Redmi inokwidziridza mureza smartphone ine Snapdragon 855 chip yemitambo

Redmi brand CEO Lu Weibing anoenderera mberi nekugovera ruzivo nezve mureza smartphone, iyo ichave yakavakirwa pane ine simba Snapdragon 855 processor.

Redmi inokwidziridza mureza smartphone ine Snapdragon 855 chip yemitambo

Pakutanga, VaWeibing vakataura kuti chigadzirwa chitsva chichatsigira teknolojia yeNFC uye 3,5 mm headphone jack. Kumashure kwemuviri kuchave nekamera katatu, iyo inosanganisira 48-megapixel sensor.

Sekutaura kwaita musoro weRedmi, iyo mureza smartphone ichave yakagadziridzwa yemitambo. Pamusoro pezvo, kuvandudzwa kwakabatana nekuchaja kwebhatiri kunotaurwa. Nenzira, kugona kweiyo yekupedzisira kunofanirwa kunge kuri 4000 mAh.

Zvinoenderana nedata iripo, mudziyo uchapihwa 6,39-inch Yakazara HD+ kuratidza ine resolution ye2340 Γ— 1080 pixels. Fingerprint scanner ichawanikwa yakananga munzvimbo yescreen.


Redmi inokwidziridza mureza smartphone ine Snapdragon 855 chip yemitambo

Yakazozivikanwawo kuti chigadzirwa chitsva chinogona kupinda mumusika mune zvinyorwa zvina: ine 6 GB ye RAM uye flash drive ine simba re 64 GB uye 128 GB, pamwe ne 8 GB ye RAM uye flash module ine simba. ye128GB uye 256GB.

Pakupedzisira, zvinonzi iyo mureza smartphone ichava nehama isingadhuri ine maitiro akafanana ehunyanzvi, asi ine Snapdragon 730 processor. 



Source: 3dnews.ru

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