{"id":156210,"date":"2026-02-01T23:12:51","date_gmt":"2026-02-01T21:12:54","guid":{"rendered":"https:\/\/prohoster.info\/blog\/novosti-interneta\/intel-pokazala-obrazecz-ogromnogo-ii-chipa-s-chetyrmya-logicheskimi-blokami-i-12-stekami-hbm4"},"modified":"2026-02-02T16:58:05","modified_gmt":"2026-02-02T14:58:05","slug":"intel-pokazala-obrazecz-ogromnogo-ii-chipa-s-chetyrmya-logicheskimi-blokami-i-12-stekami-hbm4","status":"publish","type":"post","link":"https:\/\/prohoster.info\/sq\/blog\/news\/intel-pokazala-obrazecz-ogromnogo-ii-chipa-s-chetyrmya-logicheskimi-blokami-i-12-stekami-hbm4","title":{"rendered":"Intel shfaqi nj\u00eb most\u00ebr t\u00eb madhe t\u00eb \u00e7ipit AI me kat\u00ebr blloqe logjike dhe 12 grupe HBM4","gt_translate_keys":[{"key":"rendered","format":"text"}]},"content":{"rendered":"

Intel Foundry l\u00ebshoi nj\u00eb dokument reklamues<\/a>, q\u00eb p\u00ebrshkruan n\u00eb detaje zgjidhjet p\u00ebrparimtare t\u00eb kompanis\u00eb n\u00eb zhvillimin dhe realizimin e harduer\u00ebve p\u00ebr aplikacione t\u00eb inteligjenc\u00ebs artificiale dhe llogaritjeve me performanc\u00eb t\u00eb lart\u00eb. Intel gjithashtu tregoi \"nj\u00eb most\u00ebr testi t\u00eb \u00e7ipit p\u00ebr AI\", duke demonstruar kapacitetet aktuale t\u00eb kompanis\u00eb n\u00eb fush\u00ebn e paketimit.<\/p>\n

<\/center>\"Intel<\/p>\n

Intel tregoi nj\u00eb sistem n\u00eb nj\u00eb paket\u00eb (SiP) me nj\u00eb madh\u00ebsi t\u00eb barabart\u00eb me tet\u00eb fotomaketa t\u00eb \u00e7ip\u00ebve standard\u00eb, duke p\u00ebrfshir\u00eb kat\u00ebr blloqe logjike, 12 grumbuj t\u00eb klas\u00ebs HBM4 dhe dy blloqe hyrje-dalje. Ndryshe nga koncepti i madh me 16 blloqe logjike dhe 24 grumbuj HBM5, i paraqitur nga kompania<\/a> muajin e kaluar, ky sistem \u00ebsht\u00eb me t\u00eb v\u00ebrtet\u00eb i pajisur p\u00ebr prodhim tashm\u00eb.<\/p>\n

\u00cbsht\u00eb e r\u00ebnd\u00ebsishme t\u00eb theksohet se Intel Foundry tregoi jo nj\u00eb accelerator AI n\u00eb funksionim, por \"nj\u00eb most\u00ebr testi t\u00eb \u00e7ipit p\u00ebr AI\", duke demonstruar se si mund t\u00eb krijohen (ose, m\u00eb sakt\u00eb, t\u00eb mblidhen) procesor\u00ebt e ardhsh\u00ebm p\u00ebr AI dhe llogaritje me performanc\u00eb t\u00eb lart\u00eb. Intel tregon t\u00eb gjith\u00eb metod\u00ebn e nd\u00ebrtimit, e cila bashkon blloqet e m\u00ebdha t\u00eb llogaritjes, grumbuj t\u00eb memories me shpejt\u00ebsi t\u00eb lart\u00eb, lidhjet shum\u00eb t\u00eb shpejta nd\u00ebr\u00e7ipore dhe teknologjit\u00eb e reja t\u00eb furnizimit n\u00eb nj\u00eb paket\u00eb teknologjike. Kjo paket\u00eb dallon ndjesh\u00ebm nga ajo q\u00eb ofrojn\u00eb sot kompani si TSMC. Intel d\u00ebshiron t\u00eb tregoj\u00eb se procesor\u00ebt e brezave t\u00eb ardhsh\u00ebm p\u00ebr AI me performanc\u00eb t\u00eb lart\u00eb mund t\u00eb ken\u00eb nj\u00eb konstrukcion me shum\u00eb \u00e7ipe, dhe Intel Foundry tashm\u00eb \u00ebsht\u00eb n\u00eb gjendje t'i prodhoj\u00eb ata.<\/p>\n

Platforma e demonstruar p\u00ebrb\u00ebhet nga kat\u00ebr blloqe logjike, t\u00eb nd\u00ebrtuara ose jo mbi procesin teknologjik Intel 18A (duke p\u00ebrfshir\u00eb transistorr\u00ebt RibbonFET me dritare t\u00eb rrethuar dhe sistemin e furnizimit PowerVia n\u00eb an\u00ebn e prapme), t\u00eb cilat jan\u00eb t\u00eb rrethuara nga grumbuj memorie HBM4 dhe blloqe hyrjeje-daljeje. T\u00eb gjitha elementet kryesore, presumtivisht, jan\u00eb t\u00eb lidhura me urat EMIB-T 2.5D, t\u00eb integruara direkt n\u00eb bazamentin e paketimit. Intel p\u00ebrdor teknologjin\u00eb e nd\u00ebrfaqes nd\u00ebr\u00e7ipletike EMIB-T, e cila shton vrima tranzite silikoni brenda urave, n\u00eb m\u00ebnyr\u00eb q\u00eb energjia dhe sinjalet t\u00eb kalojn\u00eb si n\u00eb drejtim vertical ashtu edhe horizontal, p\u00ebr t\u00eb maksimizuar densitetin e nd\u00ebrprerjeve dhe fuqis\u00eb. Platforma \u00ebsht\u00eb projektuar p\u00ebr nd\u00ebrfaqet nd\u00ebrkristalor\u00eb UCIe, q\u00eb funksionojn\u00eb me shpejt\u00ebsi 32 GT\/s dhe m\u00eb shum\u00eb, t\u00eb cilat, duket se, p\u00ebrdoren gjithashtu p\u00ebr lidhjen e grumbujve C-HBM4E.<\/p>\n

\"Intel<\/p>\n

Mostra e testit t\u00eb \u00e7ipit gjithashtu demonstron kalimin e Intel n\u00eb nd\u00ebrtimin vertikal. Harta e procesit t\u00eb kompanis\u00eb p\u00ebrfshin teknologjin\u00eb Intel 18A-PT, e dizajnuar posa\u00e7\u00ebrisht p\u00ebr \u00e7iplet, t\u00eb cilat parashikojn\u00eb vendosjen e kristaleve logjike ose t\u00eb memories sip\u00ebr. Prandaj, \u00e7iplet duhet t\u00eb ken\u00eb furnizim energjie nga ana e prapme, si dhe t\u00eb p\u00ebrdorin lidhje me vrima kaluese dhe hibride. N\u00eb rastin e \u00abmostr\u00ebs testuese t\u00eb procesorit t\u00eb AI\u00bb, kristalet baz\u00eb 18A-PT jan\u00eb vendosur n\u00ebn kristalet kompjuterike 18A\/18A-P dhe ose veprojn\u00eb si \u00e7ipa t\u00eb m\u00ebdhenj t\u00eb cache memorjes, ose kryejn\u00eb nj\u00eb funksion ndihm\u00ebs. P\u00ebr lidhjen vertikale t\u00eb \u00e7ipleteve, Intel p\u00ebrdor familjen e teknologjive t\u00eb paketimit Foveros \u2014 Foveros 2.5D, Foveros-R dhe Foveros Direct 3D. Ato lejojn\u00eb realizimin e nj\u00eb lidhjeje bakri me hap t\u00eb holl\u00eb midis kristaleve aktive p\u00ebr t\u00eb siguruar kapacitetin maksimal t\u00eb p\u00ebr\u00e7ueshm\u00ebris\u00eb dhe efikasitetit t\u00eb energjis\u00eb s\u00eb kristaleve t\u00eb sip\u00ebrme. N\u00eb p\u00ebrputhje me urat EMIB, k\u00ebto metoda i lejojn\u00eb Intel-it t\u00eb krijoj\u00eb nj\u00eb nd\u00ebrtim hibrid lateral-vertikal, q\u00eb kompania e pozicionon si nj\u00eb alternativ\u00eb p\u00ebr nd\u00ebrprer\u00ebsit e madhe t\u00eb silikonit me nj\u00eb shfryt\u00ebzim m\u00eb t\u00eb lart\u00eb t\u00eb pllak\u00ebs dhe prodhimin e produkteve t\u00eb gatshme.<\/p>\n

P\u00ebr akcelerator\u00ebt shum\u00eb\u00e7ipor\u00eb t\u00eb AI dhe p\u00ebr llogaritjet me performanc\u00eb t\u00eb lart\u00eb, kufizimi kryesor konstruktiv \u00ebsht\u00eb energjia. Me k\u00ebt\u00eb q\u00ebllim, platforma Intel duhet t\u00eb kombinoj\u00eb t\u00eb gjitha inovacionet m\u00eb t\u00eb fundit t\u00eb Intel-it n\u00eb fush\u00ebn e kursimit t\u00eb energjis\u00eb, duke p\u00ebrfshir\u00eb PowerVia, kondensator\u00ebt e integruar Omni MIM, izolimin n\u00eb nivelin e ur\u00ebs n\u00eb EMIB-T, kondensator\u00ebt e eDTC dhe eMIM-T n\u00eb kristalin baz\u00eb, si dhe induktor\u00ebt e integruar CoaxMIL p\u00ebr t\u00eb mb\u00ebshtetur rregullator\u00ebt e tensionit t\u00eb pol-integruar (IVR), t\u00eb vendosur n\u00ebn \u00e7do kat dhe n\u00ebn trupin e vet (n\u00eb dallim nga IVR n\u00eb rastin e CoWoS-L nga TSMC, q\u00eb jan\u00eb pjes\u00eb e nd\u00ebrprer\u00ebsit). Kjo rrjet\u00eb shum\u00eb-nivele \u00ebsht\u00eb e projektuar p\u00ebr t\u00eb mb\u00ebshtetur rrym\u00ebn e q\u00ebndrueshme n\u00eb ngarkesat e pun\u00ebs s\u00eb AI-gjenerativ, pa ulur nivelin e tensionit.<\/p>\n

Me demonstrat\u00ebn e saj, Intel duket se p\u00ebrpiqet t\u00eb t\u00ebrheq\u00eb klient\u00ebt. Deri tani, nuk dihet n\u00ebse akceleratori i ri i gjenerat\u00ebs s\u00eb AI me kodin Jaguar Shores, q\u00eb pritet t\u00eb lansohen n\u00eb vitin 2027, do t\u00eb p\u00ebrdor\u00eb arkitektur\u00ebn q\u00eb Intel-in po e demonstrojn\u00eb sot.<\/p>\n

Burimi:<\/strong><\/p>\n