Soo saaraha semiconductor Taiwanese TSMC ayaa ku dhawaaqay bilaabista wax soo saarka ballaaran ee nidaamyada hal-chip iyadoo la adeegsanayo 7-nm + habka tignoolajiyada. Waxaa xusid mudan in iibiyuhu uu soo saarayo chips markii ugu horeysay isagoo isticmaalaya lithography ee xadka adag ee ultraviolet (EUV), isagoo qaadaya tallaabo kale oo uu kula tartami karo Intel iyo Samsung.
TSMC waxay sii waddaa wada shaqaynta ay la leedahay Huawei ee Shiinaha iyada oo bilawday soo saarista Kirin 985 hababka hal-chip ee cusub, kaas oo aasaas u noqon doona talefannada casriga ah ee shirkadda Shiinaha ee Mate 30. Isla habka wax soo saarka ayaa loo isticmaalaa in lagu sameeyo Apple's A13 chips, kuwaas oo la filayo in loo isticmaalo 2019 iPhone.
Marka lagu daro ku dhawaaqista bilowga wax soo saarka ballaaran ee chips cusub, TSMC waxay ka hadashay qorshaheeda mustaqbalka. Gaar ahaan, waxaa la ogaaday in la bilaabay wax soo saarka tijaabada ah ee alaabta 5-nanometer iyadoo la adeegsanayo tignoolajiyada EUV. Haddii qorshayaasha soo-saaraha aan la carqaladayn, wax-soo-saarka taxanaha ah ee chips-ka 5-nanometer ayaa la bilaabi doonaa rubuci hore ee sanadka soo socda, waxayna awood u yeelan doonaan inay ka soo muuqdaan suuqa meel u dhow bartamaha 2020.
Warshada cusub ee shirkadda, oo ku taal Beerta Sayniska iyo Tignoolajiyada Koonfurta ee Taiwan, waxay helaysaa rakibaadyo cusub oo ku saabsan habka wax soo saarka. Isla mar ahaantaana, warshad kale oo TSMC ah ayaa bilaabeysa shaqada diyaarinta habka 3-nanometer. Waxa kale oo jira geeddi-socod ku-meel-gaar ah oo 6nm ah oo horumarinta ah, taas oo ay u badan tahay inay noqoto kor u kaca tiknoolajiyada 7nm ee hadda la isticmaalo.
Source: 3dnews.ru