyo inosanganisa 2,5D uye 3D zvinhu. Mufananidzo uyu unopa zano rakashata rezvimiro zvegadziriro iyi, asi pakati unogona kuona makristasi mana ari mundege imwechete, akakomberedzwa neina HBM memory stacks yechizvarwa chinoenderana. Sezviri pachena, dhizaini ye substrate yakajairika ichava yakanyanya kuoma. AMD inotarisira kuti shanduko kune iyi dhizaini ichawedzera density yeprofile interfaces kagumi. Zvine musoro kufunga kuti server GPUs ichave pakati pekutanga kutora iyi dhizaini.



Source: 3dnews.ru

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