Memori ea 3D XPoint le li-drive tsa Intel Optane li ka ba theko e boima ho qala ka Pulungoana

Ka Phupu e fetileng, Intel le Micron ba phatlalalitse hore ba tla emisa nts'etsopele e kopaneng ea memori e sa fetoheng ea 3D XPoint. Sena se ne se bolela hore khoebo e kopanetsoeng ea balekane, IM Flash Technologies, le eona e tla ba le bophelo bo bolelele. Ka 'nete, ka October Intel e phatlalalitsehore Micron e ka nka monyetla ka tokelo ya topollo le ho fumana taolo e felletseng holim'a khoebo e kopanetsoeng le libaka tsohle tsa tlhahiso tseo e leng tsa eona. Kopo e tsamaellanang ea ho reka karolo ea Intel ke Micron e tlisitsoe January 15 selemong sena. Kamora sena, ho fetisetsoa ha thepa ea Intel ho IM Flash Technologies JV ho ile ha fuoa nako e seng ka tlase ho 6 le likhoeli tse 12.

How sisinya basebetsi-'moho le rona ba Toms Hardware, bekeng e fetileng Intel le Micron ba ile ba kenya kopo ho US Securities and Exchange Commission ho fetisetsa thepa. Filing e re khoebo e lebelletsoe ho koala ka la 31 Mphalane 2019. Micron e tla lefa pakeng tsa $ 1,3 le $ 1,5 bilione bakeng sa kabelo ea Intel khoebong e kopanetsoeng. Ketsahalo ena e lebelletsoe kotareng ea bobeli kapa ea boraro, kamora moo Intel le Micron ba tla qetella ba qhalane.

Litlamorao tse tobileng tsa liketsahalo tsena kaofela e tla ba 'nete e sa thabiseng joalo ka keketseho e ka bang teng ea theko ea li-drive tsa Intel Optane mohopolong oa 3D XPoint. Mohopolo ona hajoale o hlahisoa femeng e le 'ngoe e Utah e USA, eo ho tloha ka Mphalane 31 e tla ba ea Micron. Ho ea ka tumellano, moetsi o tla fana ka lichifi tsa 3D XPoint ho Intel bakeng sa selemo se seng, empa o tla eketsa theko ea thekiso ea li-chips ho ea boemong ba litheko tsa konteraka. Ho fihlela joale, Intel e se e fumane li-chips tsa 3D XPoint ('me e tla tsoelapele ho li fumana ho fihlela ka Pulungoana) ka litheko tse haufi le litšenyehelo tsa tlhahiso. Ho tseba leano la Intel, ha ho pelaelo hore e tla leka ho lefella tahlehelo ka ho eketsa theko ea thekiso ea lihlahisoa tsa Optane.

Intel e boetse e tobane le mosebetsi o mong - ho theha tlhahiso ea eona ea 3D XPoint chips. Bakeng sa sena, khampani e se e ntse e le teng nchafatsa e 'ngoe ea limela tsa eona tsa khale tsa Fab 11X Rio Rancho, New Mexico. Ho hlakile hore khoebo ena e tlameha ho qala tlhahiso ea 3D XPoint pele ho la 31 Mphalane 2020. Ka tsela, ho qalisoa ha mela e mecha ha se hangata ho se nang mathata 'me ho tsamaisana le boemo bo eketsehileng ba bokooa. Kahoo re tla tlameha ho ema le ho emela phokotso ea litšenyehelo tsa 3D XPoint le phokotso ea theko ea li-drive tsa Intel Optane.

Mohlomong Micron o tla etsa tsoelo-pele? O rera ho qala ho lokolla lihlahisoa tsa hae ho 2019D XPoint qetellong ea 3, na ha ho joalo? Mohlomong haeba Intel a sa mo qose ka qoso ho utsoa Theknoloji ea tlhahiso ea 3D XPoint.

Source: 3dnews.ru