Iyada oo ay weheliso ku dhawaaqida soo-saareyaasha desktop-ka ee Ryzen 3000 ee ku saleysan Zen 2 microarchitecture, AMD waxay si rasmi ah u daaha ka qaaday faahfaahin ku saabsan X570, chipset cusub oo loogu talagalay calanka Socket AM4 motherboards. Hal-abuurka ugu weyn ee Chipset-kan ayaa ah taageerada baska PCI Express 4.0, laakiin waxyaabo kale oo xiiso leh ayaa sidoo kale la helay.
Waxaa mudan in isla markaaba xoogga la saaro in Motherboard-yada cusub ee ku saleysan X570, ee ka soo muuqan doona khaanadaha dukaamada mustaqbalka dhow, lagu dhisay il si ay ula shaqeeyaan baska PCI Express 4.0 bilowgii hore. Tani waxay ka dhigan tahay in dhammaan boosaska ku yaal looxyada cusub ay awood u yeelan doonaan inay la shaqeeyaan aaladaha ku habboon qaabka cusub ee xawaaraha sare iyada oo aan wax boos ah lagu hayn (marka jiilka XNUMXaad ee Ryzen processor lagu rakibo nidaamka). Tani waxay khuseysaa labadaba boosaska ku xiran kontaroolaha processor-ka baska PCI Express, iyo boosaska uu ka masuulka ka yahay kantaroolaha chipset-ka.
Laftigeeda, jaantuska macquulka ah ee X570 wuxuu awood u leeyahay inuu bixiyo ilaa 16 PCI Express 4.0 haad, laakiin kala badh ka mid ah haadyadan ayaa dib loogu habeyn karaa dekedaha SATA. Intaa waxaa dheer, Chipset-ku wuxuu leeyahay koontaroole SATA afar-deked ah oo madax-bannaan, USB 3.1 Gen2 kantaroole oo taageero u leh siddeed dekedood oo 10-gigabit ah, iyo kontaroolaha USB 2.0 oo taageera 4 dekedood.
Si kastaba ha ahaatee, waxaad u baahan tahay inaad fahamto in hawlgalka tiro badan oo ka mid ah qaybaha xawaaraha sare ee nidaamyada ku salaysan X570 ay xaddidi doonaan xawaaraha baska ee ku xiraya processor-ka chipset-ka. Baskuna wuxuu isticmaalaa afar haad oo PCI Express 4.0 ah haddii processor-ka Ryzen 3000 lagu rakibo sabuuradda, ama afar haad oo PCI Express 3.0 ah marka la rakibo soo-saareyaal hore.
Waxaa mudan in la xasuusto in Ryzen 3000 system-on-a-chip uu leeyahay awoodiisa: taageerada 20 PCI Express 4.0 haad (16 haad oo loogu talagalay kaararka garaafyada iyo 4 haad ee darawalka NVMe), iyo 4 USB 3.1 Gen2 dekedaha. Dhammaan tani waxay u oggolaanaysaa soosaarayaasha Motherboard-ka inay abuuraan goobo aad u dabacsan oo shaqeynaya oo ku saleysan X570 oo leh tiro badan oo ah boosaska xawaaraha sare ee PCIe, M.2, kontaroolayaasha shabakadaha kala duwan, dekedo xawaare sare leh oo loogu talagalay durugsan, iyo wixii la mid ah.
Kuleylka kuleylka ee 'X570 logic set' runtii waa 15 W oo ka soo horjeeda 6 W jiilkii hore ee chipsets, si kastaba ha ahaatee, AMD waxay sheegaysaa qaar ka mid ah nooca "la fududeeyey" ee X570, kaas oo kuleylka kuleylka lagu dhimi doono 11 W sababtoo ah diidmada tiro cayiman oo PCI Express 4.0 ah. Si kastaba ha ahaatee, X570 weli waa chip aad u kulul, taas oo ugu horrayn ay sabab u tahay isdhexgalka ee xawaaraha sare ee kontoroolka baska PCI Express galay chip.
AMD waxay xaqiijisay in X570 Chipset-ka uu isagu iskiis u sameeyay, halka naqshadaynta Chipset-yadii hore uu gacanta ku hayay qandaraasle dibadda ah -ASMedia.
Hormoodka soosaarayaasha Motherboard-ka ayaa soo bandhigi doona alaabtooda ku saleysan X570 maalmaha soo socda. AMD waxay ballan qaadaysaa in kala duwanaanshahooda ka koobnaan doonaan ugu yaraan 56 nooc.
Source: 3dnews.ru