Nakong ea seboka sa IFA 2019 Berlin, Huawei Consumer Business Executive Yu Chengdong hore k'hamphani e rera ho lokolla Mate X foldable smartphone ka Mphalane kapa Pulungoana. Sesebelisoa se tlang hajoale se ntse se etsoa liteko tse fapaneng. Ntle le moo, ho tlalehiloe hore Huawei Mate X e tla tla ka mefuta e 'meli.
Ho MWC, ho ile ha hlahisoa mofuta o fapaneng o ipapisitseng le chip ea Kirin 980. Ho thoe e tla fihla 'marakeng, empa hammoho le eona ho tla hlahisoa mofuta o tsoetseng pele haholo o nang le chip ea Kirin 990, eo . Kirin 990 5G SoC e kenyelletsa modem ea Balong 5 5000G 'me ka hona e tšehetsa marang-rang a 5G ntle le tšebeliso ea li-chips tsa ka ntle. Ntle le moo, e ts'ehetsa meaho e 'meli ea SA/NSA le maqhubu a TDD/FDD.
Mabapi le CPU, Kirin 990 e na le li-cores tse 4 tse matla tsa Cortex-A76 (tse peli ho 2,86 GHz le tse peli ho 2,36 GHz) le li-cores tse 4 tsa Cortex-A55 tse sebetsang hantle ho 1,95 GHz. Ho feta moo, e tla le ARM Mali G76 GPU. Ts'ebetso ea eona e eketsehile ka 6% le matla a matla ka 20% ha a bapisoa le chip ea moloko o fetileng.
Chip ea Kirin 990 e boetse e na le module ea neuroprocessor e nang le li-cores tse matla tse ipapisitseng le meralo ea Da Vinci le microcore e sebetsang hantle ka matla. Mochine oa litšoantšo o nchafalitsoe ho Kirin ISP 5.0, ho na le tšehetso bakeng sa memori ea LPDDR4X le UFS 2.1/3.0 flash memory. Ka tsela e 'ngoe, Samsung, ho sa tsotellehe tieho, e ne e le ka pele ho Huawei ka ho hlahisoa ha smartphone e feto-fetohang' marakeng - mosebeletsi oa rona Viktor Zaikovsky. ka Galaxy Fold e tsitsitseng mme a arolelana maikutlo a hae.
Source: 3dnews.ru