ASML, oo ah hormuudka caalamiga ah ee nidaamyada sawir-qaadista (EUV iyo DUV) ee warshadaha semiconductor-ka, ayaa gaartay horumar dhanka tiknoolajiyada lithography-ga ee EUV waxayna qorsheyneysaa inay kordhiso wax soo saarka jajabka 50% marka la gaaro 2030. Injineerada shirkaddu waxay kordhiyeen awoodda isha iftiinka ilaa 1000 watts, taasoo suurtagelisay farsamaynta ilaa 330 wafer silicon ah saacaddii iyo si weyn u dhimidda kharashka soo saarista processor-rada horumarsan.

Sida ku cad warbixinta, ReutersCilmi-baarayaashu waxay sameeyeen hab lagu kordhinayo awoodda isha iftiinka ee nidaamyada lithography-ga ultraviolet-ka daran (EUV). Horumarkan farsamo wuxuu kordhin doonaa wax soo saarka qalabka 50% dhammaadka tobanka sano wuxuuna xoojin doonaa booska shirkadda iyadoo ay sii kordhayaan tartanka ka imanaya soosaarayaasha Mareykanka iyo Shiinaha. Khabiirka tiknoolajiyadda ee ASML Michael Purvis ayaa xaqiijiyay shaqeynta buuxda ee nidaamka 1000-watt ee xaaladaha wax soo saarka adduunka dhabta ah wuxuuna xusay inaysan jirin caqabado aasaasi ah oo sii kordhinaya wax soo saarka korontada ilaa 2000 watts.
Faa'iidada ugu muhiimsan ee kordhinta awoodda isha laga bilaabo hadda 600 ilaa 1000 watts waa awoodda lagu soo saaro badeecooyin badan halbeeg kasta oo waqti ah. Maadaama jajabyada lagu daabaco iyadoo la adeegsanayo sawir-qaadis, xoogga shucaaca ee sareeya wuxuu yareeyaa waqtiga soo-gaadhista lakabka kiimikada ee ku yaal wafer-ka silicon. Teun van Gogh, Madaxweyne Ku-xigeenka Makiinadaha EUV, ayaa saadaaliyay in casriyeyntani ay u suurtogelin doonto qalabka inuu farsameeyo qiyaastii 330 wafer saacaddii marka la gaaro 2030, marka loo eego 220-ka hadda jira. Kordhinta wax-soo-saarka iskaanka ayaa yarayn doonta kharashka qalab kasta oo loogu talagalay macaamiisha waxayna taageeri doontaa jiritaanka dhaqaale ee tignoolajiyada EUV.
Si loo xaqiijiyo qorshahan, ASML waxay sifeysay hab horey loogu tixgeliyey mid ka mid ah caqabadaha injineernimada ugu adag. Nidaamku wuxuu adeegsadaa laysar awood sare leh oo soo saara iftiin 13,5-nanometer ah isagoo shidaya durdur qasacad dhalaalaysa, taasoo u beddelaysa walxaha balaasmaha. Hal-abuurka ugu muhiimsan waa labanlaabidda soo noqnoqoshada dhibcaha ilaa 100,000 ilbiriqsi kasta iyo isticmaalka naqshad garaaca laba-laser ah si loo qaabeeyo dhibcaha, iyadoo la kala soocayo nidaamka iyo moodooyinka hadda jira. Jorge J. Rocca, oo ah borofisar ka tirsan Jaamacadda Gobolka Colorado, ayaa ka faallooday baaxadda shaqada, isagoo ku tilmaamay guusha awoodda heerka kilowatt guul cajiib ah oo u baahan faham qoto dheer oo ku saabsan teknoolojiyada badan.
Reuters waxay xustay in caqabaddan injineernimada sare ay tahay tan ka caawisa shirkadda Dutch inay ilaaliso masaafada ay la leedahay tartamayaasha cusub, sida shirkadaha cusub ee Mareykanka ee Substrate iyo xLight, kuwaas oo horumarinaya xalalkooda iyagoo taageero dhaqaale ka helaya dowladda Mareykanka.
Source:
Source: 3dnews.ru
