Maajo 13, Redmi waxay soo bandhigi doontaa calanka ku saleysan Snapdragon 855 iyo "alaabta kale"

Ka dib markii Redmi ay ka soocday shirkaddeeda waalid ee Xiaomi oo u qaybsantay qayb madax-bannaan, calaamaddu waxay sii daysay shan taleefan oo casri ah - Redmi Note 7, Redmi Go, Redmi Note 7 Pro, Redmi 7 iyo Redmi Y3. Waxay hadda diyaarinaysaa calankeedii ugu horreeyay, kaas oo ku salaysnaan doona Qualcomm's horumarsan ee 7nm Snapdragon 855 SoC. Ka dib dhowr daadad, tilmaamo iyo xanta, waxay u egtahay in taleefanku ugu dambeyntii soo bixi doono.

Marka loo eego barta Weibo ee madaxa aaladda smart Xiaomi Tang Mu, shirkaddu waxay soo saari kartaa taleefanka casriga ah ee 'Snapdragon 855-powered Redmi flagship' horraantii Maajo 13, munaasabad gaar ah oo ka dhacday Shiinaha. Intaa waxaa dheer, wuxuu raaciyay in "hal shay oo kale" lagu soo bandhigi doono halkaas, laakiin waxa dhabta ah ee aan ka hadlayno way adagtahay in la fahmo. Marka la eego in Mr. Mu uu madax u yahay qaybta qalabka casriga ah, waxay u badan tahay in tani ay noqon karto nooc ka mid ah xalalka guriga.

Maalintii kale, sawirka filimka difaaca ee casriga ah ee Redmi K20 Pro (oo hore loogu soo bandhigay xanta sida Redmi X), kaas oo lagu eedeeyay inuu yahay qalabka soo socda ee calaamadda Redmi, ayaa ka soo muuqday internetka. Waxay sheegtay in taleefanku heli doono chip Snapdragon 855, oo ay ku jiraan 48-megapixel sensor ee kamaradda weyn iyo batari 4000 mAh ah.

Marka loo eego xanta, qalabku wuxuu heli doonaa shaashad 6,3-inji ah oo AMOLED ah oo leh Full HD + (2340 × 1080) xallinta waxaana loo maleynayaa inuu yeelan doono dareeraha sawirka faraha ee lagu dhex dhisay shaashadda (horey waxaa jiray warar xan ah oo sheegaya inuu ku yaal dhinaca dambe). Qalabku wuxuu taageeri doonaa dallacaadda xawaaraha sare ee 27-W, wuxuu leeyahay jaakad maqal ah oo 3,5 mm ah iyo module NFC ah oo loogu talagalay bixinta lacag-bixinta aan lala xiriirin. Waxaa la filayaa in qalabku helo kamarad saddex-laab ah oo weyn oo ku salaysan dareemayaal leh xallinta 48, 13 iyo 8 megapixels, mid ka mid ah modules-yada ayaa yeelan doona indho-indheyn ultra-ballaaran.

Shirkaddu waxa kale oo ay hore uga dhawaajisay talefanka casriga ah ee ku salaysan nidaamka hal-chip ee Snapdragon 730, laga yaabee in qalabkani heli doono kamarad dib loo celin karo oo iskeed isu sawiri doonta, waxaana la soo bandhigi doonaa 13-ka May, calanka dhabta ahna la sii dayn doono ka dib.

Source: 3dnews.ru