Intel e senotse litšobotsi tsa li-processor tse nyalisitsoeng tsa 10nm Lakefield

Ka likhoeli tse ngata, Intel esale e tsamaisa lisampole tsa liboto tsa bo-mme tse ipapisitseng le li-processor tsa 10nm Lakefield ho ea lipontšong tsa indasteri, 'me e buile khafetsa ka sebopeho se tsoelang pele sa XNUMXD Foveros seo ba se sebelisitseng, empa ha se khone ho fana ka matsatsi le litšoaneleho tse hlakileng tsa phatlalatso. Ho etsahetse kajeno - ho na le mefuta e 'meli feela e fanoang lelapeng la Lakefield.

Intel e senotse litšobotsi tsa li-processor tse nyalisitsoeng tsa 10nm Lakefield

Ho thehoa ha li-processor tsa Lakefield ho fa Intel mabaka a 'maloa a ho ba motlotlo. Nyeoe, e lekanyang 12 × 12 × 1 mm, e na le likarolo tse 'maloa tsa li-computing cores, logic ea tsamaiso, likarolo tsa matla, litšoantšo tse kopantsoeng esita le memori ea LPDDR4X-4267 e nang le boholo ba 8 GB. Ho boetse ho boletsoe ho hongata mabapi le tlhophiso ea likhomphutha tsa Lakefield: li-cores tse 'ne tsa moruo tse nang le meaho ea Tremont li haufi le motheo o le mong o hlahisang ka boqapi ba Sunny Cove. Qetellong, litšoantšo tse kopantsoeng tsa Gen 11 li na le ts'ehetso ea tlhaho bakeng sa lipontšo tse peli, tse lumellang Lakefield hore e sebelisoe bakeng sa lisebelisoa tsa selefouno tse phuthoang.

Boemong ba standby, processor ea Lakefield ha e sebelise ho feta 2,5 mW, e ka tlase ho makhetlo a leshome ho feta li-processor tse kholo tsa Amber Lake-Y. Li-processor tsa Lakefield li lokela ho hlahisoa ho sebelisoa theknoloji ea 10nm ea moloko o ts'oanang le oa Tiger Lake kapa Ice Lake-SP, leha mohopolo ona o sa utloahale. Ha rea ​​lokela ho lebala hore e 'ngoe ea "likarolo" tsa "sandwich" ea silicon, e leng Lakefield, e entsoe ka theknoloji ea 22 nm. Li-cores tsa komporo le lits'oants'o tse kopaneng li fumaneha ho chip ea 10-nm, e khethollang boleng ba theknoloji ena ha e hlalosa processor.

Intel e senotse litšobotsi tsa li-processor tse nyalisitsoeng tsa 10nm Lakefield

Mefuta e mengata ea Lakefield e lekanyelitsoe ho mabitso a mabeli: Core i5-L16G7 le Core i3-L13G4. Ka bobeli li fana ka motsoako oa "4 + 1" li-computing cores ntle le ho bala ka bongata, li na le 4 MB ea cache, li na le TDP e sa feteng 7 W le maqhubu a tsamaiso ea litšoantšo ho tloha ho 200 ho isa ho 500 MHz ho kenyeletsa. Phapang e teng ho maqhubu a li-computing cores le palo ea likarolo tsa ts'ebetso ea litšoantšo. Core i5-L16G7 e na le likarolo tse 64 tsa ts'ebetso ea litšoantšo, athe Core i3-L13G4 e na le likarolo tse 48 feela. Ea pele ea li-processor e sebetsa ka maqhubu ho tloha ho 1,4 ho ea ho 1,8 GHz ka li-cores tsohle tse sebetsang, ea bobeli - ho tloha 0,8 ho ea ho 1,3 GHz ka li-cores tsohle tse sebetsang. Ka mokhoa o le mong oa motheo, oa pele o ka fihla maqhubu a 3,0 GHz, e monyenyane - ke 2,8 GHz feela. Mokhoa oa ts'ebetso ea memori, mofuta oa eona le molumo ho bonahala li tšoana ho li-processor ka bobeli: 8 GB LPDDR4X-4267. Mohlala oa khale o ithorisa ka tšehetso bakeng sa sete ea taelo ea DL Boost.

Intel e senotse litšobotsi tsa li-processor tse nyalisitsoeng tsa 10nm Lakefield

Sistimi e thehiloeng Lakefield e ka ts'ehetsa segokanyimmediamentsi sa mohala sa Gigabit Wi-Fi 6 le modem ea LTE. Mabapi le li-interfaces, tšehetso ea PCI Express 3.0 le USB 3.1 e kengoa tšebetsong bakeng sa likou tsa Type-C. Li-SSD tse nang le li-interface tsa UFS le NVMe lia tšehetsoa.

Microsoft Surface Neo e nyametse lethathamong la lisebelisoa tse thehiloeng ho Intel Lakefield tse tlang selemong sena, empa Lenovo ThinkPad X1 Fold e ntse e lokela ho tsoela pele ho rekisoa pele selemo se fela, 'me Samsung Galaxy Book S e tla hlaha mebarakeng e khethiloeng. khoeli. Ebile, boemo bona bo ile ba lumella Intel ho hlophisa phatlalatso ea semmuso ea li-processor tsa Lakefield hajoale.



Source: 3dnews.ru

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