MediaTek waxay soo bandhigtay Chip-ga dhexe ee Dimensity 800 - oo la bilaabay rubuci hore ee 2020

Kadib hore loo soo bandhigay calanka hal-chip system Dimensity 1000 oo ka socda MediaTek xaflada Shirka Isgaarsiinta, sida la filayo, ayaa ku dhawaaqday Chip cusub - Dimensity 800. Processor-kan waxaa loogu talagalay inuu noqdo wadnaha dhexe iyo dhamaadka casriga casriga ah.

MediaTek waxay soo bandhigtay Chip-ga dhexe ee Dimensity 800 - oo la bilaabay rubuci hore ee 2020

Isla mar ahaantaana, waxaa la ogaaday in taleefannada casriga ah ee ugu horreeya ee ku saleysan MediaTek Dimensity 800 ay ka soo muuqan doonaan suuqa rubuci labaad ee sanadka soo socda, iyo bilaabista buuxda iyo gaarsiinta tirada badan ee chip lafteeda ayaa loo qorsheeyay rubuci hore ee 2020. Nasiib darro, MediaTek weli ma muujin wax faahfaahin farsamo ah oo ku saabsan sifooyinka iyo hawlaha nidaamka cusub ee hal-chip. Hal shay ayaa cad: waa inay lahaataa modem 5G ah oo ku dhex dhisan, taas oo ah sifo gaar ah oo dhan taxanaha cusub ee Dimensity.

Aan ku xasuusiyo: wakiilkii ugu horreeyay ee taxanahan wuxuu ahaa processor-ka Dimensity 1000 5G, oo la soo saaray iyadoo la adeegsanayo heerarka 7 nm. Xalka waxaa ka mid ahaa siddeed qaybood oo CPU ah: kuwani waa afar meelood oo ARM Cortex-A77 @ 2,6 GHz iyo ARM Cortex-A55 @ 2 GHz. Garaafyada waxaa gacanta ku haya ARM Mali-G77 MC9; Bandhigyada leh xallinta ilaa 2520 Γ— 1080 pixels waa la taageerayaa. Chip-ku waxa kale oo uu ka kooban yahay unug farsamayneed oo horumarsan oo AI ah (APU 3.0), kaas oo siinaya waxqabad 4,5 tiriliyan hawlgal ilbiriqsikii (TOPS).

MediaTek waxay soo bandhigtay Chip-ga dhexe ee Dimensity 800 - oo la bilaabay rubuci hore ee 2020

Modem-ka la dhisay ee Helio M70 5G waxa uu awood u leeyahay 4,7 Gbps soo dejinta xawaaraha iyo ilaa 2,5 Gbps xawli kor u qaadis ah waxana uu taageeraa qaab-dhismeedka shabakadeed ee taagan iyo kuwa aan taaganayn (SA/NSA). Dimensity 1000 waxaa loogu talagalay inay la tartanto Qualcomm Snapdragon 865, HiSilicon Kirin 990 iyo Samsung Exynos 990.

Taleefannada casriga ah ee Oppo Reno3 ee soo socda ayaa la filayaa in uu ku shaqayn doono processor-ka MediaTek Dimensity 1000L 5G, sidoo kalena loo yaqaan MediaTek MT6885, kaas oo uu ku kala duwan yahay qaabka xawaaraha saacadaha hoose. Taleefannada casriga ah ee ugu horreeya ee leh Dimensity 1000 5G chip waxay ka soo muuqan doonaan suuqa Shiinaha iyo waddamada kale ee Aasiya rubuci hore ee 2020, iyo US iyo EU qeybta labaad ee 2020.

MediaTek waxay soo bandhigtay Chip-ga dhexe ee Dimensity 800 - oo la bilaabay rubuci hore ee 2020



Source: 3dnews.ru

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