{"id":156210,"date":"2026-02-01T23:12:51","date_gmt":"2026-02-01T21:12:54","guid":{"rendered":"https:\/\/prohoster.info\/blog\/novosti-interneta\/intel-pokazala-obrazecz-ogromnogo-ii-chipa-s-chetyrmya-logicheskimi-blokami-i-12-stekami-hbm4"},"modified":"2026-02-02T16:58:05","modified_gmt":"2026-02-02T14:58:05","slug":"intel-pokazala-obrazecz-ogromnogo-ii-chipa-s-chetyrmya-logicheskimi-blokami-i-12-stekami-hbm4","status":"publish","type":"post","link":"https:\/\/prohoster.info\/sq\/blog\/novosti-interneta\/intel-pokazala-obrazecz-ogromnogo-ii-chipa-s-chetyrmya-logicheskimi-blokami-i-12-stekami-hbm4","title":{"rendered":"Intel tregoi nj\u00eb most\u00ebr t\u00eb nj\u00eb \u00e7ipi t\u00eb madh AI me kat\u00ebr blloqe logjike dhe 12 grumbuj HBM4","gt_translate_keys":[{"key":"rendered","format":"text"}]},"content":{"rendered":"

Intel Foundry l\u00ebshoi nj\u00eb dokument reklamues<\/a>, q\u00eb p\u00ebrshkruan n\u00eb detaje zgjidhjet e avancuara t\u00eb kompanis\u00eb n\u00eb zhvillimin dhe realizimin e harduer\u00ebve p\u00ebr aplikacione t\u00eb inteligjenc\u00ebs artificiale dhe p\u00ebrpunim me performanc\u00eb t\u00eb lart\u00eb. Intel gjithashtu demonstroi \"nj\u00eb most\u00ebr prove t\u00eb \u00e7ipit p\u00ebr AI\", q\u00eb tregon kapacitetet aktuale t\u00eb kompanis\u00eb n\u00eb fush\u00ebn e paketimit.<\/p>\n

<\/center>\"Intel<\/p>\n

Intel tregoi nj\u00eb sistem n\u00eb paket\u00eb (SiP) me p\u00ebrmasa t\u00eb kat\u00ebr blloqeve logjike, 12 stak\u00ebve n\u00eb klas\u00ebn HBM4 dhe dy bllokeve hyr\u00ebse-dal\u00ebse. Ndryshe nga koncepti masiv me 16 blloqe logjike dhe 24 stak\u00eb HBM5, i prezantuar nga kompania<\/a> n\u00eb muajin e kaluar, ky sistem \u00ebsht\u00eb me t\u00eb v\u00ebrtet\u00eb i gatsh\u00ebm p\u00ebr prodhim sot.<\/p>\n

\u00cbsht\u00eb e r\u00ebnd\u00ebsishme t\u00eb theksohet se Intel Foundry tregoi jo nj\u00eb p\u00ebrshpejtues AI n\u00eb funksionim, por \"nj\u00eb most\u00ebr prove t\u00eb \u00e7ipit p\u00ebr AI\", q\u00eb demonstroi si mund t\u00eb krijohen (ose, m\u00eb sakt\u00eb, t\u00eb montohen) procesor\u00ebt e ardhsh\u00ebm p\u00ebr AI dhe p\u00ebrpunim me performanc\u00eb t\u00eb lart\u00eb. Intel tregon t\u00eb gjith\u00eb metod\u00ebn e nd\u00ebrtimit, q\u00eb bashkon blloqe t\u00eb m\u00ebdha p\u00ebrpunimi, staka t\u00eb memories me shpejt\u00ebsi t\u00eb lart\u00eb, lidhje nd\u00ebr\u00e7ipore ultrashpejta dhe teknologji t\u00eb reja fuqie n\u00eb nj\u00eb paket\u00eb teknologjike. Kjo paket\u00eb dallon n\u00eb m\u00ebnyr\u00eb t\u00eb konsiderueshme nga ajo q\u00eb ofrojn\u00eb sot kompani si TSMC. Intel d\u00ebshiron t\u00eb tregoj\u00eb se procesor\u00ebt e brezit t\u00eb ardhsh\u00ebm p\u00ebr AI me performanc\u00eb t\u00eb lart\u00eb mund t\u00eb ken\u00eb nj\u00eb struktur\u00eb me shum\u00eb \u00e7ipe, dhe Intel Foundry tashm\u00eb \u00ebsht\u00eb n\u00eb gjendje t'i prodhoj\u00eb ata.<\/p>\n

N\u00eb themel t\u00eb platform\u00ebs s\u00eb demonstruar q\u00ebndrojn\u00eb kat\u00ebr blloqe logjike t\u00eb m\u00ebdha, t\u00eb nd\u00ebrtuara mendohet mbi procesin teknologjik Intel 18A (prandaj, me tranzistor\u00eb RibbonFET me mbules\u00eb qarkore dhe sistem energjie PowerVia nga mbrapa), t\u00eb rrethuar nga stak\u00eb t\u00eb memories HBM4 dhe blloqe hyr\u00ebse-dal\u00ebse. T\u00eb gjitha element\u00ebt ky\u00e7, mendohet t\u00eb jen\u00eb t\u00eb lidhura me urat EMIB-T 2.5D, t\u00eb p\u00ebrcaktuara drejtp\u00ebrdrejt n\u00eb substratin e paket\u00ebs. Intel p\u00ebrdor teknologjin\u00eb e nd\u00ebrfaqes nd\u00ebr\u00e7ipore EMIB-T, e cila shton vrima t\u00eb kalimit silikoni p\u00ebrmes urave, n\u00eb m\u00ebnyr\u00eb q\u00eb energjia dhe sinjalet t\u00eb mund t\u00eb kalojn\u00eb si p\u00ebr vertikalisht ashtu edhe horizontalisht, p\u00ebr t\u00eb maksimizuar densitetin e lidhjeve dhe furnizimit me energji. Platforma \u00ebsht\u00eb projektuar p\u00ebr nd\u00ebrfaqe UCIe nd\u00ebrkristalore q\u00eb funksionojn\u00eb me shpejt\u00ebsi 32 GT\/s dhe m\u00eb lart, t\u00eb cilat, duket se gjithashtu p\u00ebrdoren p\u00ebr t\u00eb lidhur stak\u00ebt C-HBM4E.<\/p>\n

\"Intel<\/p>\n

Mostra e \u00e7ipit gjithashtu tregon kalimin e Intel n\u00eb montim vertical. Rrug\u00ebdalja e proceseve teknologjike t\u00eb kompanis\u00eb p\u00ebrfshin teknologjin\u00eb Intel 18A-PT, e projektuar ve\u00e7an\u00ebrisht p\u00ebr \u00e7iplet q\u00eb supozojn\u00eb vendosjen e blloqeve t\u00eb tjera logjike ose memories sip\u00ebr. Prandaj, \u00e7iplet duhet t\u00eb ken\u00eb furnizim energjie nga mbrapa, si dhe t\u00eb p\u00ebrdorin lidhje t\u00eb kalimit dhe hibride. N\u00eb rastin e \"mostr\u00ebs s\u00eb procesorit t\u00eb AI\", blloqet baz\u00eb 18A-PT ndodhen n\u00ebn blloqet p\u00ebrpunuese 18A\/18A-P dhe ose veprojn\u00eb si \u00e7ipe t\u00eb m\u00ebdha t\u00eb memories cache, ose kryejn\u00eb nj\u00eb funksion ndihm\u00ebs tjet\u00ebr. P\u00ebr lidhjen vertikale t\u00eb \u00e7ipleteve, Intel p\u00ebrdor familjen e teknologjive t\u00eb paketimit Foveros \u2014 Foveros 2.5D, Foveros-R dhe Foveros Direct 3D. K\u00ebto lejojn\u00eb realizimin e nj\u00eb lidhjeje t\u00eb holl\u00eb me bak\u00ebr midis blloqeve aktive p\u00ebr t\u00eb siguruar nj\u00eb kapacitet maksimal kalimi dhe efikasitet energjetik t\u00eb blloqeve t\u00eb sip\u00ebrme. S\u00eb bashku me urat EMIB, k\u00ebto metoda lejojn\u00eb Intel t\u00eb krijoj\u00eb nj\u00eb montim hibrid lateral-vertikal, t\u00eb cil\u00ebn kompania e pozicionon si nj\u00eb alternativ\u00eb ndaj nd\u00ebrmjet\u00ebsve t\u00eb m\u00ebdhenj t\u00eb silikoni me nj\u00eb p\u00ebrpjes\u00ebtim m\u00eb t\u00eb lart\u00eb t\u00eb p\u00ebrdorimit t\u00eb pllak\u00ebs dhe daljes s\u00eb produkteve t\u00eb cil\u00ebsis\u00eb.<\/p>\n

P\u00ebr p\u00ebrshpejtuesit me shum\u00eb \u00e7ipe AI dhe p\u00ebrpunim me performanc\u00eb t\u00eb lart\u00eb, kufizimi kryesor konstruktiv \u00ebsht\u00eb energjia. Me k\u00ebt\u00eb q\u00ebllim, platforma Intel duhet t\u00eb bashkoj\u00eb t\u00eb gjitha inovacionet m\u00eb t\u00eb fundit t\u00eb Intel n\u00eb fush\u00ebn e kursimit t\u00eb energjis\u00eb, duke p\u00ebrfshir\u00eb PowerVia, kondensator\u00ebt e integruar Omni MIM, ndarjen n\u00eb nivelin\u00eb e ur\u00ebs n\u00eb EMIB-T, kondensator\u00ebt e eDTC dhe eMIM-T n\u00eb bllokun baz\u00eb, si dhe induktor\u00ebt e integruar CoaxMIL p\u00ebr mb\u00ebshtetje t\u00eb rregullator\u00ebve t\u00eb tensionit (IVR) t\u00eb gjysm\u00eb-integruar, t\u00eb pozicionuar n\u00ebn \u00e7do stack dhe n\u00ebn vet\u00eb paket\u00ebn (ndryshe nga IVR n\u00eb rastin e CoWoS-L nga TSMC, t\u00eb cilat jan\u00eb pjes\u00eb e nd\u00ebrmjet\u00ebsit). Kjo rrjet\u00eb multilayer \u00ebsht\u00eb projektuar p\u00ebr t\u00eb mb\u00ebshtetur nj\u00eb rrym\u00eb t\u00eb q\u00ebndrueshme n\u00eb ngarkesat e inteligjenc\u00ebs artificiale gjeneruese pa ulur nivelin e tensionit.<\/p>\n

P\u00ebrmes demonstrat\u00ebs s\u00eb saj, Intel duket se po p\u00ebrpiqet t\u00eb t\u00ebrheq\u00eb klient\u00eb. P\u00ebr momentin, nuk dihet n\u00ebse akceleratori i AI-s\u00eb i gjenerat\u00ebs s\u00eb re me kodin Jaguar Shores, q\u00eb pritet t\u00eb lan\u00e7ohet n\u00eb vitin 2027, do t\u00eb p\u00ebrdor\u00eb arkitektur\u00ebn q\u00eb Intel po e tregon sot.<\/p>\n

Burimi:<\/strong><\/p>\n