La 3 Tšitoe, joalo ka ha re se re ntse re le teng , Ketsahalo ea Snapdragon Tech Summit 2019 e qala: ho lebeletsoe hore ho lebeletsoe hore ho lebeletsoe ho phatlalatsoa ha mochine oa mohala oa mohala oa Qualcomm Snapdragon 865. Litšobotsi tsa chip ena li ne li le teng ka mehloli ea marang-rang.
Ho ea ka tlhahisoleseding e hatisitsoeng, sehlahisoa se sebetsang hantle se tla ba le li-cores tse robeli tsa k'homphieutha ka "1 + 3 + 4" tlhophiso. Ena ke Kryo core e le 'ngoe e thehiloeng ho ARM Cortex-A77 ka lebelo la oache ho fihla ho 2,84 GHz, li-cores tse ling tse tharo tse ts'oanang tse nang le maqhubu a ho fihla ho 2,42 GHz le li-Kryo cores tse' nè tse thehiloeng ho ARM Cortex-A55 ka lebelo la oache ho fihlela ho. 1,80 GHz.
Setsi sa litšoantšo se tla kenyelletsa accelerator e matla ea Adreno 650 e sebetsang ka lebelo ho fihla ho 587 MHz. Tšehetso ea LPDDR5 RAM le UFS 3.0 flash drives e boleloa.
Mabapi le ts'ebetso ka kakaretso, processor ea Snapdragon 865 e tla feta ea pele ho eona (Snapdragon 855) ka hoo e ka bang 20%. Keketseho ea ts'ebetso ea node ea litšoantšo e tla tloha ho 17% ho isa ho 20%.
Tlhahiso ea Snapdragon 865 e tla sebelisa theknoloji ea 7-nanometer. Chip e lebelletsoe ho ba teng ka mefuta e nang le modem ea 4G le 5G.
Sehlahisoa se secha e tla ba motheo oa li-smartphones tse tsoang ho baetsi ba bangata: lisebelisoa tse joalo li tla lokolloa selemong se tlang.
Source: 3dnews.ru